HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20
HCT系列, 8位 驱动, 实输出, PDSO20
参数名称 | 属性值 |
功能数量 | 1 |
端子数量 | 20 |
最大工作温度 | 85 Cel |
最小工作温度 | -40 Cel |
最大供电/工作电压 | 5.5 V |
最小供电/工作电压 | 4.5 V |
额定供电电压 | 5 V |
端口数 | 2 |
加工封装描述 | 0.300 INCH, MS-013, SOIC-20 |
无铅 | Yes |
欧盟RoHS规范 | Yes |
状态 | ACTIVE |
工艺 | CMOS |
包装形状 | 矩形的 |
包装尺寸 | SMALL OUTLINE |
表面贴装 | Yes |
端子形式 | GULL WING |
端子间距 | 1.27 mm |
端子涂层 | MATTE 锡 |
端子位置 | 双 |
包装材料 | 塑料/环氧树脂 |
温度等级 | INDUSTRIAL |
系列 | HCT |
输出特性 | 3-ST |
逻辑IC类型 | 驱动 |
位数 | 8 |
输出极性 | TRUE |
传播延迟TPD | 56 ns |
MM74HCT373 | MM74HCT373_05 | MM74HCT373WM | MM74HCT374 | MM74HCT374WM | MM74HCT374SJ | MM74HCT374N | |
---|---|---|---|---|---|---|---|
描述 | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | HCT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
表面贴装 | Yes | Yes | YES | Yes | YES | YES | NO |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
端子位置 | 双 | 双 | DUAL | 双 | DUAL | DUAL | DUAL |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
系列 | HCT | HCT | HCT | HCT | HCT | HCT | HCT |
输出特性 | 3-ST | 3-ST | 3-STATE | 3-ST | 3-STATE | 3-STATE | 3-STATE |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
Brand Name | - | - | Fairchild Semiconduc | - | Fairchild Semiconduc | Fairchild Semiconduc | Fairchild Semiconduc |
是否无铅 | - | - | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | - | - | 符合 | - | 符合 | 符合 | 符合 |
厂商名称 | - | - | Fairchild | - | Fairchild | Fairchild | Fairchild |
零件包装代码 | - | - | SOIC | - | SOIC | SOP | DIP |
包装说明 | - | - | SOP, SOP20,.4 | - | SOP, SOP20,.4 | SOP, SOP20,.3 | DIP, DIP20,.3 |
针数 | - | - | 20 | - | 20 | 20 | 20 |
制造商包装代码 | - | - | 20LD, SOIC, JEDEC MS013, .300\", WIDE BODY | - | 20LD, SOIC, JEDEC MS013, .300\", WIDE BODY | 20LD,SOP,EIAJ TYPE II, 5.3MM WIDE | 20LD,MDIP,JEDEC MS-001, .300\" WIDE |
Reach Compliance Code | - | - | compli | - | compli | compli | compli |
ECCN代码 | - | - | EAR99 | - | EAR99 | EAR99 | EAR99 |
JESD-30 代码 | - | - | R-PDSO-G20 | - | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 |
JESD-609代码 | - | - | e3 | - | e3 | e3 | e3 |
长度 | - | - | 12.8 mm | - | 12.8 mm | 12.6 mm | 26.075 mm |
负载电容(CL) | - | - | 50 pF | - | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | - | - | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER |
最大I(ol) | - | - | 0.006 A | - | 0.006 A | 0.006 A | 0.006 A |
端口数量 | - | - | 2 | - | 2 | 2 | 2 |
最高工作温度 | - | - | 85 °C | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | - | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
封装主体材料 | - | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | - | SOP | - | SOP | SOP | DIP |
封装等效代码 | - | - | SOP20,.4 | - | SOP20,.4 | SOP20,.3 | DIP20,.3 |
封装形状 | - | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | - | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
峰值回流温度(摄氏度) | - | - | NOT SPECIFIED | - | NOT SPECIFIED | 260 | NOT APPLICABLE |
电源 | - | - | 5 V | - | 5 V | 5 V | 5 V |
传播延迟(tpd) | - | - | 56 ns | - | 57 ns | 57 ns | 57 ns |
认证状态 | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | - | 2.65 mm | - | 2.65 mm | 2.1 mm | 5.08 mm |
最大供电电压 (Vsup) | - | - | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | - | - | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | - | - | 5 V | - | 5 V | 5 V | 5 V |
技术 | - | - | CMOS | - | CMOS | CMOS | CMOS |
端子面层 | - | - | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) |
端子节距 | - | - | 1.27 mm | - | 1.27 mm | 1.27 mm | 2.54 mm |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT APPLICABLE |
宽度 | - | - | 7.5 mm | - | 7.5 mm | 5.3 mm | 7.62 mm |
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