2.0-6.0 GHz
GaAs MMIC Amplifier
January 2007 - Rev 15-Jan-07
CMM-5-BD
Chip Diagram
Features
High Gain: 16.5 dB
18 dBm P1dB
Small Size: 39x40 mils
Directly Cascadable
Self-Biased
Single Power Supply
General Description
Mimix Broadband's CMM-5 is a 2 to 6 GHz GaAs MMIC
amplifier. It is a two-stage feedback design which provides
high gain and good power from a single power supply.
Applications include oscillator buffers, RF and IF gain blocks
and driver amplifiers.
The CMM-5 is a very small chip which provides 16.5 dB of
gain and 18 dBm of power from a 6 volt supply. The chip is
directly cascadable with no additional components. The
circuit’s self-biasing feature provides excellent performance
from a 5 to 7 volt supply. Care must be taken to isolate the
input from the external DC voltages.
Mimix MMICs are fabricated on ion-implanted GaAs material
with gold-based metalization. The FET gates are sub-half
micron, tee cross-section construction. Air bridges are used
for top level interconnection. Silicon nitride serves as
capacitor dielectric and surface passivation. Mesa resistors
are used for feedback and bias function.
The CMM-5 is available in chip form. It can be screened to
meet commercial, military Hi-Rel or space grade reliability
requirements. Custom wafer qualification for special
electrical and/or reliability requirements is also available.
Absolute Maximum Ratings
Voltage
Continuous Power Dissipation
Channel Temperature
Storage Temperature
Mounting Temperature
Input Power
JC
8V
1.25 W
+175 ºC
-65 to +175
º
C
+320 ºC
+20 dBm
60 ºC/W
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 1 of 5
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-6.0 GHz
GaAs MMIC Amplifier
January 2007 - Rev 15-Jan-07
CMM-5-BD
Specifications (T
A
= 25ºC,V
DD
= 6V, 2-6 GHz)
Die Attach and Bonding Procedures
Die Attach:
Conductive epoxy or preform die attach is recom-
mended. For preform die attach: Preform: AuSn (80% Au, 20%
Sn); Stage Temperature: 290 ºC, +/-5 ºC; Handling Tool: Tweezers;
Time: 1 min or less.
Wire Bonding:
Wire Size: 0.7 to 1.0 mil in diameter (pre-
stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding: Stage
Temperature: 250 ºC ; Bond Tip Temperature: 150 ºC; Bonding
Tip Pressure: 18 to 40 gms depending on size of wire.
Bonding Diagram
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 2 of 5
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-6.0 GHz
GaAs MMIC Amplifier
January 2007 - Rev 15-Jan-07
CMM-5-BD
Typical Performance (T
A
= 25ºC)
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 3 of 5
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-6.0 GHz
GaAs MMIC Amplifier
January 2007 - Rev 15-Jan-07
CMM-5-BD
Typical Scattering Parameters,T
A
= 25ºC
(S-Parameters Include Bonding Wire Parasitics)
Equivalent Circuit
Wafer Qualification Procedure
100% DC Text
100% Visual Insp.
Sample Mechanical
Evaluation
Sample Circuit
Performance Tests*
Reliability
Assessment
*80% of tested samples must meet specifications
for wafer acceptance.
NF, Gain, P1dB,
VSWR
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 4 of 5
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
2.0-6.0 GHz
GaAs MMIC Amplifier
January 2007 - Rev 15-Jan-07
CMM-5-BD
Handling and Assembly Information
CAUTION!
- Mimix Broadband MMIC Products contain gallium arsenide (GaAs) which can be hazardous to the human body and the
environment. For safety, observe the following procedures:
• Do not ingest.
• Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical
processing as these by-products are dangerous to the human body if inhaled, ingested, or swallowed.
• Observe government laws and company regulations when discarding this product. This product must be
discarded in accordance with methods specified by applicable hazardous waste procedures.
Life Support Policy
- Mimix Broadband's products are not authorized for use as critical components in life support devices or
systems without the express written approval of the President and General Counsel of Mimix Broadband. As used herein: (1) Life
support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain
life, and whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury to the user. (2) A critical component is any component of a life support device or
system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its
safety or effectiveness.
ESD
- Gallium Arsenide (GaAs) devices are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic
containers, which should be opened in cleanroom conditions at an appropriately grounded antistatic workstation. Devices need
careful handling using correctly designed collets, vacuum pickups or, with care, sharp tweezers.
Die Attachment
- GaAs Products from Mimix Broadband are 0.076 mm (0.003") thick and have vias through to the backside to enable
grounding to the circuit. Microstrip substrates should be brought as close to the die as possible. The mounting surface should be
clean and flat. If using conductive epoxy, recommended epoxies are Tanaka TS3332LD, Die Mat DM6030HK or DM6030HK-Pt cured in
a nitrogen atmosphere per manufacturer's cure schedule. Apply epoxy sparingly to avoid getting any on to the top surface of the die.
An epoxy fillet should be visible around the total die periphery. For additional information please see the Mimix "Epoxy Specifications
for Bare Die" application note. If eutectic mounting is preferred, then a fluxless gold-tin (AuSn) preform, approximately 0.001
2
thick,
placed between the die and the attachment surface should be used. A die bonder that utilizes a heated collet and provides scrubbing
action to ensure total wetting to prevent void formation in a nitrogen atmosphere is recommended. The gold-tin eutectic
(80% Au 20% Sn) has a melting point of approximately 280º C (Note: Gold Germanium should be avoided). The work station
temperature should be 310ºC +/- 10ºC. Exposure to these extreme temperatures should be kept to minimum. The collet should be
heated, and the die pre-heated to avoid excessive thermal shock. Avoidance of air bridges and force impact are critical during
placement.
Wire Bonding
- Windows in the surface passivation above the bond pads are provided to allow wire bonding to the die's gold bond
pads. The recommended wire bonding procedure uses 0.076 mm x 0.013 mm (0.003" x 0.0005") 99.99% pure gold ribbon with 0.5-2%
elongation to minimize RF port bond inductance. Gold 0.025 mm (0.001") diameter wedge or ball bonds are acceptable for DC Bias
connections. Aluminum wire should be avoided. Thermo-compression bonding is recommended though thermosonic bonding may
be used providing the ultrasonic content of the bond is minimized. Bond force, time and ultrasonics are all critical parameters. Bonds
should be made from the bond pads on the die to the package or substrate. All bonds should be as short as possible.
RoHS Compliant Parts
- All Mimix products are RoHS compliant unless specifically ordered with Tin-Lead finish.
Part Number for Ordering
CMM-5-BD-000X
Description
Where “X” is RoHS compliant die packed in “V” - vacuum release gel packs or
W” - waffle trays
Mimix Broadband, Inc., 10795 Rockley Rd., Houston, Texas 77099
Tel: 281.988.4600 Fax: 281.988.4615 mimixbroadband.com
Page 5 of 5
Characteristic Data and Specifications are subject to change without notice.
©2007
Mimix Broadband, Inc.
Export of this item may require appropriate export licensing from the U.S. Government. In purchasing these parts, U.S. Domestic customers accept
their obligation to be compliant with U.S. Export Laws.
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