Analog Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS
| LVXT4051 | MC74LVXT4051 | MC74LVXT4051_05 | MC74LVXT4051MG | MC74LVXT4051MEL | MC74LVXT4051DTR2 | MC74LVXT4051M | |
|---|---|---|---|---|---|---|---|
| 描述 | Analog Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS | Analog Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS | Analog Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS | Analog Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS | Analog Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS | Analog Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS | Analog Multiplexer/Demultiplexer High−Performance Silicon−Gate CMOS |
| 是否Rohs认证 | - | - | - | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | - | - | - | SOIC | SOIC | TSSOP | SOIC |
| 包装说明 | - | - | - | SOP, SOP16,.3 | SOP, SOP16,.3 | TSSOP, TSSOP16,.25 | SOP, SOP16,.3 |
| 针数 | - | - | - | 16 | 16 | 16 | 16 |
| Reach Compliance Code | - | - | - | unknow | unknow | unknow | unknow |
| 模拟集成电路 - 其他类型 | - | - | - | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 代码 | - | - | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
| JESD-609代码 | - | - | - | e4 | e4 | e4 | e4 |
| 长度 | - | - | - | 10.2 mm | 10.2 mm | 5 mm | 10.2 mm |
| 负电源电压最大值（Vsup） | - | - | - | -6 V | -6 V | -6 V | -6 V |
| 标称负供电电压 (Vsup) | - | - | - | -3 V | -3 V | -3 V | -3 V |
| 信道数量 | - | - | - | 8 | 8 | 8 | 8 |
| 功能数量 | - | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | - | - | 16 | 16 | 16 | 16 |
| 标称断态隔离度 | - | - | - | 70 dB | 70 dB | 70 dB | 70 dB |
| 通态电阻匹配规范 | - | - | - | 15 Ω | 15 Ω | 15 Ω | 15 Ω |
| 最大通态电阻 (Ron) | - | - | - | 37 Ω | 37 Ω | 37 Ω | 37 Ω |
| 最高工作温度 | - | - | - | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | - | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | - | SOP | SOP | TSSOP | SOP |
| 封装等效代码 | - | - | - | SOP16,.3 | SOP16,.3 | TSSOP16,.25 | SOP16,.3 |
| 封装形状 | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | - | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | - | - | - | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 电源 | - | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | - | 2.05 mm | 2.05 mm | 1.2 mm | 2.05 mm |
| 最大供电电压 (Vsup) | - | - | - | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | - | - | - | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 (Vsup) | - | - | - | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | - | - | - | YES | YES | YES | YES |
| 最长断开时间 | - | - | - | 28 ns | 28 ns | 28 ns | 28 ns |
| 最长接通时间 | - | - | - | 28 ns | 28 ns | 28 ns | 28 ns |
| 切换 | - | - | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | - | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | - | - | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | - | - | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | - | - | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | - | - | 1.27 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | - | - | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | - | - | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED |
| 宽度 | - | - | - | 5.275 mm | 5.275 mm | 4.4 mm | 5.275 mm |
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