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BU-64860B3-E02

产品描述Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA324, BGA-324
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小1MB,共100页
制造商Data Device Corporation
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BU-64860B3-E02概述

Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA324, BGA-324

BU-64860B3-E02规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Data Device Corporation
零件包装代码BGA
包装说明BGA, BGA324,18X18,40
针数324
Reach Compliance Codecompliant
其他特性ALSO OPERATES AT 5V SUPPLY
地址总线宽度16
边界扫描NO
最大时钟频率20 MHz
通信协议MIL STD 1553A; MIL STD 1553B; MCAIR; STANAG-3838
数据编码/解码方法BIPH-LEVEL(MANCHESTER)
最大数据传输速率0.125 MBps
外部数据总线宽度16
JESD-30 代码S-PBGA-B324
JESD-609代码e0
长度20.7 mm
低功率模式YES
串行 I/O 数2
端子数量324
最高工作温度100 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3 V
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度3.05 mm
最大供电电压3.6 V
最小供电电压3 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度20.7 mm
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches1

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Card you purchase
has...
®
TM
BU-6474X/6484X/6486X
MINI-ACE
®
MARK3/MICRO-ACE
®
*-TE
FEATURES
Fully Integrated 3.3 or 5.0 Volt, 1553
A/B Notice 2 Terminal
World’s First all 3.3 Volt Terminal
Transceiver Power-Down Options
World’s Smallest CQFP MIL-STD-1553
Device
80-pin Ceramic Flat/Gull Wing
Package or 324-Ball BGA Package
Enhanced Mini-ACE Architecture
Multiple Configurations:
- RT-only, 4K RAM
- BC/RT/Monitor, 4K RAM
DESCRIPTION
The Mini-ACE Mark3 and Micro-ACE-TE are the world's first MIL-STD-1553
terminals which can be powered entirely by +3.3 volts, thus eliminating the
need for a +5 volt power supply. With a package body of 0.880 inches square
and a gull wing "toe-to-toe" dimension of 1.110 inches, the Mini-ACE Mark3
is the industry's smallest ceramic gull-lead 1553 terminal. At 0.815 inches
square, the Micro-ACE-TE (BGA package) provides the smallest industry
footprint, enabling its use in applications where PC board space is at a pre-
mium.
These devices integrate dual 3.3 or 5 volt transceivers, 3.3 or 5.0 volt protocol
logic, and either 4K or 64K words of internal RAM. The architecture is identi-
cal to that of the Enhanced Mini-ACE, and most features are functionally and
software compatible with the previous Mini-ACE (Plus) and ACE genera-
tions.
A salient feature of the Mini-ACE Mark3 and Micro-ACE-TE is the advanced
bus controller architecture. This provides methods to control message sched-
uling, the means to minimize host overhead for asynchronous message
insertion, facilitate bulk data transfers and double buffering, and support
various message retry and bus switching strategies.
The remote terminal architecture provides flexibility in meeting all common
MIL-STD-1553 protocols. The choice of RT data buffering and interrupt
options provides robust support for synchronous and asynchronous messag-
ing, while ensuring data sample consistency and supporting bulk data trans-
fers. The monitor mode provides true message monitoring, and supports fil-
tering on an RT address/T-R bit/subaddress basis.
The Mini-ACE Mark3 and Micro-ACE-TE incorporate fully autonomous built-
in self-tests of internal protocol logic and RAM. The terminals provide
the
same flexibility in host interface configurations as the ACE/Mini-ACE, along
with a reduction in the host processor's worst case holdoff time.
- BC/RT/Monitor, 64K RAM
Supports 1553A/B Notice 2, McAir,
STANAG 3838 Protocols
MIL-STD-1553, McAir, and MIL-
STD-1760 Transceiver Options
Highly Flexible Host Side Interface
Compatible With Mini-ACE and ACE
Generations
Highly Autonomous BC with Built-In
Message Sequence Controller
Choice of Single, Double, and
Circular RT Buffering Options
Selective Message Monitor
Comprehensive Built-In Self-Test
Choice Of 10, 12, 16, or 20 MHz Clock
Inputs
Software Libraries and Drivers
available for Windows® 9x/2000/XP,
Windows NT®, VxWorks® and Linux
Available with Full Military
Temperature Range and Screening
FOR MORE INFORMATION CONTACT:
Technical
INFORMATION CONTACT:
FOR MORE
Support:
1-800-DDC-5757 ext. 7771
Technical Support:
1-800-DDC-5757 ext. 7771
*
The technology used in DDC’s Micro-ACE series of products may be
subject to one or more patents pending.
All trademarks are the property of their respective owners.
© 2002 Data Device Corporation
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com

BU-64860B3-E02相似产品对比

BU-64860B3-E02 BU-64840B3-E02
描述 Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA324, BGA-324 Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, PBGA324, BGA-324
是否无铅 含铅 含铅
是否Rohs认证 不符合 不符合
零件包装代码 BGA BGA
包装说明 BGA, BGA324,18X18,40 BGA, BGA324,18X18,40
针数 324 324
Reach Compliance Code compliant compliant
其他特性 ALSO OPERATES AT 5V SUPPLY ALSO OPERATES AT 5V SUPPLY
地址总线宽度 16 16
边界扫描 NO NO
最大时钟频率 20 MHz 20 MHz
通信协议 MIL STD 1553A; MIL STD 1553B; MCAIR; STANAG-3838 MIL STD 1553A; MIL STD 1553B; MCAIR; STANAG-3838
数据编码/解码方法 BIPH-LEVEL(MANCHESTER) BIPH-LEVEL(MANCHESTER)
最大数据传输速率 0.125 MBps 0.125 MBps
外部数据总线宽度 16 16
JESD-30 代码 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e0 e0
长度 20.7 mm 20.7 mm
低功率模式 YES YES
串行 I/O 数 2 2
端子数量 324 324
最高工作温度 100 °C 100 °C
最低工作温度 -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA
封装等效代码 BGA324,18X18,40 BGA324,18X18,40
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3/5,5 V
认证状态 Not Qualified Not Qualified
筛选级别 MIL-STD-883 MIL-STD-883
座面最大高度 3.05 mm 3.05 mm
最大供电电压 3.6 V 3.6 V
最小供电电压 3 V 3 V
标称供电电压 3.3 V 3.3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL
端子节距 1 mm 1 mm
端子位置 BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 20.7 mm 20.7 mm
uPs/uCs/外围集成电路类型 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553 SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches 1 1

 
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