Maximum Junction Temperature (Plastic Package) . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300
o
C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Short circuit may be applied to ground or to either supply.
2.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
Typical Values Intended Only for Design Guidance at V+ = 5V, V- = 0V, T
A
= 25
o
C, Unless Otherwise Specified
PARAMETER
Input Resistance
Input Capacitance
Unity Gain Crossover Frequency
Slew Rate
Transient Response:
Rise Time/Fall Time
Overshoot
Settling Time (To <0.1%, V
IN
= 4V
P-P
)
Full Power BW, SR = 5V/µs
t
r
OS
t
S
FPBW
C
L
= 25pF, R
L
= 2kΩ
(Voltage Follower)
A
V
= 1, V
OUT
= 3.65V
P-P
SYMBOL
R
I
C
I
f
T
SR
V
OUT
= 3.65V
P-P
C
L
= 25pF, R
L
= 2kΩ
(Voltage Follower)
f = 1MHz
TEST CONDITIONS
TYPICAL VALUES
5
3.1
14
5
UNITS
TΩ
pF
MHz
V/µs
27/25
20
1
436
ns
%
µs
kHz
Electrical Specifications
T
A
= 25
o
C, V+ = 5V, V- = GND
PARAMETER
Input Offset Voltage
Input Offset Current
Input Current
Common Mode Input Range
Common Mode Rejection Ratio
Power Supply Rejection Ratio
Positive Output Voltage Swing
Negative Output Voltage Swing
Total Supply Current
Unity Gain Bandwidth Product
Slew Rate
Output Current
Source to opposite supply
Sink to opposite supply
Open Loop Gain
I
SOURCE
I
SlNK
A
OL
0.5V to 3.5V, R
L
= 10kΩ
4
1.0
80
5.5
1.2
90
-
-
-
mA
mA
dB
SYMBOL
|V
IO
|
|I
IO
|
I
I
V
ICR
CMRR
PSRR
V
OM
+
V
OM
-
I
SUPPLY
f
T
SR
V
ICR
= 0V to 3.5V
∆V
= 2V
R
L
= 2kΩ to GND
R
L
= 2kΩ to GND
V
OUT
= 2.5V, R
L
=
∞
TEST CONDITIONS
MIN
-
-
-
3.5
55
60
4
-
-
10
4
TYP
6
0.5
0.5
-0.5 to 3.7
70
75
4.4
0.06
6
14
5
MAX
22
50 (Note 3)
50 (Note 3)
0
-
-
-
0.10
7
-
-
UNITS
mV
pA
pA
V
dB
dB
V
V
mA
MHz
V/µs
NOTE:
3. This is the lowest value that can be tested reliably. Almost all devices will be <10pA.
2
CA5470
Electrical Specifications
PARAMETER
Input Offset Voltage
Input Offset Current
Input Current
Common Mode Input Range
Common Mode Rejection Ratio
Power Supply Rejection Ratio
Positive Output Voltage Swing
Negative Output Voltage Swing
Total Supply Current
Unity Gain Bandwidth Product
Slew Rate
Output Current
Source to opposite supply
Sink to opposite supply
Open Loop Gain
I
SOURCE
I
SlNK
A
OL
0.5V to 3.5V, R
L
= 10kΩ
4
0.8
80
5.5
1.2
90
-
-
-
mA
mA
dB
T
A
= -55
o
C to 125
o
C, V+ = 5V, V- = GND
SYMBOL
|V
IO
|
|I
IO
|
I
I
V
ICR
CMRR
PSRR
V
OM
+
V
OM
-
I
SUPPLY
f
T
SR
V
ICR
= 0V to 3.5V
∆V
= 2V
R
L
= 2kΩ to GND
R
L
= 2kΩ to GND
V
OUT
= 2.5V
TEST CONDITIONS
MIN
-
-
-
3.5
50
58
3.8
-
-
8
3
TYP
6
550
550
-0.5 to 3.7
65
75
4.2
0.08
9
12
5
MAX
25
5500
11000
0
-
-
-
0.11
11
-
-
UNITS
mV
pA
pA
V
dB
dB
V
V
mA
MHz
V/µs
Electrical Specifications
PARAMETER
Input Offset Voltage
Input Offset Current
