RH02 - RH06
0.5A SURFACE MOUNT GLASS PASSIVATED FAST
RECOVERY BRIDGE RECTIFIER
Features
·
·
·
·
·
·
Glass Passivated Die Construction
Low Forward Voltage Drop
Surge Overload Rating to 30A Peak
Ideally Suited for Automatic Assembly
Miniature Package Saves Space on PC Boards
Lead Free Finish, RoHS Compliant (Note 4)
MiniDIP
Dim
B
C
D
E
F
G
H
J
K
L
Min
3.6
0.15
¾
¾
¾
0.70
4.5
2.3
2.3
0.50
Max
4.0
0.35
0.20
7.0
3.00
1.10
4.9
2.7
2.7
0.80
L
G
Mechanical Data
·
·
·
·
·
·
Case: MiniDIP
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Terminals: Finish
¾
Bright Tin. Plated Leads, Solderable
per MIL-STD-202, Method 208
Polarity: As Marked on Case
Marking: Type Number
Weight: 0.125 grams (approx.)
B
D E
H
J
K
F
C
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Rectified Current (Note 1) T
A
= @ 40°C
Non-Repetitive Peak Forward Surge Current, 8.3 ms
Single half-sine-wave Superimposed on Rated Load
(JEDEC method)
Instantaneous Voltage Drop @ 0.4A (per element)
Peak Reverse Current at Rated
DC Blocking Voltage (per element)
Maximum Reverse Recovery Time
Typical Junction Capacitance (per element)
Operating and Storage Temperature Range
Notes:
1.
2.
3.
4.
@ T
A
= 25°C unless otherwise specified
RH02
200
140
RH04
400
280
0.5
30
1.15
5.0
100
150
13.0
85
-55 to +150
250
RH06
600
420
Unit
V
V
A
A
V
mA
ns
pF
K/W
°C
Symbol
V
RMM
V
RWM
V
DC
V
RMS
I
O
I
FSM
V
F
I
R
t
rr
C
j
R
qJA
T
j
, T
STG
@ T
A
= 25°C
@ T
A
= 125°C
(Note 3)
(Note 2)
Typical Thermal Resistance, Junction to Ambient (Note 1)
Mounted on Glass Epoxy PC Board.
Measured at 1.0 MHz and Applied Reverse Voltage of 4.0 V.
t
rr
test conditions: I
F
= 0.5A, I
R
= 1.0A, I
rr
= 0.25A.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
DS30137 Rev. 6 - 2
1 of 3
www.diodes.com
RH02 - RH06
ã
Diodes Incorporated
I
(AV)
, AVERAGE FORWARD RECTIFIED CURRENT (A)
0.8
Alumina Substrate
0.6
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
10
1.0
0.4
Glass Epoxy PC Board
0.1
0.2
Resistive or Inductive Load
0
0
40
80
120
160
T
A
, AMBIENT TEMPERATURE (
°
C)
Fig. 1 Output Current Derating Curve
0.01
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics (per leg)
I
FSM
, PEAK FORWARD SURGE CURRENT (A)
35
30
C
j
, JUNCTION CAPACITANCE (pF)
100
T
j
= 25
°
C
f = 1.0MHz
20
10
10
T
A
= 25
°
C
Single Half Sine-Wave
Pulse Width = 5.3ms
(JEDEC Method)
0
1.0
10
NUMBER OF CYCLES AT 60 Hz
Fig. 3 Maximum Peak Forward Surge Current (per leg)
100
1
1
10
V
R
, REVERSE VOLTAGE (V)
Fig. 4 Typical Junction Capacitance
100
10
T
j
= 125
°
C
1.0
0.1
T
j
= 25
°
C
0.01
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 5 Typical Reverse Characteristics (per element)
DS30137 Rev. 6 - 2
2 of 3
www.diodes.com
RH02 - RH06
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