Ceramic Capacitor, Multilayer, Ceramic, 1000V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.21uF, Surface Mount, DIP-8
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | AVX |
包装说明 | , |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
电容 | 0.21 µF |
电容器类型 | CERAMIC CAPACITOR |
介电材料 | CERAMIC |
JESD-609代码 | e0 |
安装特点 | SURFACE MOUNT |
多层 | Yes |
负容差 | 20% |
端子数量 | 2 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装形状 | RECTANGULAR PACKAGE |
正容差 | 20% |
额定(直流)电压(URdc) | 1000 V |
表面贴装 | YES |
温度特性代码 | C0G |
温度系数 | -/+30ppm/Cel ppm/°C |
端子面层 | Tin/Lead (Sn/Pb) |
端子形状 | J BEND |
Base Number Matches | 1 |
HV03AA214MAJ650 | HV03HC214MAJ360 | HV03HC214MAL360 | HV03AA214MAL650 | HV04GC214MAL650 | HV04GC214MAJ650 | HV03HC214MAN360 | HV03AA214MAN650 | HV04GC214MAN650 | |
---|---|---|---|---|---|---|---|---|---|
描述 | Ceramic Capacitor, Multilayer, Ceramic, 1000V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.21uF, Surface Mount, DIP-8 | Ceramic Capacitor, Multilayer, Ceramic, 3000V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.21uF, Surface Mount, DIP-8 | Ceramic Capacitor, Multilayer, Ceramic, 3000V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.21uF, Surface Mount, DIP-8 | Ceramic Capacitor, Multilayer, Ceramic, 1000V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.21uF, Surface Mount, DIP-8 | Ceramic Capacitor, Multilayer, Ceramic, 2000V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.21uF, Surface Mount, DIP-8 | Ceramic Capacitor, Multilayer, Ceramic, 2000V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.21uF, Surface Mount, DIP-8 | Ceramic Capacitor, Multilayer, Ceramic, 3000V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.21uF, Through Hole Mount, DIP-8 | Ceramic Capacitor, Multilayer, Ceramic, 1000V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.21uF, Through Hole Mount, DIP-8 | Ceramic Capacitor, Multilayer, Ceramic, 2000V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.21uF, Through Hole Mount, DIP-8 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | AVX | AVX | AVX | AVX | AVX | AVX | AVX | AVX | AVX |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
电容 | 0.21 µF | 0.21 µF | 0.21 µF | 0.21 µF | 0.21 µF | 0.21 µF | 0.21 µF | 0.21 µF | 0.21 µF |
电容器类型 | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR | CERAMIC CAPACITOR |
介电材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
安装特点 | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | SURFACE MOUNT | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT | THROUGH HOLE MOUNT |
多层 | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
负容差 | 20% | 20% | 20% | 20% | 20% | 20% | 20% | 20% | 20% |
端子数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装形状 | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE | RECTANGULAR PACKAGE |
正容差 | 20% | 20% | 20% | 20% | 20% | 20% | 20% | 20% | 20% |
额定(直流)电压(URdc) | 1000 V | 3000 V | 3000 V | 1000 V | 2000 V | 2000 V | 3000 V | 1000 V | 2000 V |
表面贴装 | YES | YES | YES | YES | YES | YES | NO | NO | NO |
温度特性代码 | C0G | X7R | X7R | C0G | X7R | X7R | X7R | C0G | X7R |
温度系数 | -/+30ppm/Cel ppm/°C | 15% ppm/°C | 15% ppm/°C | -/+30ppm/Cel ppm/°C | 15% ppm/°C | 15% ppm/°C | 15% ppm/°C | -/+30ppm/Cel ppm/°C | 15% ppm/°C |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形状 | J BEND | J BEND | GULL WING | GULL WING | GULL WING | J BEND | FLAT | FLAT | FLAT |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved