电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

514-AG11D-ES

产品描述IC Socket, DIP14, 14 Contact(s)
产品类别连接器    插座   
文件大小126KB,共2页
制造商Thomas & Betts Corporation
官网地址http://www.tnb.com/
下载文档 详细参数 全文预览

514-AG11D-ES在线购买

供应商 器件名称 价格 最低购买 库存  
514-AG11D-ES - - 点击查看 点击购买

514-AG11D-ES概述

IC Socket, DIP14, 14 Contact(s)

514-AG11D-ES规格参数

参数名称属性值
厂商名称Thomas & Betts Corporation
Reach Compliance Codeunknown
ECCN代码EAR99
其他特性STANDARD: UL 94V-0
联系完成配合NOT SPECIFIED
触点材料NOT SPECIFIED
设备插槽类型IC SOCKET
使用的设备类型DIP14
外壳材料THERMOPLASTIC POLYESTER
制造商序列号500
触点数14
Base Number Matches1

文档预览

下载PDF文档
500 Series
A
DIP Socket with Four-Fingered Contact & Solid Insulator
Wide tapered entry
Low profile
“X” & “Y”
stackable
insulator
Precision
four-finger
inner contact
Non-wicking
closed bottom
528-AG11D-ES
Solderless wrap
or PC termination
FEATURES:
The Augat 500 Series Socket features a precision four-finger inner contact
to produce the industry standard for high reliability screw machine sockets.
• Precision four-finger inner contact provides concentric funnel entry for
easy flat and round lead insertion
• Machined (Premium Series) and stamped (Economy Series) contacts
are available
• "X" & "Y" stackable
• Non-wicking, closed bottom sleeve gives 100% protection against flux
and solder contamination. Choice of solderless wrap or PC termination
• Accommodates 6 through 40 pin DIPS, rectangular or round leads
Recognized under the Component Program of Underwriters
Laboratories, Inc. file no. E111362
®
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-1344, Method 2005.1,
Condition II, 10 G’s
Shock .............................. Passed MIL-STD-1344, Method 2004.1,
Condition C, 100 G’s
Durability ...................... Passed MIL-STD-1344, Method 2016
Normal Force ................ 125 Grams (4.4 oz.) average with .018" (0,46) dia.
polished steel pin (Premium Series)
200 Grams (7.1 oz.) average with .018" (0,46) dia.
polished steel pin (Economy Series)
Inner Contact Retention
in Sleeve ...................... 7.5 Lbs. per line average
Sleeve Retention
in Plastic ..................... 3.0 Lbs. per line minimum
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force .............. Premium - 134 Grams (4.7 oz.) average with a
.018" (0,46) dia. polished steel pin
Economy - 179 Grams (6.3 oz.) average with a
.018" (0,46) dia. polished steel pin
Withdrawal Force .......... 63 Grams (2.2 oz.) average with a .018" (0,46)
(Premium and Economy) dia. polished steel pin
ELECTRICAL
Contact Resistance ........ 10 Milliohms max.
Contact Rating .............. 3 Amps
Capacitance .................... 1.0 pF per MIL-STD-202, Method 305
(contact to contact)
Insulation Resistance .... 5,000 Megohms min. @ 500 VDC per
MIL-STD-1344, Method 3003.1
Dielectric Withstanding
Voltage ...................... 1,000 Volts RMS per MIL-STD-1344,
Method 3001.1
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-1344, Method 1002.2, Cond. II
Thermal Shock .............. Passed MIL-STD-1344, Method 1003.1, Cond. A
Operation Temperature .. Gold inner contact -55°C to +125°C,
Tin/lead inner contact -55°C to +105°C
• Beryllium copper inner contact for maximum mechanical and
electrical performance
• For extreme conditions involving shock and vibration, Augat's high
retention series is available
APPLICATION DIMENSIONS:
• PCB Thickness Range: Standard .062" and .092" (1,57 and 2,34)
• PCB Hole Size Range:
.035"
±
.002" (0,89
±
0,05) PC tail,
.055"
±
.003" (1,40
±
0,08) solderless wrap
• IC Pin Dimension Range: .009" x .015" (0,23 x 0,38) through
.011" x .020" (0,28 x 0,51)
.016" to .021" (0,41 to 0,53) round lead,
.105" (2,67) min. length
MATERIAL SPECIFICATIONS:
Insulator ........................ Thermoplastic polyester, UL rated 94V-0
Sleeve ............................ Machined brass/formed copper
Contact .......................... Beryllium copper
Sleeve Plating ................ Tin/lead or gold
Contact Plating .............. Premium or Economy Series (ES) - gold or
tin/lead
Economy Series (ESL) - low gold
Vapor Phase/IR Compatible
Quality & Innovation From The
Product Group
A10
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
【GD32L233C-START评测】12. 硬件IIC驱动OLED
之前的帖子可以参考: 【GD32L233C-START评测】1.开箱 【GD32L233C-START评测】2.手把手创建新工程 【GD32L233C-START评测】3.移植FreeRTOS到GD32L233 【GD32L233C-START评测】 ......
hehung GD32 MCU
[资料推荐] LM27402 —具有DCR电流感应的高性能同步降压控制器
80000说明The LM27402 is a synchronous voltage mode DC/DC buck controller with inductor DCR current sense capability. Sensing the inductor current eliminates the need to add resisti ......
soso 模拟与混合信号
提高RF微波测试正确性
尽管大部分的RF 和微波测试系统所要量测的对象只有区区几种广泛的类别- 放大器、发射器、接收器等,但每一套个别的系统却会面临一些不同的环境条件、要求和挑战。虽然每一种状况可能都不一样, ......
kandy2059 测试/测量
磁环电感的计算
本帖最后由 paulhyde 于 2014-9-15 03:06 编辑 磁环电感计算公式,很不错 ...
wulei19880906 电子竞赛
EEWORLD大学堂----直播回放: TI 60G 毫米波传感器概述和应用介绍
直播回放: TI 60G 毫米波传感器概述和应用介绍:https://training.eeworld.com.cn/course/5430...
hi5 综合技术交流
近距离通信协议
2.1 RFID RFID的空中接口通信协议规范基本决定了RFID的工作类型,RFID读写器和相应类型RFID标签之间的通讯规则,包括:频率、调制、位编码及命令集。ISO/IEC制定五种频段的空中接口协议。 ......
灞波儿奔 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 218  1357  2142  2531  2825  35  5  37  57  17 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved