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MX25L3235EM2K-12G: 产品描述Flash,; 产品类别存储存储; 文件大小1MB，共88页; 制造商Macronix; 官网地址http://www.macronix.com/en-us/Pages/default.aspx

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MX25L3235EM2K-12G概述

Flash,

MX25L3235EM2K-12G规格参数

参数名称	属性值
厂商名称	Macronix
包装说明	,
Reach Compliance Code	unknown
内存集成电路类型	FLASH
编程电压	3 V
Base Number Matches	1

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MX25L3235E

(J / K Grade)

MX25L3235E

HIGH PERFORMANCE

SERIAL FLASH SPECIFICATION

P/N: PM2011

REV. 1.2, JUL. 31, 2014

MX25L3235E

(J / K Grade)

Contents

1. FEATURES ........................................................................................................................................................ 4

2. GENERAL DESCRIPTION ............................................................................................................................... 6

3. PIN CONFIGURATION ...................................................................................................................................... 7

4. PIN DESCRIPTION ............................................................................................................................................ 7

5. BLOCK DIAGRAM............................................................................................................................................. 8

6. DATA PROTECTION.......................................................................................................................................... 9

Table 1. Protected Area Sizes ..............................................................................................................10

Table 2. 4K-bit Secured OTP Definition

............................................................................................... 11

7. MEMORY ORGANIZATION ............................................................................................................................. 12

Table 3. Memory Organization

.............................................................................................................12

8. DEVICE OPERATION ...................................................................................................................................... 13

9. HOLD FEATURE.............................................................................................................................................. 14

10. COMMAND DESCRIPTION ........................................................................................................................... 15

Table 4. Command Sets

.......................................................................................................................15

10-1. Write Enable (WREN)

..........................................................................................................................18

10-2. Write Disable (WRDI)

...........................................................................................................................19

10-3. Read Identification (RDID)

...................................................................................................................20

10-4. Read Status Register (RDSR)

.............................................................................................................21

Table 5. Configuration Register

............................................................................................................23

Table 6. Dummy Cycle and Frequency

................................................................................................23

10-5. Write Status Register (WRSR)

.............................................................................................................24

Table 7. Protection Modes

....................................................................................................................25

10-6. Read Data Bytes (READ)

....................................................................................................................27

10-7. Read Data Bytes at Higher Speed (FAST_READ)

..............................................................................28

10-8. Dual Read Mode (DREAD)

..................................................................................................................29

10-9. 2 x I/O Read Mode (2READ)

...............................................................................................................30

10-10. Quad Read Mode (QREAD)

................................................................................................................31

10-11. 4 x I/O Read Mode (4READ)

...............................................................................................................32

10-12. Performance Enhance Mode

...............................................................................................................33

10-13. Performance Enhance Mode Reset (FFh)

...........................................................................................33

10-14. Sector Erase (SE)

................................................................................................................................36

10-15. Block Erase (BE)

.................................................................................................................................37

10-16. Block Erase (BE32K)

...........................................................................................................................38

10-17. Chip Erase (CE)

...................................................................................................................................39

10-18. Page Program (PP)

.............................................................................................................................40

10-19. 4 x I/O Page Program (4PP)

................................................................................................................41

10-20. Continuous Program mode (CP mode)

................................................................................................44

10-21. Deep Power-down (DP)

.......................................................................................................................46

10-22. Release from Deep Power-down (RDP), Read Electronic Signature (RES)

.......................................47

10-23. Read Electronic Manufacturer ID & Device ID (REMS), (REMS2), (REMS4)

.....................................49

10-24. ID Read

................................................................................................................................................50

Table 8. ID Definitions

.........................................................................................................................50

10-25. Enter Secured OTP (ENSO)

................................................................................................................50

10-26. Exit Secured OTP (EXSO)

...................................................................................................................50

10-27. Read Security Register (RDSCUR)

.....................................................................................................51

P/N: PM2011

REV. 1.2, JUL. 31, 2014

MX25L3235E

(J / K Grade)

Table 9. Security Register Definition

....................................................................................................52

10-28. Write Security Register (WRSCUR)

.....................................................................................................53

10-29. Write Protection Selection (WPSEL)

....................................................................................................53

10-30. Single Block Lock/Unlock Protection (SBLK/SBULK)

..........................................................................57

10-31. Read Block Lock Status (RDBLOCK)

..................................................................................................60

10-32. Gang Block Lock/Unlock (GBLK/GBULK)

...........................................................................................61

10-33. Enable SO to Output RY/BY# (ESRY)

.................................................................................................62

10-34. Disable SO to Output RY/BY# (DSRY)

................................................................................................62

10-35. No Operation (NOP)

............................................................................................................................62

10-36. Software Reset (Reset-Enable (RSTEN) and Reset (RST))

...............................................................62

10-37. Read SFDP Mode (RDSFDP)

..............................................................................................................63

Table 10. Signature and Parameter Identification Data Values

...........................................................64

Table 11. Parameter Table (0): JEDEC Flash Parameter Tables

.........................................................65

Table 12. Parameter Table (1): Macronix Flash Parameter Tables

......................................................67

11. POWER-ON STATE ....................................................................................................................................... 69

12. ELECTRICAL SPECIFICATIONS .................................................................................................................. 70

12-1. Absolute Maximum Ratings

.................................................................................................................70

12-2. Capacitance

.........................................................................................................................................70

Table 13. DC Characteristics

................................................................................................................72

Table 14. AC

Characteristics

................................................................................................................74

13. TIMING ANALYSIS ........................................................................................................................................ 77

Table 15. Power-Up Timing

.................................................................................................................79

13-1. Initial delivery state

..............................................................................................................................79

14. OPERATING CONDITIONS ........................................................................................................................... 80

15. ERASE AND PROGRAMMING PERFORMANCE ........................................................................................ 82

16. DATA RETENTION ........................................................................................................................................ 82

17. LATCH-UP CHARACTERISTICS .................................................................................................................. 82

18. ORDERING INFORMATION .......................................................................................................................... 83

19. PART NAME DESCRIPTION ......................................................................................................................... 84

20. PACKAGE INFORMATION ............................................................................................................................ 85

21. REVISION HISTORY ..................................................................................................................................... 87

P/N: PM2011

REV. 1.2, JUL. 31, 2014

MX25L3235EM2K-12G

MX25L3235EM2K-12G概述

MX25L3235EM2K-12G规格参数

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