SPECIALTY TELECOM CIRCUIT, BGA28
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 最小工作温度 | -40 Cel |
| 最大工作温度 | 85 Cel |
| 加工封装描述 | GREEN, DSBGA-28 |
| each_compli | Yes |
| 欧盟RoHS规范 | Yes |
| 中国RoHS规范 | Yes |
| 状态 | Active |
| 通信类型 | TELECOM CIRCUIT |
| jesd_30_code | R-XBGA-B28 |
| jesd_609_code | e1 |
| moisture_sensitivity_level | 1 |
| 包装材料 | UNSPECIFIED |
| ckage_code | VFBGA |
| 包装形状 | RECTANGULAR |
| 包装尺寸 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| eak_reflow_temperature__cel_ | 260 |
| qualification_status | COMMERCIAL |
| seated_height_max | 0.6250 mm |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子涂层 | TIN SILVER COPPER |
| 端子形式 | BALL |
| 端子间距 | 0.5000 mm |
| 端子位置 | BOTTOM |
| ime_peak_reflow_temperature_max__s_ | NOT SPECIFIED |
| length | 3.25 mm |
| width | 2.75 mm |
| TSC2005 | TSC2005I | TSC2005IYZLT | TSC2005_07 | |
|---|---|---|---|---|
| 描述 | SPECIALTY TELECOM CIRCUIT, BGA28 | SPECIALTY TELECOM CIRCUIT, BGA28 | SPECIALTY TELECOM CIRCUIT, BGA28 | SPECIALTY TELECOM CIRCUIT, BGA28 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 |
| 最小工作温度 | -40 Cel | -40 Cel | -40 Cel | -40 Cel |
| 最大工作温度 | 85 Cel | 85 Cel | 85 Cel | 85 Cel |
| 加工封装描述 | GREEN, DSBGA-28 | GREEN, DSBGA-28 | GREEN, DSBGA-28 | GREEN, DSBGA-28 |
| each_compli | Yes | Yes | Yes | Yes |
| 欧盟RoHS规范 | Yes | Yes | Yes | Yes |
| 中国RoHS规范 | Yes | Yes | Yes | Yes |
| 状态 | Active | Active | Active | Active |
| 通信类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| jesd_30_code | R-XBGA-B28 | R-XBGA-B28 | R-XBGA-B28 | R-XBGA-B28 |
| jesd_609_code | e1 | e1 | e1 | e1 |
| moisture_sensitivity_level | 1 | 1 | 1 | 1 |
| 包装材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| ckage_code | VFBGA | VFBGA | VFBGA | VFBGA |
| 包装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 包装尺寸 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| eak_reflow_temperature__cel_ | 260 | 260 | 260 | 260 |
| qualification_status | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| seated_height_max | 0.6250 mm | 0.6250 mm | 0.6250 mm | 0.6250 mm |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子涂层 | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子间距 | 0.5000 mm | 0.5000 mm | 0.5000 mm | 0.5000 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| ime_peak_reflow_temperature_max__s_ | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| length | 3.25 mm | 3.25 mm | 3.25 mm | 3.25 mm |
| width | 2.75 mm | 2.75 mm | 2.75 mm | 2.75 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
