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CY7C1314BV18-300BZI

产品描述QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
产品类别存储    存储   
文件大小256KB,共25页
制造商Cypress(赛普拉斯)
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CY7C1314BV18-300BZI概述

QDR SRAM, 512KX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165

CY7C1314BV18-300BZI规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Cypress(赛普拉斯)
零件包装代码BGA
包装说明13 X 15 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-165
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间0.45 ns
其他特性PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)300 MHz
I/O 类型SEPARATE
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度18874368 bit
内存集成电路类型QDR SRAM
内存宽度36
湿度敏感等级3
功能数量1
端子数量165
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX36
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA165,11X15,40
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)220
电源1.5/1.8,1.8 V
认证状态Not Qualified
座面最大高度1.4 mm
最大待机电流0.485 A
最小待机电流1.7 V
最大压摆率1.58 mA
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度13 mm
Base Number Matches1

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PRELIMINARY
CY7C1310BV18
CY7C1312BV18
CY7C1314BV18
18-Mbit QDR-II™ SRAM 2-Word
Burst Architecture
Features
• Separate Independent Read and Write data ports
— Supports concurrent transactions
300-MHz clock for high bandwidth
2-Word Burst on all accesses
Double Data Rate (DDR) interfaces on both Read and
Write ports (data transferred at 600 MHz) @ 300 MHz
Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
Functional Description
The CY7C1310BV18, CY7C1910BV18, CY7C1312BV18, and
CY7C1314BV18 are 1.8V Synchronous Pipelined SRAMs,
equipped with QDR™-II architecture. QDR-II architecture
consists of two separate ports to access the memory array.
The Read port has dedicated Data Outputs to support Read
operations and the Write Port has dedicated Data Inputs to
support Write operations. QDR-II architecture has separate
data inputs and data outputs to completely eliminate the need
to “turn-around” the data bus required with common I/O
devices. Access to each port is accomplished through a
common address bus. The Read address is latched on the
rising edge of the K clock and the Write address is latched on
the rising edge of the K clock. Accesses to the QDR-II Read
and Write ports are completely independent of one another. In
order to maximize data throughput, both Read and Write ports
are equipped with Double Data Rate (DDR) interfaces. Each
address location is associated with two 8-bit words
(CY7C1310BV18) or 9-bit words (CY7C1910BV18) or 18-bit
words (CY7C1312BV18) or 36-bit words (CY7C1314BV18)
that burst sequentially into or out of the device. Since data can
be transferred into and out of the device on every rising edge
of both input clocks (K and K and C and C), memory bandwidth
is maximized while simplifying system design by eliminating
bus “turn-arounds.”
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C (or K or K in a single clock
domain) input clocks. Writes are conducted with on-chip
synchronous self-timed write circuitry.
• Two output clocks (C and C) accounts for clock skew
and flight time mismatching
• Echo clocks (CQ and CQ) simplify data capture in
high-speed systems
• Single multiplexed address input bus latches address
inputs for both Read and Write ports
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• Available in x8, x9, x18, and x36 configurations
• Full data coherency, providing most current data
• Core V
DD
= 1.8V (±0.1V); I/O V
DDQ
= 1.4V to V
DD
• 13 x 15 x 1.4 mm 1.0-mm pitch FBGA package, 165 ball
(11x15 matrix)
• Offered in both lead-free and non-lead free packages
• Variable drive HSTL output buffers
• JTAG 1149.1 compatible test access port
• Delay Lock Loop (DLL) for accurate data placement
Configurations
CY7C1310BV18 – 2M x 8
CY7C1910BV18 – 2M x 9
CY7C1312BV18 – 1M x 18
CY7C1314BV18 – 512K x 36
Cypress Semiconductor Corporation
Document #: 38-05619 Rev. *A
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised September 17, 2004

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