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7133LA55PFI

产品描述Dual-Port SRAM, 2KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
产品类别存储    存储   
文件大小309KB,共17页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

7133LA55PFI概述

Dual-Port SRAM, 2KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100

7133LA55PFI规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
针数100
Reach Compliance Codenot_compliant
ECCN代码EAR99
最长访问时间55 ns
I/O 类型COMMON
JESD-30 代码S-PQFP-G100
JESD-609代码e0
长度14 mm
内存密度32768 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度16
湿度敏感等级3
功能数量1
端口数量2
端子数量100
字数2048 words
字数代码2000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织2KX16
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装等效代码QFP100,.63SQ,20
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)240
电源5 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.004 A
最小待机电流2 V
最大压摆率0.285 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn85Pb15)
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm
Base Number Matches1

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HIGH SPEED
2K X 16 DUAL-PORT
SRAM
Features
IDT7133SA/LA
IDT7143SA/LA
High-speed access
– Military: 35/55/70/90ns (max.)
– Industrial: 25/55ns (max.)
– Commercial: 20/25/35/45/55/70/90ns (max.)
Low-power operation
– IDT7133/43SA
Active: 1150mW (typ.)
Standby: 5mW (typ.)
– IDT7133/43LA
Active: 1050mW (typ.)
Standby: 1mW (typ.)
Versatile control for write: separate write control for lower
and upper byte of each port
MASTER IDT7133 easily expands data bus width to 32 bits
or more using SLAVE IDT7143
On-chip port arbitration logic (IDT7133 only)
BUSY
output flag on IDT7133;
BUSY
input on IDT7143
Fully asynchronous operation from either port
Battery backup operation–2V data retention
TTL-compatible; single 5V (±10%) power supply
Available in 68-pin ceramic PGA, Flatpack, PLCC and 100-
pin TQFP
Military product compliant to MIL-PRF-38535 QML
Industrial temperature range (–40°C to +85°C) is available
for selected speeds
Green parts available, see ordering information
Functional Block Diagram
R/W
LUB
CE
L
R/W
RUB
CE
R
R/W
LLB
OE
L
R/W
RLB
OE
R
I/O
8L
- I/O
15L
I/O
0L
- I/O
7L
BUSY
L
(1)
A
10L
A
0L
ADDRESS
DECODER
11
I/O
CONTROL
I/O
CONTROL
I/O
8R
- I/O
15R
I/O
0R
- I/O
7R
BUSY
R
(1)
MEMORY
ARRAY
ADDRESS
DECODER
11
A
10R
A
0R
CE
L
ARBITRATION
LOGIC
(IDT7133 ONLY)
CE
R
2746 drw 01
NOTE:
1. IDT7133 (MASTER):
BUSY
is open drain output and requires pull-up resistor.
IDT7143 (SLAVE):
BUSY
is input.
JANUARY 2012
1
©2013 Integrated Device Technology, Inc.
DSC 2746/14

7133LA55PFI相似产品对比

7133LA55PFI 7133SA55PFI 7133SA25PFI 7143SA25JI 7133LA35PFI 7133SA35JI 7133SA25JI 7133LA35JI 7133LA55JI
描述 Dual-Port SRAM, 2KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 2KX16, 55ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 2KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 2KX16, 25ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 Dual-Port SRAM, 2KX16, 35ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 Dual-Port SRAM, 2KX16, 35ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 Dual-Port SRAM, 2KX16, 25ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 Dual-Port SRAM, 2KX16, 35ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 Dual-Port SRAM, 2KX16, 55ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP LCC QFP LCC LCC LCC LCC
包装说明 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 QCCJ, LDCC68,1.0SQ 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68
针数 100 100 100 68 100 68 68 68 68
Reach Compliance Code not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最长访问时间 55 ns 55 ns 25 ns - 35 ns 35 ns 25 ns 35 ns 55 ns
I/O 类型 COMMON COMMON COMMON - COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 S-PQFP-G100 S-PQFP-G100 S-PQFP-G100 - S-PQFP-G100 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68 S-PQCC-J68
JESD-609代码 e0 e0 e0 - e0 e0 e0 e0 e0
长度 14 mm 14 mm 14 mm - 14 mm 24.2062 mm 24.2062 mm 24.2062 mm 24.2062 mm
内存密度 32768 bit 32768 bit 32768 bit - 32768 bit 32768 bit 32768 bit 32768 bit 32768 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM - DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 16 16 16 - 16 16 16 16 16
湿度敏感等级 3 3 3 - 3 1 3 1 1
功能数量 1 1 1 - 1 1 1 1 1
端口数量 2 2 2 - 2 2 2 2 2
端子数量 100 100 100 - 100 68 68 68 68
字数 2048 words 2048 words 2048 words - 2048 words 2048 words 2048 words 2048 words 2048 words
字数代码 2000 2000 2000 - 2000 2000 2000 2000 2000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C - 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C - -40 °C -40 °C -40 °C -40 °C -40 °C
组织 2KX16 2KX16 2KX16 - 2KX16 2KX16 2KX16 2KX16 2KX16
输出特性 3-STATE 3-STATE 3-STATE - 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP - LFQFP QCCJ QCCJ QCCJ QCCJ
封装等效代码 QFP100,.63SQ,20 QFP100,.63SQ,20 QFP100,.63SQ,20 - QFP100,.63SQ,20 LDCC68,1.0SQ LDCC68,1.0SQ LDCC68,1.0SQ LDCC68,1.0SQ
封装形状 SQUARE SQUARE SQUARE - SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH - FLATPACK, LOW PROFILE, FINE PITCH CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER
并行/串行 PARALLEL PARALLEL PARALLEL - PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 240 240 240 - 240 225 225 225 225
电源 5 V 5 V 5 V - 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm - 1.6 mm 4.572 mm 4.572 mm 4.572 mm 4.572 mm
最大待机电流 0.004 A 0.004 A 0.004 A - 0.004 A 0.004 A 0.004 A 0.004 A 0.004 A
最小待机电流 2 V 2 V 2 V - 2 V 2 V 2 V 2 V 2 V
最大压摆率 0.285 mA 0.315 mA 0.33 mA - 0.295 mA 0.325 mA 0.33 mA 0.295 mA 0.285 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V - 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V - 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V - 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES - YES YES YES YES YES
技术 CMOS CMOS CMOS - CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) - Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15) Tin/Lead (Sn85Pb15)
端子形式 GULL WING GULL WING GULL WING - GULL WING J BEND J BEND J BEND J BEND
端子节距 0.5 mm 0.5 mm 0.5 mm - 0.5 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 QUAD QUAD QUAD - QUAD QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 20 20 20 - 20 30 30 30 30
宽度 14 mm 14 mm 14 mm - 14 mm 24.2062 mm 24.2062 mm 24.2062 mm 24.2062 mm
Base Number Matches 1 1 1 1 1 1 1 - -

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