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IDT72V3693L15PFG8

产品描述FIFO, 32KX36, 10ns, Synchronous, CMOS, PQFP128, TQFP-128
产品类别存储    存储   
文件大小336KB,共30页
制造商IDT (Integrated Device Technology)
标准
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IDT72V3693L15PFG8概述

FIFO, 32KX36, 10ns, Synchronous, CMOS, PQFP128, TQFP-128

IDT72V3693L15PFG8规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明LFQFP,
针数128
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间10 ns
其他特性MAILBOX
周期时间15 ns
JESD-30 代码R-PQFP-G128
JESD-609代码e3
长度20 mm
内存密度1179648 bit
内存宽度36
湿度敏感等级3
功能数量1
端子数量128
字数32768 words
字数代码32000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织32KX36
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.45 V
最小供电电压 (Vsup)3.15 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm
Base Number Matches1

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3.3 VOLT CMOS SyncFIFO
TM
WITH BUS-MATCHING
16,384 x 36
32,768 x 36
65,536 x 36
IDT72V3683
IDT72V3693
IDT72V36103
FEATURES
Memory storage capacity:
IDT72V3683 – 16,384 x 36
IDT72V3693 – 32,768 x 36
IDT72V36103 – 65,536 x 36
Clock frequencies up to 100 MHz (6.5 ns access time)
Clocked FIFO buffering data from Port A to Port B
IDT Standard timing (using
EF
and
FF)
or First Word Fall
Through Timing (using OR and IR flag functions)
Programmable Almost-Empty and Almost-Full flags; each has
five default offsets (8, 16, 64, 256 and 1,024)
Serial or parallel programming of partial flags
Port B bus sizing of 36 bits (long word), 18 bits (word) and 9 bits
(byte)
Big- or Little-Endian format for word and byte bus sizes
Retransmit Capability
Reset clears data and configures FIFO, Partial Reset clears data
but retains configuration settings
Mailbox bypass registers for each FIFO
Free-running CLKA and CLKB may be asynchronous or
coincident (simultaneous reading and writing of data on a single
clock edge is permitted)
Easily expandable in width and depth
Auto power down minimizes power dissipation
Available in a space-saving 128-pin Thin Quad Flatpack (TQFP)
Pin compatible with the lower density parts, IDT72V3623/
72V3633/72V3643/72V3653/72V3663/72V3673
°
°
Industrial temperature range (–40°C to +85°C) is available
FUNCTIONAL BLOCK DIAGRAM
MBF1
Mail 1
Register
Port-A
Control
Logic
CLKA
CSA
W/RA
ENA
MBA
RS1
RS2
PRS
Bus-
Matching
Input
Register
Output
Register
FIFO1
Mail1,
Mail2,
Reset
Logic
36
36
RAM ARRAY
36
16,384 x 36
32,768 x 36
65,536 x 36
36
RT
RTM
FIFO
Retransmit
Logic
Write
Pointer
Read
Pointer
B
0
-B
35
A
0
-A
35
FF/IR
AF
Status Flag
Logic
EF/OR
AE
36
36
FS2
FS0/SD
FS1/SEN
Programmable Flag
Offset Registers
16
Timing
Mode
Port-B
Control
Logic
Mail 2
Register
MBF2
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The SyncFIFO is a trademark of Integrated Device Technology, Inc.
FWFT
CLKB
CSB
W/RB
ENB
MBB
BE
BM
SIZE
4678 drw 01
COMMERICAL TEMPERATURE RANGE
2003 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
NOVEMBER 2003
1
DSC-4678/2

IDT72V3693L15PFG8相似产品对比

IDT72V3693L15PFG8 IDT72V36103L10PFG8 IDT72V36103L15PFG8 IDT72V3693L10PFG8
描述 FIFO, 32KX36, 10ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 64KX36, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 64KX36, 10ns, Synchronous, CMOS, PQFP128, TQFP-128 FIFO, 32KX36, 6.5ns, Synchronous, CMOS, PQFP128, TQFP-128
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 QFP QFP QFP QFP
包装说明 LFQFP, TQFP-128 TQFP-128 TQFP-128
针数 128 128 128 128
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
最长访问时间 10 ns 6.5 ns 10 ns 6.5 ns
周期时间 15 ns 10 ns 15 ns 10 ns
JESD-30 代码 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128 R-PQFP-G128
JESD-609代码 e3 e3 e3 e3
长度 20 mm 20 mm 20 mm 20 mm
内存密度 1179648 bit 2359296 bit 2359296 bit 1179648 bit
内存宽度 36 36 36 36
湿度敏感等级 3 3 3 3
功能数量 1 1 1 1
端子数量 128 128 128 128
字数 32768 words 65536 words 65536 words 32768 words
字数代码 32000 64000 64000 32000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C
组织 32KX36 64KX36 64KX36 32KX36
可输出 YES YES YES YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFQFP LFQFP LFQFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.6 mm 1.6 mm 1.6 mm
最大供电电压 (Vsup) 3.45 V 3.45 V 3.45 V 3.45 V
最小供电电压 (Vsup) 3.15 V 3.15 V 3.15 V 3.15 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 MATTE TIN MATTE TIN MATTE TIN Matte Tin (Sn)
端子形式 GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 QUAD QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30
宽度 14 mm 14 mm 14 mm 14 mm
Base Number Matches 1 1 1 -

 
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