Si3217x-C
P
RO
SLIC
®
S
IN GLE
- C
HIP
F X S S
OLUTION
Si3217x-C Features
Complete FXS solution in 5 x 7 mm
Performs all BORSCHT functions
Ideal for short to medium loops
Global programmability
Internal balanced or unbalanced
ringing
Patented low power ringing
Simplified configuration and
diagnostics
Supported by ProSLIC API
Ultra low power consumption
Integrated tracking dc-dc controller
with direct connection to MOSFET
Wideband voice support
(Si32174/6/7)
On-hook transmission
Loop or ground start operation
Smooth polarity reversal
PCM and SPI bus digital interfaces
with programmable interrupts
A-Law/µ-Law companding,
linear PCM
Software-programmable
parameters:
frequency, amplitude,
cadence, and waveshape
Two-wire ac impedance
Transhybrid balance
DC current loop feed (10-45 mA)
Loop closure and ring trip
thresholds
Ground key detect threshold
Ringing
Ordering Information
See page 39.
GCI/IOM-2 mode support
DTMF generation
DTMF detection (Si32170/1/4)
Pulse metering (Si32170/1)
3.3 V operation
Support for 1.8 V I/O
Maximum battery up to –140 V
Pb-free/RoHS-compliant
packaging
Pin Assignments
Si3217x-C
HVPAD
RING
VBAT
35
34
TIP
NC
NC
NC
VDDIO
SDI
SDO
SCLK
SDITHRU
CS
FSYNC
PCLK
INT
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
42 41 40 39 38 37 36
NC
GPIO1/STIPC
GPIO2/SRINGC
SRINGDC
SRINGAC
STIPAC
STIPDC
VDD
QGND
IREF
CAPM
CAPP
CAPLB
SVBAT
HVPAD
33
32
31
30
29
28
GNDPAD
27
26
25
24
23
Applications
Customer Premise Equipment
(CPE)
VoIP DSL Gateways and Routers
Wireless Local Loop (WLL)
DTX
DRX
Integrated Access Devices (IAD)
Analog Terminal Adapters (ATA)
Small Office/Home Office PBX
DCFF
15 16 17 18 19 20 21
SDCH
VDDREG
SDCL
DCDRV
VDD
RST
SVDC
22
Patents pending
Description
T
he Si3217x-C devices are pin-compatible single-channel ProSLIC products that
implement a complete foreign exchange station (FXS) telephony interface solution in
accordance with all relevant LSSGR, ITU, and ETSI specifications. The Si3217x-C
ProSLIC ICs operate from a 3.3 V supply and interface to standard PCM/SPI digital
interfaces with 3.3 V or 1.8 V I/O. The Si3217x integrated dc-dc controller
automatically generates the optimal battery voltages required for each linestate.
Si3217x-C ICs are available with voltage ratings of –110 V or –140 V to support a
wide range of ringing voltages. See the Ordering Guide for the voltage rating of each
Si3217x-C version. The Si3217x devices are available in a 5x7 mm 42-pin QFN
package. Refer to the Si3217x-Si3291x data sheet for information on revision B
Si3217x devices, including the Si32178/9 and Si32911/9 devices for FXS with FXO
functionality.
