Triple 4-3-3-Input Bus Driver
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ON Semiconductor(安森美) |
| 零件包装代码 | DIP |
| 包装说明 | DIP-16 |
| 针数 | 16 |
| Reach Compliance Code | _compli |
| 其他特性 | WITH 4-3-3 INPUT NOR FUNCTIONS |
| 系列 | 10K |
| JESD-30 代码 | R-GDIP-T16 |
| JESD-609代码 | e0 |
| 长度 | 19.495 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 1 |
| 功能数量 | 3 |
| 端口数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -30 °C |
| 输出特性 | OPEN-EMITTER WITH CUT-OFF |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | -5.2 V |
| 传播延迟（tpd） | 4.4 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 表面贴装 | NO |
| 技术 | ECL |
| 温度等级 | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| MC10123L | MC10123 | MC10123P | MC10123_02 | MC10123FN | |
|---|---|---|---|---|---|
| 描述 | Triple 4-3-3-Input Bus Driver | Triple 4-3-3-Input Bus Driver | Triple 4-3-3-Input Bus Driver | Triple 4-3-3-Input Bus Driver | Triple 4-3-3-Input Bus Driver |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 |
| 厂商名称 | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) | - | ON Semiconductor(安森美) |
| 零件包装代码 | DIP | - | DIP | - | QLCC |
| 包装说明 | DIP-16 | - | DIP-16 | - | LCC-20 |
| 针数 | 16 | - | 16 | - | 20 |
| Reach Compliance Code | _compli | - | _compli | - | not_compliant |
| 其他特性 | WITH 4-3-3 INPUT NOR FUNCTIONS | - | WITH 4-3-3 INPUT NOR FUNCTIONS | - | WITH 4-3-3 INPUT NOR FUNCTIONS |
| 系列 | 10K | - | 10K | - | 10K |
| JESD-30 代码 | R-GDIP-T16 | - | R-PDIP-T16 | - | S-PQCC-J20 |
| JESD-609代码 | e0 | - | e0 | - | e0 |
| 长度 | 19.495 mm | - | 19.175 mm | - | 8.965 mm |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | - | BUS DRIVER |
| 位数 | 1 | - | 1 | - | 1 |
| 功能数量 | 3 | - | 3 | - | 3 |
| 端口数量 | 2 | - | 2 | - | 2 |
| 端子数量 | 16 | - | 16 | - | 20 |
| 最高工作温度 | 85 °C | - | 85 °C | - | 85 °C |
| 最低工作温度 | -30 °C | - | -30 °C | - | -30 °C |
| 输出特性 | OPEN-EMITTER WITH CUT-OFF | - | OPEN-EMITTER WITH CUT-OFF | - | OPEN-EMITTER WITH CUT-OFF |
| 输出极性 | TRUE | - | TRUE | - | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | - | QCCJ |
| 封装等效代码 | DIP16,.3 | - | DIP16,.3 | - | LDCC20,.4SQ |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | SQUARE |
| 封装形式 | IN-LINE | - | IN-LINE | - | CHIP CARRIER |
| 电源 | -5.2 V | - | -5.2 V | - | -5.2 V |
| 传播延迟（tpd） | 4.4 ns | - | 4.4 ns | - | 4.4 ns |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified |
| 座面最大高度 | 5.08 mm | - | 4.44 mm | - | 4.57 mm |
| 表面贴装 | NO | - | NO | - | YES |
| 技术 | ECL | - | ECL | - | ECL |
| 温度等级 | OTHER | - | OTHER | - | OTHER |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn80Pb20) | - | Tin/Lead (Sn80Pb20) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | - | J BEND |
| 端子节距 | 2.54 mm | - | 2.54 mm | - | 1.27 mm |
| 端子位置 | DUAL | - | DUAL | - | QUAD |
| 宽度 | 7.62 mm | - | 7.62 mm | - | 8.965 mm |
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