808/830 nm
Broad Area Laser Diode
Product Family
Specification Sheet
The M8xx series of Broad Area Laser Diodes from Axcel Photonics offer
high CW optical power from a 100 micron multi-mode aperture and high
brightness with industry leading reliability. This series of devices is
produced with Axcels advanced wafer growth and facet passivation
technology, which enables inceased performance in all areas including
lower threshold current, increased efficiency, and lower operating voltage.
The M8XX series consists of multi-mode operating lasers with standard
apertures of 50, 100 and 200 microns. Custom devices with non-standard
apertures and wavelengths, including multiple active areas are available.
808 and 830 nm high power Broad Area Laser Diodes are suited to a number
applications including DPSSL pumping, fiber lasers, and materials
processing. Our proprietary epitaxial wafer design and facet passivation
processes significantly increase output power in these broad area devices.
Higher brightness for a given active region, up to 3 Watts for a 100 micron
aperture, is achieved with this revolutionary technology.
Facet Technology
The Axcel facet design, based on Axcels highly reliable telecom design,
increases the COD threshold to 20 MW/cm
2
(several times the industry
standard). This allows the device to operate at higher output powers and
maintain the reliability of the facet structure. The uniformity of the
passivation also contributes to increased reliabilty at these elevated
powers. Controlling the thickness of the passivation material creates
uniform power density across the facet and prevents hotpsots in the facet
structure.
Chip and Sub-mount Options
Axcels products are available as discrete single chips or in Chip On Sub-
mount configurations. Axcel offers B and C-Mount options, all of which
include an isolated fly lead connection for the laser cathode. All multi mode
lasers regardless of sub-mount options are mounted P side down.
Fiber pigtailed lasers are offered on a custom basis only. Please contact your
local distributor or sales office for details.
Benefits:
•
High Output Power
•
Improved Efficiency
•
High Reliability
Features:
•
Operating Power to 3W with 100 um
aperture
•
Operating Temperature Range
0
o
C to 70
o
C
•
Available on B or C-Mount With
Isolated Fly Lead Connection
•
Custom Specifications
•
Custom Package and Fiber Options
Available
Applications:
•
Materials Processing
•
DPSSL Pumps
•
Fiber Lasers
Distributor:
LASER COMPONENTS GmbH,
Germany,
Phone:
++49 (0)8142 28640,
Fax: ++49 (0)8142 286411,
E-Mail: info@lasercomponents.com
808/830 nm
Broad Area Laser Diode
Product Family
Parameter
Sym.
Condition
Min
Specification Sheet
Output Power
Forward Voltage
Operating Current
Threshold Current
Slope Efficiency
Horizontal Divergence Angle (//)
Vertical Divergence Angle (^)
Center Wavelength Variation
(808/810/830 typ.)
Laser Emitter Width
Po
Vf
Io
Ith
SE
HFF
VFF
dLc
We
25C & Iop
@ Po
@ Po
4
Typ
1.9
4.3
300
1.0
Max
2.1
4.5
350
10
40
5
25C
FWHM, Po
FWHM, Po
0.95
W
V
A
mA
W/A
deg
deg
nm
um
Units
-5
100
Notes:
1. 50µm, 200µm and dual ridge designs are available, please contact your local represntative for more information and specifications.
2. Output power, vertical divergence angle, and center wavelength are typical specifications and can be customized for specific applications. Please contact your sales representative
for further infromation
3. All specifications are at a sub-mount temperature 25C.
L-I Performance Curves
Ordering Information
Part Number : M-LLL-TT-WWWW-UUU
M = Multi Mode
LLL: Wavelength in nm
800 to 840, 808=808 nm; 830=830 nm
TT: Submount Type
CH=Chip; BM=B Mount; CM=C Mount; SM=Special Mount
WWWW: Output Power in mW
0300 = 300 mW; 5000 = 5000 mW
UUU: Emission Aperture Size
050 = 50
µ
m;
100 = 100
µ
m
Distributor:
LASER COMPONENTS GmbH,
Germany,
Phone:
++49 (0)8142 28640,
Fax: ++49 (0)8142 286411,
E-Mail: info@lasercomponents.com
808/830 nm
Broad Area Laser Diode
Product Family
Sub-mount Options
C Mount Mechanical Drawing
Specification Sheet
Sub-mount Options
B Mount Mechanical Drawing
Mounting Block Notes:
1. B, C, and D mounts are manufactured of oxygen-free high conductivity (OFHC) Cu with diamond machined laser mounting surfaces.
2. Cu mounts have been plated with one micron of Au over a Ni flash.
3. All lasers are attached with a flux-less Indium solder process.
4. All wire bonds are 2 mil Au wires with current carrying capability of 3A per wire.
5. All units in inches.
Issue: 03/03 / V1 / HW / P:/www/pdf/axcel/8xx.pdf
Distributor:
LASER COMPONENTS GmbH, Werner-von-Siemens-Str. 15, D-82140 Olching
Phone:
++49 (0)8142 28640, Fax: ++49 (0)8142 286411, E-Mail: info@lasercomponents.com, Web: www.lasercomponents.com
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
