Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Data Device Corporation |
零件包装代码 | BGA |
包装说明 | BGA, BGA312,13X24,40 |
针数 | 312 |
Reach Compliance Code | compliant |
地址总线宽度 | 16 |
边界扫描 | NO |
总线兼容性 | MIL-STD-1553 |
最大时钟频率 | 20 MHz |
通信协议 | MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 |
数据编码/解码方法 | BIPH-LEVEL(MANCHESTER) |
最大数据传输速率 | 1 MBps |
外部数据总线宽度 | 16 |
JESD-30 代码 | R-PBGA-B312 |
JESD-609代码 | e0 |
长度 | 27.9 mm |
低功率模式 | YES |
湿度敏感等级 | 3 |
串行 I/O 数 | 2 |
端子数量 | 312 |
片上数据RAM宽度 | 16 |
最高工作温度 | 100 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA312,13X24,40 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY |
认证状态 | Not Qualified |
RAM(字数) | 2048 |
筛选级别 | MIL-STD-883 |
座面最大高度 | 4.7 mm |
最大压摆率 | 931 mA |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | HYBRID |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn63Pb37) |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
宽度 | 15.2 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |
Base Number Matches | 1 |
BU-64843T8-E02 | BU-64863I8-E02 | BU-64863H8-E02 | BU-64843I8-E02 | BU-64843U8-E02 | |
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描述 | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312 | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312 | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312 | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312 | Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA312, BGA-312 |
是否无铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 不符合 | 符合 | 不符合 | 符合 | 符合 |
厂商名称 | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation | Data Device Corporation |
零件包装代码 | BGA | BGA | BGA | BGA | BGA |
包装说明 | BGA, BGA312,13X24,40 | BGA, BGA312,13X24,40 | BGA, BGA312,13X24,40 | BGA, BGA312,13X24,40 | BGA, BGA312,13X24,40 |
针数 | 312 | 312 | 312 | 312 | 312 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
地址总线宽度 | 16 | 16 | 16 | 16 | 16 |
边界扫描 | NO | NO | NO | NO | NO |
总线兼容性 | MIL-STD-1553 | MIL-STD-1553 | MIL-STD-1553 | MIL-STD-1553 | MIL-STD-1553 |
最大时钟频率 | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
通信协议 | MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 | MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 | MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 | MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 | MIL STD 1553A; MIL STD 1553B; MIL STD 1760; MCAIR; STANAG-3838 |
数据编码/解码方法 | BIPH-LEVEL(MANCHESTER) | BIPH-LEVEL(MANCHESTER) | BIPH-LEVEL(MANCHESTER) | BIPH-LEVEL(MANCHESTER) | BIPH-LEVEL(MANCHESTER) |
最大数据传输速率 | 1 MBps | 1 MBps | 1 MBps | 1 MBps | 1 MBps |
外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 |
JESD-30 代码 | R-PBGA-B312 | R-PBGA-B312 | R-PBGA-B312 | R-PBGA-B312 | R-PBGA-B312 |
JESD-609代码 | e0 | e1 | e0 | e1 | e1 |
长度 | 27.9 mm | 27.9 mm | 27.9 mm | 27.9 mm | 27.9 mm |
低功率模式 | YES | YES | YES | YES | YES |
串行 I/O 数 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 312 | 312 | 312 | 312 | 312 |
片上数据RAM宽度 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 100 °C | 100 °C | 100 °C | 100 °C | 100 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA | BGA |
封装等效代码 | BGA312,13X24,40 | BGA312,13X24,40 | BGA312,13X24,40 | BGA312,13X24,40 | BGA312,13X24,40 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字数) | 2048 | 8192 | 8192 | 2048 | 2048 |
筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
座面最大高度 | 4.7 mm | 4.7 mm | 4.7 mm | 4.7 mm | 4.7 mm |
最大压摆率 | 931 mA | 937 mA | 937 mA | 931 mA | 931 mA |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn63Pb37) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
端子形式 | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 15.2 mm | 17.8 mm | 17.8 mm | 17.8 mm | 15.2 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 | SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 |
Base Number Matches | 1 | 1 | 1 | - | - |
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