Decoder/Driver, CMOS, CDIP24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Solid State Scientific Inc |
| 包装说明 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-XDIP-T24 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 883/4514BC | 883/4514BF | SCL4515BE | SCL4515BE++ | SCL4514BE | SCL4514BE+ | 883/4515BF | SCL4515BC | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Decoder/Driver, CMOS, CDIP24 | Decoder/Driver, CMOS, CDFP24 | Decoder/Driver, CMOS, PDIP24 | Decoder/Driver, CMOS, PDIP24 | Decoder/Driver, CMOS, PDIP24 | Decoder/Driver, CMOS, PDIP24 | Decoder/Driver, CMOS, CDFP24 | Decoder/Driver, CMOS, CDIP24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc | Solid State Scientific Inc |
| 包装说明 | DIP, DIP24,.6 | DFP, FL24,.4 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DIP, DIP24,.6 | DFP, FL24,.4 | DIP, DIP24,.6 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| JESD-30 代码 | R-XDIP-T24 | R-XDFP-F24 | - | - | R-PDIP-T24 | R-PDIP-T24 | R-XDFP-F24 | R-XDIP-T24 |
| JESD-609代码 | e0 | e0 | - | - | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | - | - | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER |
| 功能数量 | 1 | 1 | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | - | - | 24 | 24 | 24 | 24 |
| 最高工作温度 | 125 °C | 125 °C | - | - | 85 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | - | -40 °C | -40 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
| 封装代码 | DIP | DFP | - | - | DIP | DIP | DFP | DIP |
| 封装等效代码 | DIP24,.6 | FL24,.4 | - | - | DIP24,.6 | DIP24,.6 | FL24,.4 | DIP24,.6 |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | - | - | IN-LINE | IN-LINE | FLATPACK | IN-LINE |
| 电源 | 5/15 V | 5/15 V | - | - | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | - | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | - | - | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | - | - | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | FLAT | - | - | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | - | - | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | - | DUAL | DUAL | DUAL | DUAL |
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