NBB-300
CASCADABLE BROADBAND
GaAs MMIC AMPLIFIER DC TO 12GHz
RoHS Compliant & Pb-Free Product
Package Style: Micro-X, 4-Pin, Ceramic
Features
Reliable, Low-Cost HBT Design
12.0dB Gain, +13.8dBm
P1dB@2GHz
High P1dB of
+14.3dBm@6.0GHz and
+11.2dBm@14.0GHz
Single Power Supply Operation
50Ω I/O Matched for High Freq.
Use
RF IN 1
GND
4
MARKING - N3
3 RF OUT
Applications
Narrow and Broadband Commer-
cial and Military Radio Designs
Linear and Saturated Amplifiers
Gain Stage or Driver Amplifiers
for MWRadio/Optical Designs
(PTP/PMP/
LMDS/UNII/VSAT/WLAN/Cellu-
lar/DWDM)
2
GND
Functional Block Diagram
Product Description
The NBB-300 cascadable broadband InGaP/GaAs MMIC amplifier is a low-cost,
high-performance solution for general purpose RF and microwave amplification
needs. This 50Ω gain block is based on a reliable HBT proprietary MMIC design,
providing unsurpassed performance for small-signal applications. Designed with an
external bias resistor, the NBB-300 provides flexibility and stability. The NBB-300 is
packaged in a low-cost, surface-mount ceramic package, providing ease of assem-
bly for high-volume tape-and-reel requirements. It is available in either packaged or
chip (NBB-300-D) form, where its gold metallization is ideal for hybrid circuit
designs.surface-mount ceramic package, providing ease of assembly for high-vol-
ume tape-and-reel requirements. It is available in either packaged or chip (NBB-
300-D) form, where its gold metallization is ideal for hybrid circuit designs.
Package Drawing
45°
0.055
(1.40)
UNITS:
Inches
(mm)
N3
0.040
(1.02)
0.070
(1.78)
Ordering Information
NBB-300
NBB-300-T1
NBB-300-D
NBB-300-E
NBB-X-K1
Cascadable Broadband GaAs MMIC Amplifier DC to 12GHz
Tape & Reel, 1000 Pieces
NBB-300 Chip Form (100 pieces minimum order)
Fully Assembled Evaluation Board
Extended Frequency InGaP Amp Designer’s Tool Kit
0.020
0.200 sq.
(5.08)
0.005
(0.13)
Optimum Technology Matching® Applied
GaAs HBT
GaAs MESFET
InGaP HBT
SiGe BiCMOS
Si BiCMOS
SiGe HBT
GaAs pHEMT
Si CMOS
Si BJT
GaN HEMT
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
Rev A11 DS070328
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
1 of 12
NBB-300
Absolute Maximum Ratings
Parameter
RF Input Power
Power Dissipation
Device Current
Channel Temperature
Operating Temperature
Storage Temperature
Rating
+20
300
70
200
-45 to +85
-65 to +150
Unit
dBm
mW
mA
°C
°C
°C
The information in this publication is believed to be accurate and reliable. How-
ever, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use,
nor for any infringement of patents, or other rights of third parties, resulting
from its use. No license is granted by implication or otherwise under any patent
or patent rights of RFMD. RFMD reserves the right to change component cir-
cuitry, recommended application circuitry and specifications at any time without
prior notice.
RoHS status based on EUDirective2002/95/EC (at time of this document revi-
sion).
Caution! ESD sensitive device.
Exceeding any one or a combination of these limits may cause permanent
damage.
Parameter
Overall
Small Signal Power Gain, S21
Min.
12.0
11.0
9.0
Specification
Typ.
13.0
13.0
11.0
9.5
8.0
±0.6
2.4:1
2.0:1
2.5:1
Max.
Unit
dB
dB
dB
dB
dB
dB
Condition
V
D
=+3.9V, I
CC
=50mA, Z
0
=50Ω, T
A
=+25°C
f=0.1GHz to 1.0GHz
f=1.0GHz to 4.0GHz
f=4.0GHz to 6.0GHz
f=6.0GHz to 12.0GHz
f=12.0GHz to 14.0GHz
f=0.1GHz to 4.0GHz
f=0.1GHz to 4.0GHz
f=4.0GHz to 6.0GHz
f=6.0GHz to 12.0GHz
Gain Flatness, GF
Input and Output VSWR
Bandwidth, BW
Output Power @
-1dB Compression, P1dB
12.5
13.0
13.8
12.0
GHz
dBm
dBm
dBm
dB
dBm
dB
4.2
V
dB/°C
BW3 (3dB)
f=2.0GHz
f=6.0GHz
f=14.0GHz
f=3.0GHz
f=2.0GHz
f=0.1GHz to 12.0GHz
Noise Figure, NF
Third Order Intercept, IP3
Reverse Isolation, S12
Device Voltage, V
D
Gain Temperature Coefficient,
δG
T
/δT
3.6
5.1
+27.1
-15
3.9
-0.0015
MTTF versus Temperature
@ I
CC
=50mA
Case Temperature
Junction Temperature
MTTF
85
138
>1,000,000
272
°C
°C
hours
°C/W
Thermal Resistance
θ
JC
J
T
–
T
CASE
-------------------------- =
θ
JC
( °C ⁄
Watt
)
-
V
D
⋅
I
CC
2 of 12
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A11 DS070328
NBB-300
Pin
1
Function
RF IN
Description
RF input pin. This pin is NOT internally DC blocked. A DC blocking capacitor,
suitable for the frequency of operation, should be used in most applica-
tions. DC coupling of the input is not allowed, because this will override the
internal feedback loop and cause temperature instability.
