电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1N3828CUR-1TRE3

产品描述Zener Diode, 6.2V V(Z), 2%, 1.5W,
产品类别分立半导体    二极管   
文件大小236KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

1N3828CUR-1TRE3概述

Zener Diode, 6.2V V(Z), 2%, 1.5W,

1N3828CUR-1TRE3规格参数

参数名称属性值
是否Rohs认证符合
Reach Compliance Codecompli
ECCN代码EAR99
配置SINGLE
二极管类型ZENER DIODE
最大动态阻抗2 Ω
元件数量1
最高工作温度175 °C
最大功率耗散1.5 W
标称参考电压6.2 V
表面贴装YES
最大电压容差2%
工作测试电流41 mA
Base Number Matches1

文档预览

下载PDF文档
1N3821UR-1 thru 1N3830AUR-1, e3 or
MLL3821 thru MLL3830A, e3
SCOTTSDALE DIVISION
LEADLESS GLASS ZENER DIODES
DESCRIPTION
This surface mountable zener diode series is similar to the lower voltage
1N3821 thru 1N3830 JEDEC registration except it is in a surface mount
DO-213AB package outline. It is an ideal selection for applications of high
density and low parasitic requirements. Due to its glass hermetic qualities
and enhanced metallurgical bonded internal construction, it is also well
suited for high reliability applications. This can be acquired by a source
control drawing (SCD), or simply by ordering device types with a MQ, MX
or MV prefix for equivalent screening to JAN, JANTX or JANTXV
respectively.
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
FEATURES
Leadless package for surface mount equivalent to
1N3821 thru 1N3830A.
Ideal for high-density mounting
Lower voltage selections of 3.3 V to 7.5 V
Hermetically sealed, double-slug glass construction
Metallurgically enhanced contact construction
Options for screening in accordance with MIL-PRF-
19500/115 for JAN, JANTX, and JANTXV with MQ, MX
or MV prefixes respectively for part numbers, e.g.
MX1N3821AUR-1, MV1N3828AUR-1, etc.
Axial lead “thru-hole” DO-13 packages per JEDEC
registration available as 1N3821A thru 1N3830A (see
separate data sheet with MIL-PRF-19500/115
qualification)
RoHS Compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Leadless package for surface mounting
Tight voltage tolerances available
Ideal for high-density mounting
Metallurgically enhanced internal contact design
for greater reliability and lower thermal resistance
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard as described in
Microsemi MicroNote 050
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see derating
in Figure 1).
º
º
Operating and Storage temperature: -65 C to +175 C
Thermal Resistance: 40
º
C/W junction to end cap, or
120
º
C/W junction to ambient when mounted on FR4 PC
board (1 oz Cu) with recommended footprint (see last
page)
Steady-State Power: 1.50 watts at end-cap
temperature T
EC
< 115
o
C, or 1.25 watts at T
A
= 25
º
C
when mounted on FR4 PC board and recommended
footprint as described for thermal resistance (also see
Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
Solder Temperatures: 260
º
C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed glass MELF package
TERMINALS: Tin-Lead (SN/Pb) or RoHS
compliant annealed matte-Tin (Sn) plating
solderable per MIL-STD-750, method 2026
POLARITY: Cathode indicated by band. Diode
to be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-1-
A with 12 mm tape, 1500 per 7 inch reel or 5000
per 13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
1N3821UR-1 thru
1N3830AUR-1,e3 or
MLL3821 thru MLL3830A,e3
hru
Copyright
©
2006
3-12-2006 REV C
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
职场加薪的7大秘诀
公司规定”难道真是唯一的标准答案吗?   有一个趣的调查。875位接受调查的人力资源主管中,60%表示会在面谈时对薪水保留一些弹性,只有30%说绝对不能调整,其余10%要视对方的态度而定。 ......
daicheng 工作这点儿事
McBSP以DMA方式实现
目前想实现的功能是C28346和F28335之间通过McBSP以DMA的方式进行数据传输:C28346发送一个数组给F28335,F28335接收完成后,将数据发还给C28346.校验无误后执行全数组+1操作,然后重复发送。现 ......
feng_5_23 微控制器 MCU
我的开题报告被打回来了!!那位大大帮忙
无语了,老师说国内外综述 跟主要的技术方法都不行 一个太少了一个内容不对...
只为51 51单片机
请问DeviceIOControl 问题?
用MFC,把USB盘上的img文件写到Flash 上, Flash 也是用USB接口连接到PC 上。 1.请问从U盘上读时 ReadFile 前必须调用DeviceIOControl,写时WriteFile 都必须调用这个DeviceIOControl 吗? ......
stopliu 嵌入式系统
TL5708开发板IPC通信FFT数据的解读
# TL5708开发板IPC通信FFT数据的解读 **目录 (Table of Contents)** ## 一、实际设定的波形参数 给DSP核输入的信号是这样的:初始化时域数据,此处设置一个50Hz、100Hz、200Hz、500Hz的 ......
bqgup 创意市集
关于学习arm还是dsp 或者fpga
我现在大三,只了解过51,自学过430, 大四想学点别的,是学m3 还是dsp或者fpga ,求有经验者帮先忙给点意见。 ...
sunxg 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2449  1182  2572  92  839  42  29  25  43  36 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved