Optoisolators (Photocouplers)
CNC7H001
Optoisolator
Unit: mm
I
Features
•
Housed in a surface mount package alternative to mini-flat package
of 1.27 mm pitch
•
Double molded package
•
2.5 kV isolation voltage
•
UL approved (File No. E79920)
10.3
±0.3
16
9
I
Applications
•
Suited for interface circuits requiring high density mounting of
parts, especially hybrid ICs and programmable controllers
•
Signal transfer between circuits with different potentials and with
impedances
1
1.27
0.4
8
4.4
7.0
±0.3
2.0
0.1
±0.1
0.15
+0.10
-0.05
(1.3)
0.5
±0.3
I
Absolute Maximum Ratings
T
a
=
25°C
Parameter
Input (light
Forward current (DC)
*1
Symbol
I
F
I
FP
P
D
I
C
V
CEO
V
ECO
P
C
V
ISO
T
opr
T
stg
Rating
±50
±1
75
50
80
7
120
2 500
−30
to
+100
−55
to
+125
Unit
mA
A
mW/ch
mA
V
V
mW/ch
V[rms]
°C
°C
1
2
3
1, 3, 5, 7
: Anode/Cathode
2, 4, 6, 8
: Cathode/Anode
9, 11, 13, 15 : Emitter
10, 12, 14, 16: Collector
PCTFG116-001 Package
emitting diode) Pulse forward current
Power dissipation
*2
Output (photo Collector current
transistor)
Pin Connection
16
15 14
13 12
11 10
9
Collector-emitter voltage
Emitter-collector voltage
Collector power dissipation
*3
*4
Isolation voltage, input to output
Operating ambient temperature
Storage temperature
4
5
6
7
8
Top View
Note) *1: Pulse repetition rate
=
100 pps. Pulse wide
≤
100
µs
*2: Above 25°C ambient temperature, derate dissipation at the rate of 0.75 mW/°C.
*3: Above 25°C ambient temperature, derate dissipation at the rate of 1.2 mW/°C.
*4: AC voltage (t
=
1.0 min., RH
<
60%)
Publication date: May 2002
SHF00007AED
1
Caution for Safety
I
Gallium arsenide material (GaAs) is used
in this product.
DANGER
Therefore, do not burn, destroy, cut, crush, or chemi-
cally decompose the product, since gallium arsenide
material in powder or vapor form is harmful to human
health.
Observe the relevant laws and regulations when
disposing of the products. Do not mix them with ordi-
nary industrial waste or household refuse when dis-
posing of GaAs-containing products.
Request for your special attention and precautions in using the technical information
and semiconductors described in this book
(1) An export permit needs to be obtained from the competent authorities of the Japanese Govern-
ment if any of the products or technologies described in this book and controlled under the "Foreign
Exchange and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this book is limited to showing representative characteristics
and applied circuits examples of the products. It neither warrants non-infringement of intellectual
property right or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the
product or technologies as described in this book.
(4) The products described in this book are intended to be used for standard applications or general
electronic equipment (such as office equipment, communications equipment, measuring instru-
ments and household appliances).
Consult our sales staff in advance for information on the following applications:
•
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment,
combustion equipment, life support systems and safety devices) in which exceptional quality and
reliability are required, or if the failure or malfunction of the products may directly jeopardize life or
harm the human body.
•
Any applications other than the standard applications intended.
(5) The products and product specifications described in this book are subject to change without no-
tice for modification and/or improvement. At the final stage of your design, purchasing, or use of the
products, therefore, ask for the most up-to-date Product Standards in advance to make sure that
the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum
rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise,
we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of
incidence of break down and failure mode, possible to occur to semiconductor products. Measures
on the systems such as redundant design, arresting the spread of fire or preventing glitch are
recommended in order to prevent physical injury, fire, social damages, for example, by using the
products.
(7) When using products for which damp-proof packing is required, observe the conditions (including
shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets
are individually exchanged.
(8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written
permission of Matsushita Electric Industrial Co., Ltd.
2002 MAY
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