®
HS-139RH
Data Sheet
December 22, 2004
FN3573.3
Radiation Hardened Quad Voltage
Comparator
The Radiation Hardened HS-139RH consists of four
independent single or dual supply voltage comparators on a
single monolithic substrate. The common mode input
voltage range includes ground, even when operated from a
single supply, and the low supply current makes these
comparators suitable for low power applications. These
types were designed to directly interface with TTL and
CMOS.
The HS-139RH is fabricated on our dielectrically isolated
Rad Hard Silicon Gate (RSG) process, which provides an
immunity to Single Event Latch-up and the capability of
highly reliable performance in any radiation environment.
Specifications for Rad Hard QML devices are controlled
by the Defense Supply Center in Columbus (DSCC). The
SMD numbers listed below must be used when ordering.
Detailed Electrical Specifications for the HS-139RH are
contained in SMD 5962-98613. A “hot-link” is provided
on our homepage with instructions for downloading.
www.intersil.com/spacedefense/newsafclasst.asp
Features
• QML Qualified Per MIL-PRF-38535 Requirements
• Radiation Environment
- Latch-up Free Under any Conditions
- Total Dose (Max) . . . . . . . . . . . . . . . . . 3 x 10
5
RAD(Si)
- SEU LET Threshold . . . . . . . . . . . . . . . 20MeV/cm
2
/mg
- Low Dose Rate Effects Immunity
• 100V Output Voltage Withstand Capability
• ESD Protection to >3000V
• Differential Input Voltage Range Equal to the Supply
Voltage
• Input Offset Voltage (V
IO
) . . . . . . . . . . . . . . . . 2mV (Max)
• Quiescent Supply Current . . . . . . . . . . . . . . . . 2mA (Max)
Applications
• Pulse Generators
• Timing Circuitry
• Level Shifting
• Analog to Digital Conversion
Ordering Information
ORDERING
NUMBER
5962F9861301VCC
5962F9861301QCC
HS1-139RH/Proto
5962F9861301VXC
5962F9861301QXC
HS9-139RH/Proto
INTERNAL
MKT. NUMBER
HS1-139RH-Q
HS1-139RH-8
HS1-139RH/Proto
HS9-139RH-Q
HS9-139RH-8
HS9-139RH/Proto
TEMP. RANGE (
o
C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Pinouts
s
HS-139RH (SBDIP CDIP2-T14)
TOP VIEW
OUT 2 1
OUT 1 2
V+ 3
- IN 1 4
+ IN 1 5
- IN 2 6
+ IN 2 7
14 OUT 3
13 OUT 4
12 GND
11 + IN 4
10 - IN 4
9 + IN 3
8 - IN 3
HS-139RH (FLATPACK CDFP3-F14)
TOP VIEW
OUT 2
OUT 1
V+
- IN 1
+ IN 1
- IN 2
+IN 2
1
2
3
4
5
6
7
14
13
12
11
10
9
8
OUT 3
OUT 4
GND
+ IN 4
- IN 4
+ IN 3
- IN 3
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-352-6832
|
Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 1999, 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
HS-139RH
Die Characteristics
DIE DIMENSIONS:
3750µm x 2820µm (148 mils x 111 mils)
483µm
±
25.4µm (19 mils
±
1 mil)
INTERFACE MATERIALS:
Glassivation:
Type: Silox (SiO
2
)
Thickness: 8.0kÅ
±
1.0kÅ
Top Metallization:
Type: AlSiCu
Thickness: 16.0kÅ
±
2kÅ
Substrate:
Radiation Hardened Silicon Gate, Dielectric Isolation
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Unbiased (DI)
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2.0 x 10
5
A/cm
2
Transistor Count:
49
Metallization Mask Layout
HS-139RH
GND
(12)
+IN4
(11)
-IN4
(10)
OUT4
(13)
+IN3
(9)
OUT3
(14)
-IN3
(8)
+IN2
(7)
OUT2
(1)
-IN2
(6)
OUT1
(2)
V+
(3)
-IN1
(4)
+IN1
(5)
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
2
FN3573.3
December 22, 2004
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