MICRO SFP+
CONNECTOR &
CABLE ASSEMBLY
micro SFP+ Connector and Cable Assembly
TE Connectivity’s (TE) micro SFP+ connector and cable assembly empower you to dream big when
designing your communication system. Through a footprint that’s up to 50% smaller than current SFP+
interconnects, the micro SFP+ interconnects allow you to increase faceplate density while freeing up ad-
ditional PCB space due to the board connector’s shortened length. The products’ designs have also been
enhanced to improve signal routing, minimize EMI and optimize automated manufacturing processes.
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Increases Faceplate Density / Saves PCB Space:
micro SFP+ is up to 50% smaller than current SFP+
connectors, in width and length, taking up as little as 15mm board space. One micro SFP+ frees up
19% more faceplate space than 1 SFP+ connector.
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Improves Signal Integrity:
The cable assembly and connector were designed with a staggered
contact configuration that improves signal routing. Additionally, the bottom and top contacts have
been further optimized for speed.
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Reduces EMI:
EMI is minimized through a die cast housing, cable shield crimped at 360 degrees, and
an extended EMI shield over the cable’s plug.
Optimizes Manufacturing Processes:
For manufacturing automation, the board interconnect
combines the connector & cage into one finished product for automated of board placement. High
temperature pin in paste soldering can be achieved as the product withstands up to 265 degrees
Celsius.
DATA COMMUNICATIONS
/// MICRO SFP+ CONNECTOR AND CABLE ASSEMBLY
Applications
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Telecommunications: Cellular infrastructure, hubs servers and switches
Data communication: servers and storage equipment
Medical diagnostic equipment
Networking: Network interface, storage, power supplies and test and measurement equipment
Specifications / Protocols
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Electrically compliant to SFF-8431
10 Gigabit Ethernet and Gigabit Ethernet (IEEE802.3ae)
Fibre channel: 1, 2, 4 and 8 GFC
InfiniBand standard (10Gbps)
Fibre Channel over Ethernet (FCoE)
Serial data transmission
Parts Reference Guide
Minimum
Part
2142969
2142970
Configuration
micro SFP+ to micro
SFP+
micro SFP+ to SFP+
Data Rate
10 Gbps
10 Gbps
Maximum
AWG Cable Length Cable Length Equalization
26
26
0.5m
0.5m
6.0m
6.0m
unEQ
unEQ
Connector
EMI Spring
Part Number
2246040-1
2246041-1
Configuration
micro SFP
micro SFP+
Finger Design
Yes
Yes
Solder Tail
Yes
Yes
Lightpipe
No
No
DATA COMMUNICATIONS
/// MICRO SFP+ CONNECTOR AND CABLE ASSEMBLY
PAGE 2
Faceplate Space Savings
Achieve more speed in the same space.
Figure to the left shows four SFP+
connectors can be replaced with five micro
SFP+ assemblies.
PCB Space Savings
The micro SFP+ is a little more than half
the size of traditional SFP+ connectors.
See figure on the right.
Smaller Connector + Smaller Cable Assembly
Overall footprint is up to 50% smaller than current SFP+ products
PAGE 3
Micro SFP+ Board Connector
Electrical
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Board connector uses approximately 50% less PCB space
Connector height fits 15 mm board spacing practice
Mechanical
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Retention force: 90N maximum
Durability: 100 cycles minimum
Latch: Retractable pin
Features
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Speed:
22 position connector
supporting data rates up to 10
Gbps
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Increased Faceplate Density /
Saves PCB Space:
•
Board connector saves ap-
proximately 50% more PCB
space
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Connector height fits 15 mm
board spacing practice
Improved Signal Integrity:
Con-
nector designed with staggered
contact configuration for im-
proved signal routing
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Supports Manufacturing
Automation
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Integrated connector and
cage design for one-step
placement on to PCB
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Connector withstands up to
265 degrees Celsius for high
temperature pin in paste
soldering
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Cage features solder tail
design
EMI Reduction:
Cage designed
with EMI metal springs
Compliant pin version optional
Material
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Cage design with EMI metal spring fingers
Cage features a solder tail design
DATA COMMUNICATIONS
/// MICRO SFP+ CONNECTOR AND CABLE ASSEMBLY
PAGE 4
Micro SFP+ Cable Assembly
Electrical
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UL rated 80°C: AWM Style 20626 80°C 30V VW-1
Differential impedance: 100 ± 5 Ohms @ TDR
Mutual capacitance: 14 pF/ft nominal
Time delay: 1.35 ns/ft nominal
Time delay skew (within pair): 70 ps/8.5 m maximum
Time delay skew (between pair): 350 ps/8.5 m maximum
Attenuation (SDD21)2: 10 dB/8.5 m maximum @ 1.25 GHz
Conductor DC Resistance: 0.040 Ohms/ft nominal @ 20°C
Tested / functional to 10 GHz
Mechanical
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Operating temperature: 0 to +70 degrees Celsius
Storage temperature: -40 to +80 degrees Celsius
Bend radius: 3x outer diameter static / 5x outer diam-
eter dynamic
Cable outer diameter: 26 AWG = 0.205 inches
Features
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Speed:
Designed with Madison Cable
brand TurboTwin parallel pair cable,
the cable assembly supports data
rates up to 10 Gbps; the cable assem-
bly is direct attach for short reach
applications
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Improved Signal Integrity:
Staggered
contact configuration for improved
signal routing
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EMI Reduction:
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Cable features a 360 degree
braid crimp to minimize EMI
Extended EMI shield over the
cable’s connector further reduces
EMI
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Flexibility:
Available in wire size AWG
26; other sizes available on request
Ease of Use:
Quick-release cable
latching system
Material
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Inner shield: Aluminum / poly tape
Outer shield: Tin plated copper braid
Jacket material: Low Smoke Zero Halogen (LSZH)
Safety: UL recognized, CSA certified, RoHS compliant
amd REACH 2010 compliant
Interface: PCB paddle card
Contact material: 30
μ
Gold plated contact pads
Backshell material: Tin plated Zinc die cast
EMI spring: Tin plated copper alloy
Latch release: Molded thermoplastic pull tab
DATA COMMUNICATIONS
/// MICRO SFP+ CONNECTOR AND CABLE ASSEMBLY
PAGE 5
PCB设计
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