Ground connection. For best performance, keep traces physically short
and connect immediately to ground plane.
RF output and bias pin. Biasing is accomplished with an external series
resistor and choke inductor to V
CC
. The resistor is selected to set the DC
current into this pin to a desired level. The resistor value is determined by
the following equation:
Interface Schematic
2
3
GND
RF OUT
RF OUT
(
V
CC
–
V
DEVICE
)
-
R
= ------------------------------------------
I
CC
Care should also be taken in the resistor selection to ensure that the cur-
rent into the part never exceeds maximum datasheet operating current
over the planned operating temperature. This means that a resistor
between the supply and this pin is always required, even if a supply near
5.0V is available, to provide DC feedback to prevent thermal runaway.
Because DC is present on this pin, a DC blocking capacitor, suitable for the
frequency of operation, should be used in most applications. The supply
side of the bias network should also be well bypassed.
RF IN
4
GND
Same as pin 2.
Typical Bias Configuration
Application notes related to biasing circuit, device footprint, and thermal considerations are available on request.
V
CC
R
CC
4
In
1
C block
2
3
L choke
(optional)
Out
C block
V
DEVICE
Recommended Bias Resistor Values
Supply Voltage, V
CC
(V)
Bias Resistor, R
CC
(Ω)
5
22
8
81
10
122
12
162
15
222
20
322
Rev A11 DS070328
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
3 of 12
NBB-300
Chip Outline Drawing - NBB-300-D
Chip Dimensions: 0.017” x 0.017” x 0.004”
UNITS:
Inches
(mm)
Back of chip is ground.
OUTPUT
INPUT
0.017 ± 0.001
(0.44 ± 0.03)
GND
VIA
0.017 ± 0.001
(0.44 ± 0.03)
0.004 ± 0.001
(0.10 ± 0.03)
Sales Criteria - Unpackaged Die
Die Sales Information
• All segmented die are sold 100% DC-tested. Testing parameters for wafer-level sales of die material shall be nego-
tiated on a case-by-case basis.
• Segmented die are selected for customer shipment in accordance with RFMD Document #6000152 - Die Product
Final Visual Inspection Criteria
1
.
• Segmented die has a minimum sales volume of 100 pieces per order. A maximum of 400 die per carrier is allow-
able.
Die Packaging
• All die are packaged in GelPak ESD protective containers with the following specification:
O.D.=2"X2", Capacity=400 Die (20X20 segments), Retention Level=High(X0).
• GelPak ESD protective containers are placed in a static shield bag. RFMD recommends that once the bag is
opened the GelPak/s should be stored in a controlled nitrogen environment. Do not press on the cover of a closed
GelPak, handle by the edges only. Do not vacuum seal bags containing GelPak containers.
• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit
2
.
Package Storage
• Unit packages should be kept in a dry nitrogen environment for optimal assembly, performance, and reliability.
• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit
2
.
Die Handling
• Proper ESD precautions must be taken when handling die material.
• Die should be handled using vacuum pick-up equipment, or handled along the long side with a sharp pair of twee-
zers. Do not touch die with any part of the body.
• When using automated pick-up and placement equipment, ensure that force impact is set correctly. Excessive force
may damage GaAs devices.
4 of 12
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
Rev A11 DS070328
NBB-300
Die Attach
• The die attach process mechanically attaches the die to the circuit substrate. In addition, the utilization of proper die
attach processes electrically connect the ground to the trace on which the chip is mounted. It also establishes the
thermal path by which heat can leave the chip.
• Die should be mounted to a clean, flat surface. Epoxy or eutectic die attach are both acceptable attachment meth-
ods. Top and bottom metallization are gold. Conductive silver-filled epoxies are recommended. This procedure
involves the use of epoxy to form a joint between the backside gold of the chip and the metallized area of the sub-
strate.
• All connections should be made on the topside of the die. It is essential to performance that the backside be well
grounded and that the length of topside interconnects be minimized.
• Some die utilize vias for effective grounding. Care must be exercised when mounting die to preclude excess run-out
on the topside.
Die Wire Bonding
• Electrical connections to the chip are made through wire bonds. Either wedge or ball bonding methods are accept-
able practices for wire bonding.
• All bond wires should be made as short as possible.
Notes
1
RFMD Document #6000152 - Die Product Final Visual Inspection Criteria. This document provides guidance for die inspec-
tion personnel to determine final visual acceptance of die product prior to shipping to customers.
takes precautions to ensure that die product is shipped in accordance with quality standards established to minimize
material shift. However, due to the physical size of die-level product, RFMD does not guarantee that material will not shift dur-
ing transit, especially under extreme handling circumstances. Product replacement due to material shift will be at the discre-
tion of RFMD.
2
RFMD
Rev A11 DS070328
7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical
support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.
5 of 12
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