FIFO, 64X36, 12ns, Synchronous, CMOS, PQFP120, TQFP-120
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFP |
包装说明 | LFQFP, |
针数 | 120 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最长访问时间 | 12 ns |
周期时间 | 20 ns |
JESD-30 代码 | S-PQFP-G120 |
JESD-609代码 | e0 |
长度 | 14 mm |
内存密度 | 2304 bit |
内存宽度 | 36 |
湿度敏感等级 | 4 |
功能数量 | 1 |
端子数量 | 120 |
字数 | 64 words |
字数代码 | 64 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 64X36 |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 240 |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | GULL WING |
端子节距 | 0.4 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 14 mm |
Base Number Matches | 1 |
IDT723613L20PFI9 | IDT723613L20PFG8 | IDT723613L20PF9 | IDT723613L15PFG8 | IDT723613L15PQF9 | IDT723613L20PQFI9 | IDT723613L15PF9 | IDT723613L20PQF9 | IDT723613L20PFGI8 | |
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描述 | FIFO, 64X36, 12ns, Synchronous, CMOS, PQFP120, TQFP-120 | FIFO, 64X36, 12ns, Synchronous, CMOS, PQFP120, TQFP-120 | FIFO, 64X36, 12ns, Synchronous, CMOS, PQFP120, TQFP-120 | FIFO, 64X36, 10ns, Synchronous, CMOS, PQFP120, TQFP-120 | FIFO, 64X36, 10ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 | FIFO, 64X36, 12ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 | FIFO, 64X36, 10ns, Synchronous, CMOS, PQFP120, TQFP-120 | FIFO, 64X36, 12ns, Synchronous, CMOS, PQFP132, PLASTIC, QFP-132 | FIFO, 64X36, 12ns, Synchronous, CMOS, PQFP120, TQFP-120 |
是否无铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | LFQFP, | LFQFP, | LFQFP, | LFQFP, | BQFP, | BQFP, | LFQFP, | BQFP, | LFQFP, |
针数 | 120 | 120 | 120 | 120 | 132 | 132 | 120 | 132 | 120 |
Reach Compliance Code | not_compliant | compliant | not_compliant | compliant | compliant | compliant | not_compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 12 ns | 12 ns | 12 ns | 10 ns | 10 ns | 12 ns | 10 ns | 12 ns | 12 ns |
周期时间 | 20 ns | 20 ns | 20 ns | 15 ns | 15 ns | 20 ns | 15 ns | 20 ns | 20 ns |
JESD-30 代码 | S-PQFP-G120 | S-PQFP-G120 | S-PQFP-G120 | S-PQFP-G120 | S-PQFP-G132 | S-PQFP-G132 | S-PQFP-G120 | S-PQFP-G132 | S-PQFP-G120 |
JESD-609代码 | e0 | e3 | e0 | e3 | e0 | e0 | e0 | e0 | e3 |
长度 | 14 mm | 14 mm | 14 mm | 14 mm | 24.13 mm | 24.13 mm | 14 mm | 24.13 mm | 14 mm |
内存密度 | 2304 bit | 2304 bit | 2304 bit | 2304 bit | 2304 bit | 2304 bit | 2304 bit | 2304 bit | 2304 bit |
内存宽度 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 | 36 |
湿度敏感等级 | 4 | 3 | 4 | 3 | 3 | 3 | 4 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 120 | 120 | 120 | 120 | 132 | 132 | 120 | 132 | 120 |
字数 | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
字数代码 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C |
组织 | 64X36 | 64X36 | 64X36 | 64X36 | 64X36 | 64X36 | 64X36 | 64X36 | 64X36 |
可输出 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFQFP | LFQFP | LFQFP | LFQFP | BQFP | BQFP | LFQFP | BQFP | LFQFP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, BUMPER | FLATPACK, BUMPER | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, BUMPER | FLATPACK, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 240 | 260 | 240 | 260 | 225 | 225 | 240 | 225 | 260 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 4.57 mm | 4.57 mm | 1.6 mm | 4.57 mm | 1.6 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) - annealed | Tin/Lead (Sn85Pb15) | Matte Tin (Sn) - annealed | TIN LEAD | TIN LEAD | Tin/Lead (Sn85Pb15) | TIN LEAD | Matte Tin (Sn) - annealed |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.4 mm | 0.4 mm | 0.4 mm | 0.4 mm | 0.635 mm | 0.635 mm | 0.4 mm | 0.635 mm | 0.4 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 20 | 30 | 20 | 30 | 20 | 20 | 20 | 20 | 30 |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 24.13 mm | 24.13 mm | 14 mm | 24.13 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
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