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1N6312DUS

产品描述Zener Diode
产品类别分立半导体    二极管   
文件大小232KB,共6页
制造商Microsemi
官网地址https://www.microsemi.com
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1N6312DUS概述

Zener Diode

1N6312DUS规格参数

参数名称属性值
是否Rohs认证不符合
Reach Compliance Codecompli
ECCN代码EAR99
二极管类型ZENER DIODE
Base Number Matches1

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1N6309US thru 1N6355DUS
VOIDLESS HERMETICALLY SEALED
500mV GLASS ZENER DIODES
Qualified per MIL-PRF-19500/533
DESCRIPTION
This Zener voltage regulator series is military qualified and is ideal for high-reliability
applications where a failure cannot be tolerated. These industry-recognized 0.5 watt Zener
voltage regulators are hermetically sealed with voidless-glass construction using an internal
metallurgical bond. It includes Zener selections from 2.4 to 200 volts in standard 5%
tolerances as well as tighter 1% and 2% tolerances. They are also available in axial leaded
packages. Microsemi also offers numerous other Zener products to meet higher and lower
power ratings in both thru-hole and surface mount packages.
Important:
For the latest information, visit our website
http://www.microsemi.com.
Available on
commercial
versions
Qualified Levels:
JAN, JANTX, JANTXV
and JANS
B-SQ Melf Package
FEATURES
Surface mount equivalent of JEDEC registered 1N6309 thru 1N6355 series.
Voltage tolerances of 1%, 2% and 5% are available. (See
part nomenclature.)
Voidless hermetically sealed glass package.
Internal “Category
I”
metallurgical bonds for 1N6321US thru 1N6355US and “Category
III”
for
1N6309US thru 1N6320US.
JAN, JANTX, JANTXV, and JANS reliability levels are available per MIL-PRF-19500/533.
RoHS compliant versions available (commercial grade only).
Also available in:
DO-35 package
(axial-leaded)
1N6309 – 1N6355D
APPLICATIONS / BENEFITS
Small surface mount Melf (“D” Package).
Regulates voltage over a broad operating current and temperature range.
Extensive selection from 2.4 to 200 volts.
Standard and tight voltage tolerances available.
Extremely robust construction.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Inherently radiation hard as described in Microsemi “MicroNote
050”.
MAXIMUM RATINGS
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-End Cap
(1)
1N6309US – 1N6320US
1N6321US – 1N6355US
Thermal Resistance Junction-to-Ambient
(2)
Steady-State Power Dissipation @ T
EC
= 150
o
C
Forward Voltage @ 1.0 A
Solder Temperature @ 10 s
Symbol
T
J
and T
STG
R
ӨJEC
R
ӨJA
P
D
V
F
T
SP
Value
-65 to +175
35
21
240
0.5
1.4
260
Unit
o
C
o
C/W
C/W
W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
o
Notes:
1. See
Figure 1
and
Figure 2
for derating.
2. T
A
= +55 °C before derating on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1-layer 1-
Oz Cu, horizontal, still air, pads = .067 inch (1.70 mm) x .105 inch (2.67 mm); strip = .030 inch (0.76
mm) x 1 inch (25.4 mm) long, R
ΘJA
with a defined thermal resistance condition included is measured at
I
Z
= as defined in the characteristics and ratings table herein.
T4-LDS-0193-1, Rev. 1 (111899)
©2011 Microsemi Corporation
Page 1 of 6
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