Bus Driver, HCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, METAL SEALED, CERAMIC, DIP-20
| 参数名称 | 属性值 |
| 厂商名称 | Harris |
| 包装说明 | DIP, |
| Reach Compliance Code | unknown |
| 其他特性 | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY |
| 系列 | HCT |
| JESD-30 代码 | R-CDIP-T20 |
| JESD-609代码 | e4 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 传播延迟（tpd） | 35 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 总剂量 | 100k Rad(Si) V |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962R9574801VRC | 5962R9574801VRX | 5962R9574801VXC | 5962R9574801VXX | HCTS374DMSH | HCTS374KMSH | |
|---|---|---|---|---|---|---|
| 描述 | Bus Driver, HCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, METAL SEALED, CERAMIC, DIP-20 | Bus Driver, HCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, METAL SEALED, CERAMIC, DIP-20 | Bus Driver, HCT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, METAL SEALED, CERAMIC, DFP-20 | Bus Driver, HCT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, METAL SEALED, CERAMIC, DFP-20 | Bus Driver, HCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP20, METAL SEALED, CERAMIC, DIP-20 | Bus Driver, HCT Series, 1-Func, 8-Bit, True Output, CMOS, CDFP20, METAL SEALED, CERAMIC, DFP-20 |
| 包装说明 | DIP, | DIP, | DFP, | DFP, | DIP, DIP20,.3 | DFP, FL20,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY | RADIATION HARD CMOS/SILICON ON SAPPHIRE (SOS) TECHONOLOGY |
| 系列 | HCT | HCT | HCT | HCT | HCT | HCT |
| JESD-30 代码 | R-CDIP-T20 | R-CDIP-T20 | R-CDFP-F20 | R-CDFP-F20 | R-CDIP-T20 | R-CDFP-F20 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | DFP | DFP | DIP | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | FLATPACK | FLATPACK | IN-LINE | FLATPACK |
| 传播延迟（tpd） | 35 ns | 35 ns | 35 ns | 35 ns | 44 ns | 44 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.92 mm | 2.92 mm | 5.08 mm | 2.92 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | FLAT |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | 1M Rad(Si) V | 1M Rad(Si) V |
| 宽度 | 7.62 mm | 7.62 mm | 6.92 mm | 6.92 mm | 7.62 mm | 6.92 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | e4 | - | e4 | - | e0 | e0 |
| 负载电容（CL） | 50 pF | - | 50 pF | - | 50 pF | 50 pF |
| 端子面层 | GOLD | - | GOLD | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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