Input Current
Common Mode Input Range
Common Mode Rejection Ratio
Power Supply Rejection Ratio
Positive Output Voltage Swing
T
A
= 25
o
C, V
SUPPLY
=
±7.5V
SYMBOL
|V
IO
|
|I
IO
|
I
I
V
ICR
CMRR
PSRR
V
OM
+
R
L
= 2kΩ to GND
R
L
= 10kΩ to GND
6.3
6.4
6.5
6.6
-
-
V
V
V
ICR
= 0V to 13.3V
∆V
= 1V
TEST CONDITIONS
MIN
-
-
-
5.8
60
60
TYP
5
0.5
1
-7.8 to 6.0
70
76
MAX
25
50 (Note 4)
50 (Note 4)
-7.5
-
-
UNITS
mV
pA
pA
V
dB
dB
Negative Output Voltage Swing
V
OM
-
R
L
= 2kΩ to GND
R
L
= 10kΩ to GND
V
OUT
= GND, R
L
=
∞
-
-
-
12
4
-2.6
-7.3
10
16
7
-2
-7.1
12
-
-
V
V
mA
MHz
V/µs
Total Supply Current
Unity Gain Bandwidth Product
Slew Rate
Output Current
Source to opposite supply
Sink to opposite supply
Open Loop Gain
NOTE:
I
SUPPLY
f
T
SR
I
SOURCE
I
SlNK
A
OL
-5V to +5V, R
L
= 10kΩ
6.2
1
80
6.8
1.4
90
-
-
-
mA
mA
dB
4. This is the lowest value that can be tested reliably. Almost all devices will be <10pA.
3
CA5470
Electrical Specifications
PARAMETER
Input Offset Voltage
Input Offset Current
Input Current
Common Mode Input Range
Common Mode Rejection Ratio
Power Supply Rejection Ratio
Positive Output Voltage Swing
T
A
= -55
o
C to 125
o
C, V
SUPPLY
=
±7.5V
SYMBOL
|V
IO
|
|I
IO
|
I
I
V
ICR
CMRR
PSRR
V
OM
+
R
L
= 2kΩ to GND
R
L
= 10kΩ to GND
Negative Output Voltage Swing
V
OM
-
R
L
= 2kΩ to GND
R
L
= 10kΩ to GND
Total Supply Current
Unity Gain Bandwidth Product
Slew Rate
Output Current
Source to opposite supply
Sink to opposite supply
Open Loop Gain
I
SOURCE
I
SlNK
A
OL
-5V to +5V, R
L
= 10kΩ
6.2
1
80
6.8
1.4
90
-
-
-
mA
mA
dB
I
SUPPLY
f
T
SR
V
OUT
= GND, R
L
=
∞
-
-
-
10
3
-2.6
-7.3
12
15
7
-2
-7.1
18
-
-
V
V
mA
MHz
V/µs
4.75
6.1
5.5
6.4
-
-
V
V
V
ICR
= 0V to 3.5V
∆V
= 1V
TEST CONDITIONS
MIN
-
-
-
5.8
58
60
TYP
5
550
1100
-7.8 to 6.0
70
76
MAX
30
5500
11000
-7.5
-
-
UNITS
mV
pA
pA
V
dB
dB
Block Diagram
(
1
/
4
of CA5470)
V+
TO BIAS
CIRCUIT
4 1.8mA/AMP
100µA
150µA
320µA
50µA
50µA
1.2mA
+INPUT
A
V
≈
6dB
OUTPUT
-INPUT
A
V
≈
30dB
A
V
≈
54dB
2kΩ
2kΩ
11
PMOS DIFFERENTIAL
INPUT STAGE
GROUNDED GATE
LEVEL SHIFTER
COMPOSITE MILLER
GAIN STAGE
OUTPUT STAGE
GND OR
- SUPPLY
4
CA5470
Typical Performance Curve
14
12
V
OUT
(V
P-P
)
10
8
6
4
2
V+ = 5V, V- = 0V
V
S
=
±7.5V
10K
100K
1M
10M
100M
FREQUENCY
FIGURE 1. MAXIMUM OUTPUT VOLTAGE SWING vs FREQUENCY
Metallization Mask Layout
Dimensions in parentheses are in millimeters and
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10
-3
inch).
The layout represents a chip when it is part of the
wafer. When the wafer is cut into chips, the cleavage
angles are 57
o
instead of 90
o
with respect to the face
of the chip. Therefore, the isolated chip is actually 7
NXP MCU
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