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IDT72T3645L4-4BBG

产品描述FIFO, 1KX36, 3.4ns, Synchronous, CMOS, PBGA208, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-208
产品类别存储    存储   
文件大小461KB,共57页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

IDT72T3645L4-4BBG概述

FIFO, 1KX36, 3.4ns, Synchronous, CMOS, PBGA208, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-208

IDT72T3645L4-4BBG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-208
针数208
Reach Compliance Codeunknown
ECCN代码EAR99
最长访问时间3.4 ns
其他特性ASYNCHRONOUS OPERATION ALSO POSSIBLE
最大时钟频率 (fCLK)225 MHz
周期时间4.4 ns
JESD-30 代码S-PBGA-B208
JESD-609代码e1
长度17 mm
内存密度36864 bit
内存集成电路类型OTHER FIFO
内存宽度36
湿度敏感等级3
功能数量1
端子数量208
字数1024 words
字数代码1000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织1KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA208,16X16,40
封装形状SQUARE
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源1.5/2.5,2.5 V
认证状态Not Qualified
座面最大高度1.97 mm
最大待机电流0.01 A
最大压摆率0.07 mA
最大供电电压 (Vsup)2.625 V
最小供电电压 (Vsup)2.375 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度17 mm
Base Number Matches1

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2.5 VOLT HIGH-SPEED TeraSync
TM
FIFO 36-BIT CONFIGURATIONS
1,024 x 36, 2,048 x 36, 4,096 x 36,
8,192 x 36, 16,384 x 36, 32,768 x 36,
65,536 x 36, 131,072 x 36 and 262,144 x 36
IDT72T3645, IDT72T3655, IDT72T3665,
IDT72T3675, IDT72T3685, IDT72T3695,
IDT72T36105, IDT72T36115, IDT72T36125
FEATURES:
Choose among the following memory organizations:
IDT72T3645
1,024 x 36
IDT72T3655
2,048 x 36
IDT72T3665
4,096 x 36
IDT72T3675
8,192 x 36
IDT72T3685
16,384 x 36
IDT72T3695
32,768 x 36
IDT72T36105
65,536 x 36
IDT72T36115
131,072 x 36
IDT72T36125
262,144 x 36
Up to 225 MHz Operation of Clocks
User selectable HSTL/LVTTL Input and/or Output
2.5V LVTTL or 1.8V, 1.5V HSTL Port Selectable Input/Ouput voltage
3.3V Input tolerant
Read Enable & Read Clock Echo outputs aid high speed operation
User selectable Asynchronous read and/or write port timing
Mark & Retransmit, resets read pointer to user marked position
Write Chip Select (WCS) input enables/disables Write operations
Read Chip Select (RCS) synchronous to RCLK
Programmable Almost-Empty and Almost-Full flags, each flag can
default to one of eight preselected offsets
Program programmable flags by either serial or parallel means
Selectable synchronous/asynchronous timing modes for Almost-
Empty and Almost-Full flags
Separate SCLK input for Serial programming of flag offsets
User selectable input and output port bus-sizing
- x36 in to x36 out
- x36 in to x18 out
- x36 in to x9 out
- x18 in to x36 out
- x9 in to x36 out
Big-Endian/Little-Endian user selectable byte representation
Auto power down minimizes standby power consumption
Master Reset clears entire FIFO
Partial Reset clears data, but retains programmable settings
Empty, Full and Half-Full flags signal FIFO status
Select IDT Standard timing (using
EF
and
FF
flags) or First Word
Fall Through timing (using
OR
and
IR
flags)
Output enable puts data outputs into high impedance state
JTAG port, provided for Boundary Scan function
Available in 208-pin (17mm x 17mm) or 240-pin (19mm x 19mm)
Plastic Ball Grid Array (PBGA)
Easily expandable in depth and width
Independent Read and Write Clocks (permit reading and writing
simultaneously)
High-performance submicron CMOS technology
Industrial temperature range (–40°C to +85°C) is available
°
°
Green parts are available, see ordering information
FUNCTIONAL BLOCK DIAGRAM
WEN
WCLK/WR
WCS
D
0
-D
n
(x36, x18 or x9)
LD
SEN
SCLK
INPUT REGISTER
OFFSET REGISTER
FF/IR
PAF
EF/OR
PAE
HF
FWFT/SI
PFM
FSEL0
FSEL1
ASYW
WRITE CONTROL
LOGIC
RAM ARRAY
1,024 x 36, 2,048 x 36
4,096 x 36, 8,192 x 36
16,384 x 36, 32,768 x 36
65,536 x 36, 131,072 x36
262,144 x 36
FLAG
LOGIC
WRITE POINTER
BE
IP
BM
IW
OW
MRS
PRS
TCK
TRST
TMS
TDO
TDI
Vref
WHSTL
RHSTL
SHSTL
CONTROL
LOGIC
BUS
CONFIGURATION
RESET
LOGIC
READ POINTER
OUTPUT REGISTER
READ
CONTROL
LOGIC
RT
MARK
ASYR
JTAG CONTROL
(BOUNDARY SCAN)
RCLK/RD
REN
RCS
HSTL I/0
CONTROL
OE
EREN
5907 drw01
Q
0
-Q
n
(x36, x18 or x9)
ERCLK
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The TeraSync FIFO is a trademark of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGES
1
©
2009 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
FEBRUARY 2009
DSC-5907/20