Rev. 1.1 11/13
Copyright © 2013 by Silicon Laboratories
Si3217x-C
Si3217x-C
Functional Block Diagram
ADC
ADC
DAC
DAC
Linefeed
DRX
DTX
CS
SDI
SDO
SCLK
IN T
RST
DTM F &
Tone G en
C a lle r ID
Programmable
Programmable
AC Impedance
AC Impedance
and Hybrid
FSYNC
PCM/
GCI
In te r fa c e
SPI
C o n tr o l
In te rfa c e
CODEC
S L IC
L in e fe e d
C o n tro l
L in e fe e d
M o n ito r
T IP
FXS
R IN G
R in g in g
G e n e ra to r
DSP
L in e D ia g n o s tic s
PLL
D C -D C C o n tr o lle rr
D C -D C C o n tro lle
PCLK
S i3 2 1 7 x -C
2
Rev. 1.1
Si3217x-C
T
ABLE O F
C
ONTENTS
Section
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Schematics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
5. FXS Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
5.1. DC Feed Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.2. Linefeed Operating States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
5.3. Line Voltage and Current Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
6. Power Monitoring and Power Fault Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.1. Thermal Overload Shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
6.2. Loop Closure Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.3. Ground Key Detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.4. Ringing Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.5. Polarity Reversal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.6. Two-Wire Impedance Synthesis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.7. Transhybrid Balance Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.8. Tone Generators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
6.9. DTMF Detection (Si32170/1/4 Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.10. Pulse Metering (Si32170/1 Only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
6.11. DC-DC Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.12. Wideband Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
6.13. In-Circuit and Metallic Loop Testing (MLT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
7. System Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
7.1. SPI Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
7.2. PCM Interface and Companding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
7.3. Input/Output Voltage Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
8. Pin Descriptions: Si3217x-C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
9. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
10. Product Identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
11. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
11.1. 42-Pin QFN/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
12. PCB Land Pattern Si3217x QFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
12.1. QFN PCB Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
12.2. QFN Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
12.3. QFN Stencil Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
12.4. QFN Card Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
13. Top Markings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
13.1. Si3217x-C Package Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
13.2. Si3217x-C LGA Package Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . 45
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Rev. 1.1
3
Si3217x-C
1. Electrical Specifications
Table 1. Recommended Operating Conditions
1
Parameter
Ambient Temperature
Silicon Junction Temperature,
QFN-42
Supply Voltage, Si3217x-C
Battery Voltage, Si32171/4/6
2
Battery Voltage, Si32170/7
2
IO Supply Voltage, Si3217x-C
Symbol
T
A
T
JHV
V
DD
V
BAT
V
BAT
V
DDIO
Test Condition
F-grade
G-grade
Linefeed Die
Min*
0
–40
—
3.13
–110
–140
1.71
Typ
25
25
—
3.3
–95
–130
—
Max*
70
85
145
3.47
–15
–15
3.47
Unit
°C
°C
°C
V
V
V
V
Notes:
1.
All minimum and maximum specifications apply across the recommended operating conditions. Typical values apply at
nominal supply voltages and an operating temperature of 25
°
C unless otherwise stated.
2.
Operation at minimum voltage dependent upon loop conditions and dc-dc converter configuration.
4
Rev. 1.1
Si3217x-C
Table 2. Power Supply Characteristics for Si3217x-C
Parameter
Supply Currents:
Reset
Supply Currents:
High Impedance,
Open
Supply Currents:
Forward/Reverse,
On-hook
Supply Currents:
Forward/Reverse,
On-hook
Supply Currents:
Tip/Ring Open,
Symbol
I
DD
I
VBAT
I
DD
I
VBAT
I
DD
I
VBAT
I
DD
I
VBAT
I
DD
I
VBAT
I
DD
V
TR
= –48 V,
Automatic Power Save Mode Enabled
V
TR
= –48 V,
Automatic Power Save Mode Disabled
V
T
or V
R
= –48 V
V
R
or V
T
= Hi-Z,
Automatic Power Save Mode Enabled
V
T
or V
R
= –48 V
V
R
or V
T
= Hi-Z,
Automatic Power Save Mode Disabled
V
TR
=48 V
V
T
and V
R
= Hi-Z
Test Condition
V
T
and V
R
= Hi-Z , RST = 0
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
I
LOOP
= 20 mA, R
LOAD
= 200
—
—
V
TR
= 55 V
RMS
+ 0 V
DC
,
balanced, sinusoidal, f = 20 Hz
R
LOAD
= 5 REN = 1400
—
—
Typ
6.3
0
20.8
0.6
10.8
0.6
31.2
2.1
10.9
0.4
30.6
1.3
43.8
2.9
44.6
21.3
35.8
37.5
Max
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Unit
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
On‐hook
Supply Currents:
Tip/Ring Open,
On-hook
Supply Currents:
Forward/Reverse OHT,
On-hook
Supply Currents:
Forward/Reverse Active,
Off-hook
Supply Currents:
Ringing
I
VBAT
I
DD
I
VBAT
I
DD
I
VBAT
I
DD
I
VBAT
Notes:
1.
All specifications are for a single channel of Si3217x with a tracking flyback dc-dc converter
2.
I
DD
includes I
DDIO
.
Rev. 1.1
5
FPGA/CPLD
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