64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | SPANSION |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, |
| 针数 | 73 |
| Reach Compliance Code | compli |
| 其他特性 | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 |
| JESD-30 代码 | R-PBGA-B73 |
| JESD-609代码 | e0 |
| 长度 | 11.6 mm |
| 内存密度 | 67108864 bi |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 73 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 4MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.4 mm |
| 最大供电电压 (Vsup) | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 8 mm |
| Base Number Matches | 1 |
| Am49DL640BH56IT | Am49DL640BH70IT | AM49DL640BH | Am49DL640BH85IT | Am49DL640BH70IS | Am49DL640BH56IS | Am49DL640BH85IS | |
|---|---|---|---|---|---|---|---|
| 描述 | 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory | 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory | 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory | 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory | 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory | 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory | 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | SPANSION | SPANSION | - | SPANSION | SPANSION | SPANSION | SPANSION |
| 零件包装代码 | BGA | BGA | - | BGA | BGA | BGA | BGA |
| 包装说明 | LFBGA, | LFBGA, | - | LFBGA, | LFBGA, | LFBGA, | LFBGA, |
| 针数 | 73 | 73 | - | 73 | 73 | 73 | 73 |
| Reach Compliance Code | compli | compli | - | compli | compliant | compli | compliant |
| 其他特性 | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | - | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 | PSEUDO STATIC RAM IS ORGANIZED AS 2M X 16; FLASH CAN ALSO BE ORGANIZED AS 8M X 8 |
| JESD-30 代码 | R-PBGA-B73 | R-PBGA-B73 | - | R-PBGA-B73 | R-PBGA-B73 | R-PBGA-B73 | R-PBGA-B73 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 |
| 长度 | 11.6 mm | 11.6 mm | - | 11.6 mm | 11.6 mm | 11.6 mm | 11.6 mm |
| 内存密度 | 67108864 bi | 67108864 bi | - | 67108864 bi | 67108864 bit | 67108864 bi | 67108864 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | - | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 16 | 16 | - | 16 | 16 | 16 | 16 |
| 湿度敏感等级 | 3 | 3 | - | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 73 | 73 | - | 73 | 73 | 73 | 73 |
| 字数 | 4194304 words | 4194304 words | - | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | - | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 4MX16 | 4MX16 | - | 4MX16 | 4MX16 | 4MX16 | 4MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | - | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 240 | 240 | - | 240 | 240 | 240 | 240 |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.4 mm | 1.4 mm | - | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 (Vsup) | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | - | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | - | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | BALL | BALL | - | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | 30 | 30 |
| 宽度 | 8 mm | 8 mm | - | 8 mm | 8 mm | 8 mm | 8 mm |
| Base Number Matches | 1 | 1 | - | 1 | 1 | 1 | 1 |
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