Fast Page DRAM Module, 8MX32, 50ns, CMOS, SIMM-72
| 参数名称 | 属性值 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | SIMM |
| 包装说明 | SIMM, SSIM72 |
| 针数 | 72 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE |
| 最长访问时间 | 50 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-XSMA-N72 |
| 内存密度 | 268435456 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 72 |
| 字数 | 8388608 words |
| 字数代码 | 8000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8MX32 |
| 输出特性 | 3-STATE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | SIMM |
| 封装等效代码 | SSIM72 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 刷新周期 | 2048 |
| 自我刷新 | NO |
| 最大待机电流 | 0.016 A |
| 最大压摆率 | 0.896 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | SINGLE |
| Base Number Matches | 1 |
| M53210810DB0-C50 | M53210810DB0-C60 | M53210810DW0-C50 | M53210800DB0-C60 | M53210800DB0-C50 | M53210800DW0-C50 | M53210800DW0-C60 | M53210810DW0-C60 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Fast Page DRAM Module, 8MX32, 50ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 50ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 50ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 50ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SIMM-72 | Fast Page DRAM Module, 8MX32, 60ns, CMOS, SIMM-72 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 零件包装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
| 包装说明 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 | SIMM, SSIM72 |
| 针数 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 50 ns | 60 ns | 50 ns | 60 ns | 50 ns | 50 ns | 60 ns | 60 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 |
| 内存密度 | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit |
| 内存集成电路类型 | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE | FAST PAGE DRAM MODULE |
| 内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
| 字数 | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words | 8388608 words |
| 字数代码 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 | 8000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 | 8MX32 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM | SIMM |
| 封装等效代码 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 | SSIM72 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 2048 | 2048 | 2048 | 4096 | 4096 | 4096 | 4096 | 2048 |
| 自我刷新 | NO | NO | NO | NO | NO | NO | NO | NO |
| 最大待机电流 | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A | 0.016 A |
| 最大压摆率 | 0.896 mA | 0.816 mA | 0.896 mA | 0.656 mA | 0.736 mA | 0.736 mA | 0.656 mA | 0.816 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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