HMIC
TM
Integrated Passive Diplexer
GSM/DCS or AMPS/PCS Applications
3 mm square MLP Plastic Package
V 1.00
MA4DP918-1277
Features
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3mm MLP Plastic Package
HMIC
TM
Integrated Passive Circuit
Low Insertion Loss, High Rejection Diplexer
Suface Mountable in Microwave Circuits, No
Wirebonds Required
Rugged HMIC
TM
Construction with Polyamide
Encapsulation
Reliable, Multilayer Metalization
No External 50
Ω
Matching Required
Low Cost Miniature Plastic MLP Package
Description
The MA4DP918-1277 HMIC
TM
Integrated Passive Diplexer is
fabricated with the patented Heterolithic Microwave Integrated
Circuit (HMIC) process. HMIC circuits consist of multilayer
conductors on a glass dielectric, which acts as the low dispersion,
low loss microstrip transmission medium. The glass allows HMIC
devices to have excellent Q characteristics in a low profile, reliable
device. Conductors are printed with state-of-the-art semiconductor
photolithography processes and encapsulated in rugged silicon
nitride and BCB polyamide. The circuit is composed of plated
inductors and metal-insulator-metal (MIM) capacitors employing a
silicon nitride dielectric layer. The high performance 3 mm MLP
package allows for surface mount placement with no additional
circuit matching required.
PIN Configuration
PIN
Function
GND
NC
RF 900
NC
NC
NC
NC
NC
Paddle
PIN
9
10
11
12
13
14
15
16
GND
Function
NC
RF 1800
NC
GND
NC
ANT
NC
NC
1
2
3
4
5
6
Applications
The MA4DP918-1277 HMIC
TM
Integrated Passive Diplexer is
recommended for use in wireless dual band GSM/DCS or
AMPS/PCS applications. The diplexer has low insertion loss in the
pass bands and high rejection in the stop bands. All ports are
matched to 50 ohms.
7
8
Absolute Maximum Ratings
1
@ TA = +25 °C
(Unless otherwise specified)
Parameter
Operating Temperature
Storage Temperature
RF C.W. Incident Power
Value
-65 °C to +125 °C
-65 °C to +150 °C
3 Watts C.W.
Ordering Information
Part Number
MA4DP918-1277
MA4DP918-1277T
Bulk
Tape and Reel
Package
1. Exceeding any of these values may result in permanent
damage
HMIC
TM
Integrated Passive Diplexer for GSM/DCS or AMPS/PCS Applications
MA4DP918-1277
V 1.00
Electrical Specifications @ 25 °C
ANT - RF 900 (AMPS / GSM)
Freq (MHz)
IL (dB) typ
Freq (MHz)
2H Rej (dB) typ
Freq (MHz)
3H Rej (dB) typ
825
0.55
1650
34
2475
15
880
0.63
1760
28
2640
15
960
0.88
1920
20
2880
16
Freq (MHz)
IL (dB) typ
Freq (MHz)
Rej (dB) typ
ANT - RF 1800 (PCS / DCS)
1710
0.75
825
35
1880
0.80
880
44
1990
0.91
960
33
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
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North America:
Tel. (800) 366-2266
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Asia/Pacific:
Tel.+81-44-844-8296, Fax +81-44-844-8298
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Europe:
Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
HMIC
TM
Integrated Passive Diplexer for GSM/DCS or AMPS/PCS Applications
MA4DP918-1277
V 1.00
Package Dimensions
3
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
n
North America:
Tel. (800) 366-2266
n
Asia/Pacific:
Tel.+81-44-844-8296, Fax +81-44-844-8298
n
Europe:
Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
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