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89HPES6T5ZBBCGI

产品描述CABGA-196, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小439KB,共29页
制造商IDT (Integrated Device Technology)
标准
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89HPES6T5ZBBCGI概述

CABGA-196, Tray

89HPES6T5ZBBCGI规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码CABGA
包装说明CABGA-196
针数196
制造商包装代码BCG196
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys DescriptionCHIP ARRAY BGA 15.0 X 15.0 X 1.0 MM PIT
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B196
JESD-609代码e1
长度15 mm
湿度敏感等级3
端子数量196
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA196,14X14,40
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)260
电源1,3.3 V
认证状态Not Qualified
座面最大高度1.5 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度15 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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6-Lane 5-Port
PCI Express® Switch
®
89HPES6T5
Data Sheet
The 89HPES6T5 is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES6T5 is an 6-lane, 5-port peripheral
chip that performs PCI Express Base switching. It provides connectivity
and switching functions between a PCI Express upstream port and up to
four downstream ports and supports switching between downstream
ports.
Device Overview
u
u
Features
u
u
u
High Performance PCI Express Switch
– Six 2.5Gbps PCI Express lanes
– Five switch ports
– Upstream port is x2
– Downstream ports are x1
– Low-latency cut-through switch architecture
– Support for Max Payload Sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
u
u
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates six 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Support PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to read and write any internal register via the SMBus
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
5-Port Switch Core / 6 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
(Port 4)
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 28
June 18, 2014

89HPES6T5ZBBCGI相似产品对比

89HPES6T5ZBBCGI WBC-T0303AS-06-2840-BD 89HPES6T5ZBBCG 89HPES6T5ZBBCI8
描述 CABGA-196, Tray Array/Network Resistor, Center Tap, Thin Film, 0.25W, 284ohm, 100V, 0.1% +/-Tol, -50,50ppm/Cel, 0303, CABGA-196, Tray CABGA-196, Reel
是否Rohs认证 符合 符合 符合 不符合
Reach Compliance Code compliant compliant compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
端子数量 196 6 196 196
最高工作温度 85 °C 150 °C 70 °C 85 °C
最低工作温度 -40 °C -55 °C - -40 °C
封装形式 GRID ARRAY, LOW PROFILE SMT GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
技术 CMOS THIN FILM CMOS CMOS
Brand Name Integrated Device Technology - Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 - 不含铅 含铅
厂商名称 IDT (Integrated Device Technology) - IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 CABGA - CABGA CABGA
包装说明 CABGA-196 - LBGA, BGA196,14X14,40 LBGA,
针数 196 - 196 196
制造商包装代码 BCG196 - BCG196 BC196
总线兼容性 PCI - PCI PCI; SMBUS
最大时钟频率 125 MHz - 125 MHz 125 MHz
JESD-30 代码 S-PBGA-B196 - S-PBGA-B196 S-PBGA-B196
JESD-609代码 e1 - e1 e0
长度 15 mm - 15 mm 15 mm
湿度敏感等级 3 - 3 3
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA - LBGA LBGA
封装形状 SQUARE - SQUARE SQUARE
峰值回流温度(摄氏度) 260 - 260 225
座面最大高度 1.5 mm - 1.5 mm 1.5 mm
最大供电电压 1.1 V - 1.1 V 1.1 V
最小供电电压 0.9 V - 0.9 V 0.9 V
标称供电电压 1 V - 1 V 1 V
表面贴装 YES - YES YES
温度等级 INDUSTRIAL - COMMERCIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) - Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
端子形式 BALL - BALL BALL
端子节距 1 mm - 1 mm 1 mm
端子位置 BOTTOM - BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 - 30 NOT SPECIFIED
宽度 15 mm - 15 mm 15 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI - BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 - 1 1
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