Low Voltage Quad 2-Input NAND Gate with Open Drain Outputs and 3.6V Tolerant Inputs and Outputs
| 74VCX38 | 74VCX38BQX | 74VCX38M | 74VCX38_05 | 74VCX38MTCX_NL | 74VCX38MTC | |
|---|---|---|---|---|---|---|
| 描述 | Low Voltage Quad 2-Input NAND Gate with Open Drain Outputs and 3.6V Tolerant Inputs and Outputs | Low Voltage Quad 2-Input NAND Gate with Open Drain Outputs and 3.6V Tolerant Inputs and Outputs | Low Voltage Quad 2-Input NAND Gate with Open Drain Outputs and 3.6V Tolerant Inputs and Outputs | Low Voltage Quad 2-Input NAND Gate with Open Drain Outputs and 3.6V Tolerant Inputs and Outputs | Low Voltage Quad 2-Input NAND Gate with Open Drain Outputs and 3.6V Tolerant Inputs and Outputs | Low Voltage Quad 2-Input NAND Gate with Open Drain Outputs and 3.6V Tolerant Inputs and Outputs |
| 是否Rohs认证 | - | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | - | Fairchild | Fairchild | - | Fairchild | Fairchild |
| 零件包装代码 | - | QFN | SOIC | - | TSSOP | TSSOP |
| 包装说明 | - | 2.50 X 3 MM, MO-241AA, DQFN-14 | 0.150 INCH, MS-012, SOIC-14 | - | 4.40 MM, LEAD FREE, MO-153AB, TSSOP-14 | 4.40 MM, MO-153AB, TSSOP-14 |
| 针数 | - | 14 | 14 | - | 14 | 14 |
| Reach Compliance Code | - | compli | unknow | - | _compli | unknow |
| 系列 | - | ALVC/VCX/A | ALVC/VCX/A | - | ALVC/VCX/A | ALVC/VCX/A |
| JESD-30 代码 | - | R-XQCC-N14 | R-PDSO-G14 | - | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | - | e3 | e3 | - | e3 | e3 |
| 长度 | - | 3 mm | 8.6235 mm | - | 5 mm | 5 mm |
| 负载电容（CL） | - | 30 pF | 30 pF | - | 30 pF | 30 pF |
| 逻辑集成电路类型 | - | NAND GATE | NAND GATE | - | NAND GATE | NAND GATE |
| 最大I（ol） | - | 0.024 A | 0.024 A | - | 0.024 A | 0.024 A |
| 湿度敏感等级 | - | 1 | 1 | - | 1 | 1 |
| 功能数量 | - | 4 | 4 | - | 4 | 4 |
| 输入次数 | - | 2 | 2 | - | 2 | 2 |
| 端子数量 | - | 14 | 14 | - | 14 | 14 |
| 最高工作温度 | - | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 输出特性 | - | OPEN-DRAIN | OPEN-DRAIN | - | OPEN-DRAIN | OPEN-DRAIN |
| 封装主体材料 | - | UNSPECIFIED | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | HVQCCN | SOP | - | TSSOP | TSSOP |
| 封装等效代码 | - | LCC14,.1X.12,20 | SOP14,.25 | - | TSSOP14,.25 | TSSOP14,.25 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | - | TAPE AND REEL | RAIL | - | TAPE AND REEL | RAIL |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | 260 | - | 260 | 260 |
| 电源 | - | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Su | - | 2.8 ns | 2.8 ns | - | 2.8 ns | 2.8 ns |
| 传播延迟（tpd） | - | 33.5 ns | 33.5 ns | - | 33.5 ns | 33.5 ns |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 施密特触发器 | - | NO | NO | - | NO | NO |
| 座面最大高度 | - | 0.8 mm | 1.753 mm | - | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 1.2 V | 1.2 V | - | 1.2 V | 1.2 V |
| 标称供电电压 (Vsup) | - | 1.5 V | 1.5 V | - | 1.5 V | 1.5 V |
| 表面贴装 | - | YES | YES | - | YES | YES |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin (Sn) | Matte Tin (Sn) | - | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | - | NO LEAD | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | - | 0.5 mm | 1.27 mm | - | 0.65 mm | 0.65 mm |
| 端子位置 | - | QUAD | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 2.5 mm | 3.9 mm | - | 4.4 mm | 4.4 mm |
| Base Number Matches | - | 1 | 1 | - | 1 | 1 |
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