IDT72T3645L4-4BBG相似产品对比

IDT72T3645L4-4BBG IDT72T36115L4-4BBG IDT72T36125L4-4BBG IDT72T36125L5BBG IDT72T36125L5BBGI IDT72T3665L4-4BBG
描述 FIFO, 1KX36, 3.4ns, Synchronous, CMOS, PBGA208, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-208 FIFO, 128KX36, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 FIFO, 256KX36, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 FIFO, 256KX36, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 FIFO, 256KX36, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 FIFO, 4KX36, 3.4ns, Synchronous, CMOS, PBGA208, 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-208
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合
零件包装代码 BGA BGA BGA BGA BGA BGA
包装说明 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-208 19 X 19 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-240 BGA, BGA240,18X18,40 BGA, BGA240,18X18,40 BGA, BGA240,18X18,40 17 X 17 MM, 1 MM PITCH, GREEN, PLASTIC, BGA-208
针数 208 240 240 240 240 208
Reach Compliance Code unknown compli compli compliant compliant unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 3.4 ns 3.4 ns 3.4 ns 3.6 ns 3.6 ns 3.4 ns
其他特性 ASYNCHRONOUS OPERATION ALSO POSSIBLE ASYNCHRONOUS OPERATION ALSO POSSIBLE ASYNCHRONOUS OPERATION ALSO POSSIBLE ASYNCHRONOUS OPERATION ALSO POSSIBLE ASYNCHRONOUS OPERATION ALSO POSSIBLE ASYNCHRONOUS OPERATION ALSO POSSIBLE
最大时钟频率 (fCLK) 225 MHz 225 MHz 225 MHz 200 MHz 200 MHz 225 MHz
周期时间 4.4 ns 4.4 ns 4.4 ns 5 ns 5 ns 4.4 ns
JESD-30 代码 S-PBGA-B208 S-PBGA-B240 S-PBGA-B240 S-PBGA-B240 S-PBGA-B240 S-PBGA-B208
JESD-609代码 e1 e1 e1 e1 e1 e1
长度 17 mm 19 mm 19 mm 19 mm 19 mm 17 mm
内存密度 36864 bit 4718592 bi 9437184 bi 9437184 bit 9437184 bit 147456 bit
内存集成电路类型 OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO OTHER FIFO
内存宽度 36 36 36 36 36 36
湿度敏感等级 3 3 3 3 3 3
功能数量 1 1 1 1 1 1
端子数量 208 240 240 240 240 208
字数 1024 words 131072 words 262144 words 262144 words 262144 words 4096 words
字数代码 1000 128000 256000 256000 256000 4000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 85 °C 70 °C
组织 1KX36 128KX36 256KX36 256KX36 256KX36 4KX36
可输出 YES YES YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA
封装等效代码 BGA208,16X16,40 BGA240,18X18,40 BGA240,18X18,40 BGA240,18X18,40 BGA240,18X18,40 BGA208,16X16,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260 260 260
电源 1.5/2.5,2.5 V 1.5/2.5,2.5 V 1.5/2.5,2.5 V 1.5/2.5,2.5 V 1.5/2.5,2.5 V 1.5/2.5,2.5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.97 mm 1.97 mm 1.97 mm 1.97 mm 1.97 mm 1.97 mm
最大待机电流 0.01 A 0.02 A 0.02 A 0.02 A 0.02 A 0.01 A
最大压摆率 0.07 mA 0.09 mA 0.09 mA 0.09 mA 0.09 mA 0.07 mA
最大供电电压 (Vsup) 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V 2.625 V
最小供电电压 (Vsup) 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V 2.375 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER TIN SILVER COPPER
端子形式 BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 17 mm 19 mm 19 mm 19 mm 19 mm 17 mm
Base Number Matches 1 1 1 1 1 1
厂商名称 IDT (Integrated Device Technology) - - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
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