Crystal unit
SMALL SMD LOW / MEDIUM-FREQUENCY
CRYSTAL UNIT
MC-306
• High-density mounting-type SMD.
• Photolithography finished allows uniform and stable performance.
• Excellent reliability and environmental capability.
Actual size
Specifications (characteristics)
Item
Symbol
f
T
STG
T
OPR
GL
T
SOL
∆f/f
θT
a
C
L
R
1
C
1
C
0
IR
fa
50 kΩ max.
1.8fF typ.
0.9pF typ.
32.768 kHz
Specifications
20.000 kHz to 165.000 kHz
-55˚C to +125˚C
-40˚C to +85˚C
1.0µW max.
Twice at under 260˚C within 10 sec.
Stored as bare product after unpacking
Remarks
Nominal frequency
Temperature
range
Storage temperature
Operating temperature
Maximum drive level
Soldering condition
Frequency tolerance (standard)
Peak temperature (frequency)
Temperature coefficient (frequency)
Load capacitance
Series resistance
Motional capacitance
Shunt capacitance
Insulation resistance
Aging
or under 230˚C within 3 min.
±20ppm, ±50ppm
±50ppm, ±100ppm
25˚C ±5˚C
-0.04ppm/ ˚C
2
max.
6pF to
∞
55 kΩ to 10 kΩ
4.0fF to 0.6fF
2.0pF to 0.6pF
500 MΩ min.
±3ppm/year max.
±5ppm/year max.
Ta=25˚C ±3˚C, first year
Three drops on a hard board from 75 cm or excitation
test with 3000G x 0.3ms x 1/2 sine wave x 3 directions
Ta=25˚C, DL=0.1µW
Please specify
As per below table
Shock resistance
S.R.
±5ppm max.
Metal may be exposed on the top of this product. This won't affect any quality, reliability or electrical spec.
Series resistance
Frequency (kHz)
Series resistance (Ω)
20
≤
f < 30
55k
Ω
max.
30
≤
f < 40
45k
Ω
max.
40
≤
f < 60
20k
Ω
max.
(Unit: mm)
60
≤
f < 70
15k
Ω
max.
70
≤
f < 120
12k
Ω
max.
120
≤
f < 165
10k
Ω
max.
(Unit: mm)
External dimensions
8.0 max.
#4
#3
Recommended soldering pattern
1.3
4.2
1.3
Internal connection
#4
3.8 max.
#3
#1
#2
#1
#2
2.54 max.
2.38
0.5
5.5
(0.9)
1.9
(0.9)
Do not connect
#2 and #3 to external device.
19
1.9
1.3
1.9
32.768k
E
571
3.2
THE CRYSTALMASTER
ENERGY SAVING EPSON
EPSON offers effective savings to its customers through
a wide range of electronic devices, such as semiconductors,
liquid crystal display (LCD) modules, and crystal devices.
These savings are achieved through a sophisticated melding
of three different efficiency technologies.
Power saving technology
provides low power con-
sumption at low voltages.
Energy Saving
Space saving technology
provides further reductions
in product size and weight
Power Saving
through super-precise pro-
cessing and high-density
assembly technology.
Space Saving
Time saving technology
shortens the time required
for design and development
Time Saving
on the customer side and
shortens delivery times.
Our concept of Energy Saving technology conserves
resources by blending the essence of these three efficiency
technologies. The essence of these technologies is repre-
sented in each of the products that we provide to our cus-
tomers.
In the industrial sector, leading priorities include mea-
sures to counter the greenhouse effect by reducing CO2,
measures to preserve the global environ-
ment, and the development of energy-
efficient products. Environmental
problems are of global concern, and
although the contribution of energy-
Resource
saving technology developed by
Saving
EPSON may appear insignificant,
we seek to contribute to the develop-
ment of energy-saving products by our
customers through the utilization of our electronic devices.
EPSON is committed to the conservation of energy, both
for the sake of people and of the planet on which we live.
SEIKO EPSON CORP. QUARTZ DEVICE DIVISION acquired ISO9001 and ISO14001 certification
by B.V.Q. I. (Bureau Veritas Quality International) .
ISO9001 in October, 1992.
ISO14001 in November,1997.
NOTICE
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circuit and, further, there is no representation that this material is applicable to products requiring high level reliability, such as,
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