3. Surface−mounted onto min pad FR4 PCB, (2 oz. Cu, 0.06″ thick).
Symbol
R
qJA
R
qJA
R
qJT
Value
114
72
14
Unit
°C/W
ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted)
Parameter
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
(Note 4)
Zero Gate Voltage Drain Current
V
(BR)DSS
V
GS
= 0 V, I
D
= 10 mA
T
J
= 25°C
T
J
= 150°C
T
J
= 25°C
T
J
= 150°C
42
40
46
45
0.25
1.1
50
55
55
4.0
20
100
mA
V
−mV/°C
mW
mA
V
Symbol
Test Condition
Min
Typ
Max
Unit
I
DSS
V
GS
= 0 V, V
DS
= 32 V
Gate Input Current
ON CHARACTERISTICS
(Note 4)
Gate Threshold Voltage
Gate Threshold Temperature Coefficient
Static Drain−to−Source On−Resistance
I
GSSF
V
GS(th)
V
GS(th)
/T
J
R
DS(on)
V
DS
= 0 V, V
GS
= 5.0 V
V
GS
= V
DS
, I
D
= 150
mA
T
J
= 25°C
T
J
= 150°C
T
J
= 25°C
T
J
= 150°C
T
J
= 25°C
T
J
= 150°C
1.3
1.8
4.0
165
305
195
360
190
350
1.0
2.2
6.0
200
400
230
460
230
460
V
GS
= 10 V, I
D
= 1.7 A
V
GS
= 5.0 V, I
D
= 1.7 A
V
GS
= 5.0 V, I
D
= 0.5 A
Source−Drain Forward On Voltage
SWITCHING CHARACTERISTICS
Turn−on Time
Turn−off Time
Slew Rate On
Slew−Rate Off
t
d(on)
t
d(off)
dV
DS
/dt
on
dV
DS
/dt
off
V
SD
V
GS
= 0 V, I
S
= 7.0 A
V
GS
= 10 V, V
DD
= 12 V,
I
D
= 2.5 A, R
L
= 4.7
W,
(10% V
in
to 90% I
D
)
R
L
= 4.7
W,
V
in
= 0 to 10 V,
V
DD
= 12 V, 70% to 50%
R
L
= 4.7
W,
V
in
= 0 to 10 V,
V
DD
= 12 V, 50% to 70%
V
ms
20
65
1.2
0.5
30
100
V/ms
SELF PROTECTION CHARACTERISTICS
(T
J
= 25°C unless otherwise noted) (Note 5)
Current Limit
I
LIM
V
DS
= 10 V, V
GS
= 5.0 V
T
J
= 25°C
T
J
= 150°C
T
J
= 25°C
T
J
= 150°C
3.1
2.0
3.8
2.8
150
135
150
135
4.7
3.2
5.7
4.3
175
160
165
150
6.3
4.3
7.6
5.7
200
185
185
170
°C
A
V
DS
= 10 V, V
GS
= 10 V
Temperature Limit (Turn−off)
Temperature Limit (Circuit Reset)
Temperature Limit (Turn−off)
Temperature Limit (Circuit Reset)
T
LIM(off)
T
LIM(on)
T
LIM(off)
T
LIM(on)
V
GS
= 5.0 V
V
GS
= 5.0 V
V
GS
= 10 V
V
GS
= 10 V
ESD ELECTRICAL CHARACTERISTICS
(T
J
= 25°C unless otherwise noted)
Electro−Static Discharge Capability
ESD
Human Body Model (HBM)
Machine Model (MM)
4. Pulse Test: Pulse Width
≤
300
ms,
Duty Cycle
≤
2%.
