Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> 935312733557

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935312733557: 产品描述RISC Microcontroller; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小847KB，共60页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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935312733557概述

RISC Microcontroller

935312733557规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
包装说明	,
Reach Compliance Code	unknown
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC
Base Number Matches	1

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Kinetis V系列KV10和KV11微控制器基于ARM Cortex-M0+核心，运行频率高达75 MHz，采用创新的90nm薄膜存储（TFS）闪存技术。该系列提供高达128 KB的闪存和16 KB的RAM，支持多种外设集成，如双通道16-bit ADC、FlexTimers（FTM）和FlexCAN通信接口。其设计专注于工业级应用，工作电压范围为1.71 V至3.6 V，温度适应范围从-40°C到105°C，确保在苛刻环境下的稳定运行。核心特性包括低功耗模式优化和硬件加速模块，如位操作引擎（BME），提升系统效率。在性能方面，双16-bit ADC支持最高1.2 MS/s的采样率（12位模式），适用于高精度信号采集。FlexTimers提供灵活的电机控制能力，结合Kinetis Motor Suite（KMS）支持，可快速配置无刷直流（BLDC）和永磁同步电机（PMSM）驱动系统。通信接口包括SPI、I2C、UART和FlexCAN（仅KV11），满足多样化连接需求。低功耗模式如VLPS和VLLS可显著降低能耗，例如VLPR模式下电流低至268 μA（3.0 V时），延长电池供电设备的寿命。关键优势包括集成安全模块如硬件CRC和唯一芯片ID，增强系统完整性。封装选项多样，包括32 QFN和64 LQFP，便于紧凑设计。该微控制器系列适用于工业电机控制、逆变器和低端电源转换应用，提供可靠的数据处理和控制功能。Kinetis V系列微控制器以低功耗为核心，集成ARM Cortex-M0+处理器，运行频率75 MHz。内存配置高达128 KB闪存和16 KB RAM，支持多种低功耗模式，如VLLS0电流可低至0.098 μA（3.0 V时），优化能源消耗。外设包括双16-bit ADC、FlexTimers和通信接口（SPI、I2C、UART），工作电压1.71 V至3.6 V，温度范围-40°C至105°C，适用于电池供电和便携设备。在功耗管理上，VLPR模式电流268 μA（4 MHz核心频率），VLPW模式电流173.4 μA，延长设备运行时间。模拟模块如ADC和DAC支持12位精度，结合硬件CRC确保数据完整性。系统时钟灵活，内置多用途时钟生成器（MCG），支持外部晶体振荡器（4-32 MHz）。Kinetis Motor Suite（KMS）实现快速电机配置，提升BLDC和PMSM驱动的效率。可靠性和适应性是关键，提供热阻数据（如RθJA 34°C/W）和ESD保护（HBM 2000 V）。封装选项涵盖32至64引脚，便于集成。该系列适合低端电源转换和嵌入式控制，确保高性能与低能耗的平衡。

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NXP Semiconductors

Data Sheet: Technical Data

KV11P64M75

Rev. 4, 05/2017

Kinetis V Series KV10 and KV11,

128/64 KB Flash

75 MHz Cortex-M0+ Based Microcontroller

The Kinetis V Series KV11x MCU family is built on ARM Cortex-

M0+ core and enabled by innovative 90nm thin film storage

(TFS) flash process technology. The KV11x is an extension of

the existing KV10x family providing increased memory, higher

pin count, additional FTMs and a FlexCAN serial interface.

• Dual 16-bit ADCs sampling at up to 1.2 MS/s in 12-bit

mode

• Highly accurate and flexible motor control timers

• Ideal for industrial motor control applications, inverters, and

low-end power conversion applications

• Enabled to support Kinetis Motor Suite (KMS), a bundled

hardware and software solution that enables rapid

configuration of BLDC and PMSM motor drive systems

MKV11Z128VXX7

MKV11Z64VXX7

MKV10Z64VXX7

MKV10Z128VXX7

MKV11Z128VLX7P

MKV10Z64VLX7P

32 QFN

64 LQFP

5 x 5 x 1.23 mm Pitch 10 x 10 x 1.4 mm Pitch

0.5 mm

32 LQFP

7 x 7 x 1.4 mm Pitch

0.8 mm

48 LQFP

7 x 7 x 1.4 mm Pitch

0.5 mm

Performance

• Up to 75 MHz ARM Cortex-M0+ based core

Memories and memory interfaces

• Up to 128 KB of program flash memory

• Up to 16 KB of RAM

System peripherals

• Nine low-power modes to provide power optimization

based on application requirements

• 8-channel DMA controller

• SWD interface and Micro Trace buffer

• Bit Manipulation Engine (BME)

