Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | State of the Art Inc |
| 包装说明 | SMT, 1206 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | RATED CURRENT: 3.2A |
| 构造 | Chip |
| JESD-609代码 | e4 |
| 安装特点 | SURFACE MOUNT |
| 端子数量 | 2 |
| 最高工作温度 | 150 °C |
| 最低工作温度 | -55 °C |
| 封装高度 | 0.46 mm |
| 封装长度 | 3.2 mm |
| 封装形状 | RECTANGULAR PACKAGE |
| 封装形式 | SMT |
| 封装宽度 | 1.55 mm |
| 包装方法 | TR, 8 INCH; WAFFLE PACK |
| 额定功率耗散 (P) | 0.25 W |
| 额定温度 | 70 °C |
| 参考标准 | MIL-PRF-32159 |
| 电阻 | |
| 电阻器类型 | FIXED RESISTOR |
| 尺寸代码 | 1206 |
| 表面贴装 | YES |
| 技术 | METAL GLAZE/THICK FILM |
| 端子面层 | Gold (Au) |
| 端子形状 | WRAPAROUND |
| Base Number Matches | 1 |
| M32159G07C | M32159C07T | M32159C07C | M32159B07M | M32159B07C | M32159C07M | M32159G07M | M32159G07T | M32159U07M | M32159U07T | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP | Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0ohm, Surface Mount, 1206, CHIP |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 不符合 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 不符合 |
| 厂商名称 | State of the Art Inc | State of the Art Inc | State of the Art Inc | State of the Art Inc | State of the Art Inc | State of the Art Inc | State of the Art Inc | State of the Art Inc | State of the Art Inc | State of the Art Inc |
| 包装说明 | SMT, 1206 | SMT, 1206 | SMT, 1206 | CHIP | SMT, 1206 | SMT, 1206 | SMT, 1206 | SMT, 1206 | SMT, 1206 | SMT, 1206 |
| Reach Compliance Code | compliant | compliant | compliant | not_compliant | _compli | compli | compli | compli | _compli | _compli |
| 其他特性 | RATED CURRENT: 3.2A | RATED CURRENT: 2.5A | RATED CURRENT: 2.5A | PACKAGING ALSO AVAILABLE IN WAFFLE PACK WITH 140 QUANTITY, RATED CURRENT: 3.2A | RATED CURRENT: 3.2A | RATED CURRENT: 2.5A | RATED CURRENT: 3.2A | RATED CURRENT: 3.2A | RATED CURRENT: 1.4A | RATED CURRENT: 1.4A |
| 构造 | Chip | Chip | Chip | Rectangular | Chi | Chi | Chi | Chi | Chi | Chi |
| JESD-609代码 | e4 | e4 | e4 | e0 | e0 | e4 | e4 | e4 | e4 | e4 |
| 安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT |
| 端子数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 最高工作温度 | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装高度 | 0.46 mm | 0.46 mm | 0.46 mm | 0.46 mm | 0.46 mm | 0.46 mm | 0.46 mm | 0.46 mm | 0.46 mm | 0.46 mm |
| 封装长度 | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm |
| 封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
| 封装形式 | SMT | SMT | SMT | SMT | SMT | SMT | SMT | SMT | SMT | SMT |
| 封装宽度 | 1.55 mm | 1.55 mm | 1.55 mm | 1.55 mm | 1.55 mm | 1.55 mm | 1.55 mm | 1.55 mm | 1.55 mm | 1.55 mm |
| 包装方法 | TR, 8 INCH; WAFFLE PACK | TR, 8 INCH; WAFFLE PACK | TR, 8 INCH; WAFFLE PACK | TR, 8 INCH | TR, 8 INCH; WAFFLE PACK | TR, 8 INCH; WAFFLE PACK | TR, 8 INCH; WAFFLE PACK | TR, 8 INCH; WAFFLE PACK | TR, 8 INCH; WAFFLE PACK | TR, 8 INCH; WAFFLE PACK |
| 额定功率耗散 (P) | 0.25 W | 0.25 W | 0.25 W | 0.25 W | 0.25 W | 0.25 W | 0.25 W | 0.25 W | 0.25 W | 0.25 W |
| 额定温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 参考标准 | MIL-PRF-32159 | MIL-PRF-32159 | MIL-PRF-32159 | MIL-PRF-32159 | MIL-PRF-32159 | MIL-PRF-32159 | MIL-PRF-32159 | MIL-PRF-32159 | MIL-PRF-32159 | MIL-PRF-32159 |
| 电阻器类型 | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR | FIXED RESISTOR |
| 尺寸代码 | 1206 | 1206 | 1206 | 1206 | 1206 | 1206 | 1206 | 1206 | 1206 | 1206 |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM | METAL GLAZE/THICK FILM |
| 端子面层 | Gold (Au) | Palladium/Silver (Pd/Ag) | Palladium/Silver (Pd/Ag) | Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrier | Tin/Lead (Sn60Pb40) - with Nickel (Ni) barrie | Palladium/Silver (Pd/Ag) | Gold (Au) | Gold (Au) | Platinum/Gold (Pt/Au) | Platinum/Gold (Pt/Au) |
| 端子形状 | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND | WRAPAROUND |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
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