If Military/Aerospace specified devices are required,
please contact the
CSMSC
Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage
Storage Temperature
Input Voltage
Power Dissipation (P
D
) (Note 4)
ESD Susceptibility (Note 5)
ESD Susceptibility (Note 6)
Junction Temperature (T
J
)
Soldering Information (Note 1)
Small Outline Package
Vapor Phase (60 seconds)
215˚C
6.0V
−65˚C to +150˚C
−0.3V to V
DD
+0.3V
Internally Limited
3.5kV
250V
150˚C
Infrared (15 seconds)
Thermal Resistance
θ
JC
(MSOP)
θ
JA
(MSOP)
θ
JC
(SOP)
θ
JA
(SOP)
θ
JA
(LLP)
θ
JA
(LLP)
220˚C
56˚C/W
210˚C/W
35˚C/W
170˚C/W
117˚C/W (Note 10)
150˚C/W (Note 11)
Operating Ratings
(Notes 2, 3)
Temperature Range
T
MIN
≤
T
A
≤
T
MAX
Supply Voltage
−40˚C
≤
T
A
≤
85˚C
2.0V
≤
V
CC
≤
5.5V
Electrical Characteristics V
DD
= 5V
The following specifications apply for V
DD
(Notes 2, 3)
= 5V, R
L
= 16Ω unless otherwise stated. Limits apply for T
A
= 25˚C.
HWD2119
Units
(Limits)
mA (max)
µA (max)
V (min)
V (max)
mV (max)
mW
mW
%
Symbol
I
DD
I
SD
V
SDIH
V
SDIL
V
OS
P
O
THD+N
Parameter
Quiescent Power Supply Current
Shutdown Current
Shutdown Voltage Input High
Shutdown Voltage Input Low
Output Offset Voltage
Output Power
Total Harmonic Distortion + Noise
V
IN
= 0V
Conditions
V
IN
= 0V, I
o
= 0A
V
PIN1
= V
DD
(Note 12)
Typical
(Note 7)
1.5
1.0
Limit
(Notes 8, 9)
3.0
5.0
4.0
1.0
5
350
300
1
50
THD = 10%, f
IN
= 1kHz
THD = 10%, f
IN
= 1kHz, R
L
= 8Ω
P
O
= 270mW
RMS
, A
VD
= 2, f
IN
=
1kHz
Electrical Characteristics V
DD
= 3V
The following specifications apply for V
DD
(Notes 2, 3)
= 3V and R
L
= 16Ω load unless otherwise stated. Limits apply to T
A
= 25˚C.
HWD2119
Units
(Limits)
mA (max)
µA (max)
V (min)
V (max)
mV
mW
mW
%
Symbol
I
DD
I
SD
V
SDIH
V
SDIL
V
OS
P
O
THD+N
Parameter
Quiescent Power Supply Current
Shutdown Current
Shutdown Voltage Input High
Shutdown Voltage Input Low
Output Offset Voltage
Output Power
Total Harmonic Distortion + Noise
V
IN
= 0V
Conditions
V
IN
= 0V, I
o
= 0A
V
PIN1
= V
DD
(Note 12)
Typical
(Note 7)
1.0
0.7
Limit
(Notes 8, 9)
3.0
5.0
2.4
0.6
5
110
90
1
50
THD = 10%, f
IN
= 1kHz
THD = 10%, f
IN
= 1kHz, R
L
= 8Ω
P
O
= 80mW
RMS
, A
VD
= 2, f
IN
=
1kHz
2
Electrical Characteristics V
DD
= 3V
The following specifications apply for V
DD
25˚C. (Continued)
(Notes 2, 3)
= 3V and R
L
= 16Ω load unless otherwise stated. Limits apply to T
A
=
Note 1:
See AN-450 ’Surface Mounting and their Effects on Product Reliability’ for other methods of soldering surface mount devices.
Note 2:
All voltages are measured with respect to the ground pin, unless otherwise specified.
Note 3:
Absolute Maximum Ratings
indicate limits beyond which damage to the device may occur.
Operating Ratings
indicate conditions for which the device is
functional, but do not guarantee specific performance limits.
Electrical Characteristics
state DC and AC electrical specifications under particular test conditions which
guarantee specific performance limits. This assumes that the device is within the Operating Ratings. Specifications are not guaranteed for parameters where no limit
is given. However, the typical value is a good indication of device’s performance.
Note 4:
The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
,
θ
JA
, and the ambient temperature T
A
. The maximum
allowable power dissipation is P
DMAX
= (T
JMAX
–T
A
)/θ
JA
. For the
HWD2119,
T
JMAX
= 150˚C and the typical junction-to-ambient thermal resistance (θ
JA
) when board
mounted is 210˚C/W for the MSOP package and 170˚C/W for the SOP package.
Note 5:
Human body model, 100pF discharged through a 1.5 kΩ resistor.
Note 6:
Machine Model, 220pF–240pF capacitor is discharged through all pins.
Note 7:
Typical specifications are specified at 25˚C and represent the parametric norm.
Note 8:
Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).
Note 9:
Datasheet min/max specification limits are guaranteed by designs, test, or statistical analysis.
Note 10:
The given
θ
JA
is for an
HWD2119
package in an LDA08B with the Exposed-DAP soldered to a printed circuit board copper pad with an area equivalent to
that of the Exposed-DAP itself. The Exposed-DAP of the LDA08B package should be electrically connected to GND or an electrically isolated copper area.
Note 11:
The given
θ
JA
is for an
HWD2119
package in an LDA08B with the Exposed-DAP not soldered to any printed circuit board copper.
Note 12:
The shutdown pin (pin1) should be driven as close as possible to V
DD
for minimum current in Shutdown Mode.
External Components Description
Components
1.
2.
R
i
C
i
(Figure
1)
Functional Description
Combined with R
f
, this inverting input resistor sets the closed-loop gain. R
i
also forms a high pass filter with
C
i
at f
c
= 1/(2πR
i
C
i
).
This input coupling capacitor blocks DC voltage at the amplifier’s terminals. Combined with R
i
, it creates a
high pass filter with R
i
at f
c
= 1/(2πR
i
C
i
). Refer to the section,
Proper Selection of External Components
for an explanation of how to determine the value of C
i
.
Combined with R
i
, this is the feedback resistor that sets the closed-loop gain: A
v
= 2(R
F
/R
i
).
This is the power supply bypass capacitor that filters the voltage applied to the power supply pin. Refer to
the
Application Information
section for proper placement and selection of C
s
.
This is the bypass pin capacitor that filters the voltage at the BYPASS pin. Refer to the section,
Proper
Selection of External Components,
for information concerning proper placement and selection of C
当今的计算机外部设备，都在追求高速度和高通用性。为了满足用户的需求，以Intel为首的七家公司于1994年推出了USB（Universal Serial Bus，通用串行总线）总线协议，专用于低、中速的计算机外设。目前，USB端口已成为微机主板的标准端口；而在不久的将来，所有的微机外设，包括键盘、鼠标、显示器、打印机、数字相机、扫描仪和游戏柄等等，都将通过USB与主机相连。
...[详细]
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