5. Fault conditions are viewed as beyond the normal operating range of the part.
4000
400
V
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2
NIF5002N
TYPICAL PERFORMANCE CURVES
7
I
D,
DRAIN CURRENT (AMPS)
6
5
4
3
2
1
0
0
1
2
10 V
9V
8V
7V
6V
5V
4V
3.8 V
3.6 V
3.4 V
3.2 V
3.0 V
2.8 V
2.6 V
3
4
T
J
= 25°C
I
D,
DRAIN CURRENT (AMPS)
4
V
DS
≥
10 V
3
2
100°C
1
25°C
T
J
= −55°C
1
2
3
1.5
3.5
2.5
V
GS
, GATE−TO−SOURCE VOLTAGE (VOLTS)
4
0
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 1. On−Region Characteristics
R
DS(on),
DRAIN−TO−SOURCE RESISTANCE (W)
R
DS(on),
DRAIN−TO−SOURCE RESISTANCE (W)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
2
5
4
6
7
8
9
V
GS
, GATE−TO−SOURCE VOLTAGE (VOLTS)
3
10
I
D
= 1.7 A
T
J
= 25°C
0.3
Figure 2. Transfer Characteristics
T
J
= 25°C
0.25
V
GS
= 5 V
0.2
0.15
V
GS
= 10 V
0.1
0.05
0
2
3
4
5
I
D,
DRAIN CURRENT (AMPS)
Figure 3. On−Resistance vs. Gate−to−Source
Voltage
2.5
R
DS(on),
DRAIN−TO−SOURCE
RESISTANCE (NORMALIZED)
I
D
= 1.7 A
V
GS
= 5 V
2
I
DSS
, LEAKAGE (nA)
1000
10000
Figure 4. On−Resistance vs. Drain Current and
Gate Voltage
V
GS
= 0 V
T
J
= 150°C
1.5
100
T
J
= 100°C
10
1
0.5
0
−50
1
10
−25
0
25
50
75
100
125
150
20
30
40
T
J
, JUNCTION TEMPERATURE (°C)
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 5. On−Resistance Variation with
Temperature
Figure 6. Drain−to−Source Leakage Current
vs. Voltage
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3
NIF5002N
TYPICAL PERFORMANCE CURVES
10
I
S
, SOURCE CURRENT (AMPS)
I
D
, DRAIN CURRENT (AMPS)
V
GS
= 0 V
T
J
= 25°C
1
10
V
GS
= 20 V
SINGLE PULSE
T
C
= 25°C
1 ms
10 ms
1.0
0.1
0.1
R
DS(on)
LIMIT
THERMAL LIMIT
PACKAGE LIMIT
1.0
10
dc
0.01
0.4
0.5
0.6
0.7
0.8
0.9
1
0.01
0.1
100
V
SD
, SOURCE−TO−DRAIN VOLTAGE (VOLTS)
V
DS
, DRAIN−TO−SOURCE VOLTAGE (VOLTS)
Figure 7. Diode Forward Voltage vs. Current
Figure 8. Maximum Rated Forward Biased
Safe Operating Area
1.0
r(t), NORMALIZED EFFECTIVE
TRANSIENT THERMAL RESISTANCE
D = 0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
1.0E−02
1.0E−01
1.0E+00
t, TIME (s)
1.0E+01
1.0E+02
1.0E+03
0.1
0.01
1.0E−03
Figure 9. Thermal Response
ORDERING INFORMATION
Device
NIF5002NT1
NIF5002NT1G
NIF5002NT3
NIF5002NT3G
Package
SOT−223
SOT−223
(Pb−Free)
SOT−223
SOT−223
(Pb−Free)
Shipping
†
1000 / Tape & Reel
1000 / Tape & Reel
4000 / Tape & Reel
4000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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4
NIF5002N
PACKAGE DIMENSIONS
SOT−223 (TO−261)
CASE 318E−04
ISSUE L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
A1
b
b1
c
D
E
e
e1
L1
H
E
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
1.50
6.70
0°
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
1.75
2.00
7.00
7.30
10°
−
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.060
0.264
0°
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
0.069
0.276
−
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
0.078
0.287
10°
D
b1
4
H
E
1
2
3
E
b
e1
e
q
C
q
A
0.08 (0003)
A1
L1
STYLE 3:
PIN 1.
2.
3.
4.
GATE
DRAIN
SOURCE
DRAIN
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
mm
inches
SCALE 6:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
HDPlus is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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