Flip-Top™
Ball Grid Array Sockets
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
How It Works
SMT models are shipped un-assembled to ease solderability.
Thru-hole models are shipped fully assembled.
1. Lower assembly is soldered to PC board with no
external hold-down mechanism. Thru-hole models
may be soldered to PC board or plugged into a
mating socket.
2. Upper assembly inserts easily to lower assembly
by aligning guide posts and installing four (sup-
plied) screws.
3. Finned heat sink or coin screw is screwed down to
flush position.
Support Plate
Not Shown
4. Lid opens easily by pressing latch.
5. BGA device is inserted by aligning A1 position with
chamfered corner of Flip-Top™ socket. Place
support plate on top of device, close lid, engage
heat sink or coin screw, and socket is ready for use.
Detailed Installation and General Usage
Instructions are provided with product.
Flip-Top™ Features
• Designed to save space on new and
existing PC boards in test, develop-
ment, programming and production
applications.
• No external hold-downs or soldering
of BGA device required.
• AIC exclusive eutectic solder ball
terminals offer superior processing.
• Uses same footprint as BGA device.
• Compact design maximizes PCB real
estate – only 3mm wider and 10mm
longer than BGA device package.
• Available with integral, finned heat
sink or coin screw clamp assembly.
• Currently available in 1.27mm pitch.
• Consult factory for additional terminal
styles and heat sink options, as well
as custom designs.
1.27mm Pitch Terminal Options
Standard Terminals
for Test, Development and Production Applications
Terminals for LGA or
De-balled BGA Device Applications
Type -690
Surface Mount
Type -708
Thru-Hole
.183
(4.65)
Type -712
.193
(4.90)
Type -713
.183
(4.65)
.193
(4.90)
.030 Dia.
(0.76)
.018 Dia.
(0.46)
.125
(3.18)
.018 Dia.
(0.46)
.125
(3.18)
.030 Dia.
(0.76)
Terminals for BGA Device Test Applications
(Consult Factory for Availability)
Type -657
.183
(4.65)
Type -659
Type -709
.183
(4.65)
Specifications
Terminals:
Brass; Copper Alloy
(C36000)
Terminal Support:
Polyimide Film
Contacts:
Beryllium Copper (C17200)
Plating:
G – Gold over Nickel
Spring Material:
Stainless Steel
Heat Sink/Coin Screw and Support Plate
Material:
Aluminum
Insulator, Lid and Latch Material:
.018 Dia.
(0.46)
.125
(3.18)
.030 Dia.
(0.76)
.183
(4.65)
.016 Dia.
(0.41)
.125
(3.18)
How To Order
X
Footprint Dash #
If Applicable*
Flip-Top™
BGA Socket
Pitch
G = .050/(1.27mm) pitch
Number of Positions
*See BGA Footprint Booklet
or web site
Terminal Type
See options above
FT G XXXX - 690 G G XX
Clamp Options
HS - Heat Sink (3 Fins Std.)
CS - Coin Screw
Contact Plating
G - Gold
Terminal Plating
G - Gold
Molded PPS (High Temp. Glass Filled
Thermoplastic), U.L. Rated 94V-O,
-60°C to 260°C (-76°F to 500°F)
Solder Ball:
Eutectic, 63Sn/37Pb,183°C (361°F)
FT-TECH02
REV. 3/02
Mechanical specifications for BGA device package required for quoting/ordering.
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown:
inch/(mm).
BGA Device Dimension
and I/O Requirements
5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: info@advintcorp.com Internet: www.advintcorp.com
Advanced Interconnections has complete design and manufacturing capabilities for your BGA Socket needs.
By answering the following questions we can design a socket to meet your requirements.
Copy this page and fill in the information needed.
Fax to Customer Service at 401-823-8723.
Contact Name: _____________________________ Date: _______
Company Name: __________________________________________
Address: ________________________________________________
City: ________________________
Postal/Zip Code: ______________
Phone ______________________
State: _____________________
Country: ___________________
Fax: ______________________
D B
BGA Device – Top View
E-mail: __________________________________________________
Fill in ball location* or attach complete device mech. specifications:
*All sockets (footprints) viewed top down – looking toward seating plane
of PCB and into female side of socket.
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AB AD AF AH AK AM AP
AA AC AE AG AJ AL AN AR
C
A
BGA Device – Side View
A&B
C&D
H
P
F
E
BGA DEVICE DIMENSIONS
Dim.
inches
mm
Tol.
A
B
C
D
E
F
H
P
Specification Requirements:
Device Manufacturer: ___________________
BGA Device Model No.: _________________
Application: ___________________________
Number of Balls: _______________________
Grid Pattern (rows across X down): ________
Pitch (specify inches or mm): _____________
BGA DEVICE
Complete the required dimension table
and attach BGA mechanical specifica-
tions including footprint.
© 2002, Advanced Interconnections Corp., West Warwick RI USA.
FT-TECH02
REV. 3/02
Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Dimensions shown:
inch/(mm).
NXP MCU
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