• External watchdog timer

• Advanced independent clocked watchdog

• Memory Mapped Divide and Square Root (MMDVSQ)

module

Clocks

• 32-40 kHz or 4-32 MHz external crystal oscillator

• Multipurpose clock generator (MCG) with frequency-

locked loop referencing either internal or external

reference clock

Security and integrity modules

• 80-bit unique identification (ID) number per chip

• Hardware CRC module

Communication interfaces

• One 16-bit SPI module

• One I2C module

• Two UART modules

• One FlexCAN module

Timers

• Programmable delay block

• Two 6-channel FlexTimers (FTM) for motor control/

general purpose applications

• Four 2-channel FlexTimers (FTM) with quadrature

decoder functionality

• 16-bit low-power timer (LPTMR)

Operating Characteristics

• Voltage range: 1.71 to 3.6 V

• Flash write voltage range: 1.71 to 3.6 V

• Temperature range (ambient): –40 to 105°C

Analog modules

• Two 16-bit SAR ADCs

• 12-bit DAC

• Two analog comparators (ACMP) containing a 6-bit

DAC and programmable reference input

Human-machine interface

• General-purpose I/O

NXP reserves the right to change the production detail specifications as may be

required to permit improvements in the design of its products.

Table of Contents

1 Ratings................................................................................ 6

1.1 Thermal handling ratings............................................. 6

1.2 Moisture handling ratings.............................................6

1.3 ESD handling ratings................................................... 6

1.4 Voltage and current operating ratings..........................6

2 General............................................................................... 7

2.1 AC electrical characteristics.........................................7

2.2 Nonswitching electrical specifications..........................8

2.2.1 Voltage and current operating requirements....8

2.2.2 LVD and POR operating requirements............ 9

2.2.3 Voltage and current operating behaviors......... 10

2.2.4 Power mode transition operating behaviors.....10

2.2.5 KV11x Power consumption operating

behaviors......................................................... 11

2.2.6 EMC radiated emissions operating behaviors..17

2.2.7 Designing with radiated emissions in mind...... 18

2.2.8 Capacitance attributes..................................... 18

2.3 Switching specifications............................................... 18

2.3.1 Device clock specifications.............................. 18

2.3.2 General switching specifications...................... 19

2.4 Thermal specifications................................................. 20

2.4.1 Thermal operating requirements...................... 20

2.4.2 Thermal attributes............................................ 20

3 Peripheral operating requirements and behaviors.............. 21

3.1 Core modules...............................................................21

3.1.1 SWD Electricals .............................................. 21

3.2 System modules.......................................................... 22

3.3 Clock modules............................................................. 22

3.3.1 MCG specifications.......................................... 22

3.3.2 Oscillator electrical specifications.................... 24

3.4 Memories and memory interfaces................................26

3.4.1 Flash electrical specifications...........................26

3.5 Security and integrity modules.....................................28

3.6 Analog..........................................................................28

3.6.1 ADC electrical specifications............................28

3.6.2

3.6.3

CMP and 6-bit DAC electrical specifications....32

12-bit DAC electrical characteristics................ 34

3.7 Timers.......................................................................... 37

3.8 Communication interfaces........................................... 37

3.8.1 DSPI switching specifications (limited voltage

range)...............................................................37

3.8.2 DSPI switching specifications (full voltage

range)...............................................................40

3.8.3 I2C................................................................... 44

3.8.4 UART............................................................... 44

Kinetis Motor Suite.............................................................. 44

Dimensions..........................................................................44

5.1 Obtaining package dimensions....................................44

Pinout.................................................................................. 45

6.1 KV11 Signal Multiplexing and Pin Assignments.......... 45

6.2 KV11 Pinouts............................................................... 48

Ordering parts..................................................................... 52

7.1 Determining valid orderable parts................................ 52

Part identification.................................................................52

8.1 Description................................................................... 53

8.2 Format..........................................................................53

8.3 Fields........................................................................... 53

8.4 Example....................................................................... 53

Terminology and guidelines................................................ 54

9.1 Definition: Operating requirement................................ 54

9.2 Definition: Operating behavior..................................... 54

9.3 Definition: Attribute.......................................................54

9.4 Definition: Rating..........................................................55

9.5 Result of exceeding a rating........................................ 55

9.6 Relationship between ratings and operating

requirements................................................................ 56

9.7 Guidelines for ratings and operating requirements...... 56

9.8 Definition: Typical value............................................... 57

9.9 Typical Value Conditions............................................. 58

10 Revision history................................................................... 58

Kinetis V Series KV10 and KV11, 128/64 KB Flash, Rev. 4, 05/2017

NXP Semiconductors

935312733557相似产品对比

	935312733557	935315996557
描述	RISC Microcontroller	RISC Microcontroller
厂商名称	NXP(恩智浦)	NXP(恩智浦)
Reach Compliance Code	unknown	unknown
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
Base Number Matches	1	1

935312733557

935312733557概述

935312733557规格参数

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935312733557相似产品对比

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