电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

71V65602S100BGG

产品描述PBGA-119, Tray
产品类别存储    存储   
文件大小970KB,共26页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 全文预览

71V65602S100BGG概述

PBGA-119, Tray

71V65602S100BGG规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码PBGA
包装说明BGA,
针数119
制造商包装代码BGG119
Reach Compliance Codecompliant
最长访问时间5 ns
其他特性PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B119
JESD-609代码e1
长度22 mm
内存密度8388608 bit
内存集成电路类型ZBT SRAM
内存宽度32
湿度敏感等级3
功能数量1
端子数量119
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX32
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)260
座面最大高度2.36 mm
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm
Base Number Matches1

文档预览

下载PDF文档
256K x 36, 512K x 18
3.3V Synchronous ZBT™ SRAMs
2.5V I/O, Burst Counter
Pipelined Outputs
x
x
x
x
x
x
x
x
x
x
x
x
x
IDT71V65602
IDT71V65802
Features
256K x 36, 512K x 18 memory configurations
Supports high performance system speed - 150MHz
(3.8ns Clock-to-Data Access)
ZBT
TM
Feature - No dead cycles between write and read cycles
Internally synchronized output buffer enable eliminates the
need to control
OE
Single R/W (READ/WRITE) control pin
W
Positive clock-edge triggered address, data, and control
signal registers for fully pipelined applications
4-word burst capability (interleaved or linear)
Individual byte write (BW
1
-
BW
4
) control (May tie active)
BW
Three chip enables for simple depth expansion
3.3V power supply (±5%)
2.5V I/O Supply (V
DDQ
)
Power down controlled by ZZ input
Packaged in a JEDEC standard 100-pin plastic thin quad and
flatpack (TQFP), 119 ball grid array (BGA) and 165 fine pitch
ball grid array (fBGA)
Description
The IDT71V65602/5802 are 3.3V high-speed 9,437,184-bit
(9 Megabit) synchronous SRAMs. They are designed to eliminate dead
bus cycles when turning the bus around between reads and writes, or
writes and reads. Thus, they have been given the name ZBT
TM
, or Zero
Bus Turnaround.
Address and control signals are applied to the SRAM during one clock
cycle, and two cycles later the associated data cycle occurs, be it read or write.
The IDT71V65602/5802 contain data I/O, address and control signal
registers. Output enable is the only asynchronous signal and can be used to
disable the outputs at any given time.
A Clock Enable (CEN) pin allows operation of the IDT71V65602/5802
to be suspended as long as necessary. All synchronous inputs are ignored
when (CEN) is high and the internal device registers will hold their previous
values.
There are three chip enable pins (CE
1
, CE
2
,
CE
2
) that allow the
user to deselect the device when desired. If any one of these three are not
asserted when ADV/LD is low, no new memory operation can be initiated.
However, any pending data transfers (reads or writes) will be completed. The
data bus will tri-state two cycles after chip is deselected or a write is initiated.
The IDT71V65602/5802 have an on-chip burst counter. In the burst
mode, the IDT71V65602/5802 can provide four cycles of data for a single
address presented to the SRAM. The order of the burst sequence is defined
by the
LBO
input pin. The
LBO
pin selects between linear and interleaved burst
sequence. The ADV/LD signal is used to load a new external address (ADV/
LD
= LOW) or increment the internal burst counter (ADV/LD = HIGH).
The IDT71V65602/5802 SRAM utilize IDT's latest high-performance
CMOS process, and are packaged in a JEDEC Standard 14mm x 20mm 100-
pin thin plastic quad flatpack (TQFP) as well as a 119 ball grid array (BGA)
and a 165 fine pitch ball grid array (fBGA).
Pin Description Summary
A
0
-A
18
Address Inputs
Chip Enables
Output Enable
Read/Write Signal
Clock Enable
Individual Byte Write Selects
Clock
Advance burst address / Load new address
Linear / Interleaved Burst Order
Sleep Mode
Data Input / Output
Core Power, I/O Power
Ground
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
I/O
Supply
Supply
Synchronous
Synchronous
Asynchronous
Synchronous
Synchronous
Synchronous
N/A
Synchronous
Static
Asynchronous
Synchronous
Static
Static
5303 tbl 01
CE
1
, CE
2
,
CE
2
OE
R/
W
CEN
BW
1
,
BW
2
,
BW
3
,
BW
4
CLK
ADV/
LD
LBO
ZZ
I/O
0
-I/O
31
, I/O
P1
-I/O
P4
V
DD
, V
DDQ
V
SS
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc. and the architecture is supported by Micron Technology and Motorola, Inc.
OCTOBER 2004
DSC-5303/05
1
©2004 Integrated Device Technology, Inc.
英特尔推虚拟试衣,大家来看看啥原理?
:) 日前,英特尔展示了一款虚拟试衣技术。这个机器是一块特制的透明屏幕+遥控器。机器放置在某衣服店内,通过投影将店内场景投射到屏幕上,用户在屏幕上看着就像正在逛商场。随后用遥控器进 ......
soso 创意市集
無刷直流電机的調速器有誰做過?用的什么芯片,能否給個代碼研究一下?
無刷直流電机的調速器有誰做過?用的什么芯片,能否給個代碼研究一下?...
ylhsia 嵌入式系统
高性能汉语数码语音识别算法(1)
摘 要: 提出了一个高性能的汉语数码语音识别(MDSR)系统。 MDSR系统使用Mel频标倒谱系数(MFCC)作为主要的语音特征参数,同时提取共振峰轨迹和鼻音特征以区分一些易混语音对,并提出一个基于语 ......
DSP 与 ARM 处理器
dsp学习视频谁有,传一下,谢谢,
刚学dsp,希望各位强人给点意见 ...
yjp080214 微控制器 MCU
透视网通电信运营业务模式创新
在互联网上购物、在家炒股、视频会议、远程教学,这与几年前我们在邮局里排队打电话的情景相比有着多么大的反差。从垄断的以提供单一语音业务为主的电信公司,到今天多元化竞争格局的形成,电信 ......
xiaoxin 无线连接
国产FPGA之路在于高安全性
半导体市场格局已成三足鼎立之势,FPGA,ASIC和ASSP三分天下。市场统计数据表明,FPGA已经逐步侵蚀ASIC和ASSP的传统市场,并处于快速增长阶段。现阶段FPGA的应用不断扩展,从工业控制、视频监控 ......
天天谈芯 FPGA/CPLD

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 623  1787  1487  2027  2029  10  17  49  33  6 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved