EEPROM, 16KX8, Serial, CMOS, PDSO8
| 参数名称 | 属性值 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | SOP, |
| Reach Compliance Code | compliant |
| 其他特性 | ALSO OPERATES AT 5MHZ AT 2.5-4.5 SUPPLY VOLTAGE |
| 最大时钟频率 (fCLK) | 10 MHz |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 4.9 mm |
| 内存密度 | 131072 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 组织 | 16KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 筛选级别 | AEC-Q100 |
| 座面最大高度 | 1.75 mm |
| 串行总线类型 | SPI |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| Base Number Matches | 1 |
| 25LC128-E/SN16KVAO | 25LC128T-E/SN16KVAO | 25LC128-E/ST16KVAO | 25LC128T-E/ST16KVAO | 25LC128T-E/SN16KV04 | |
|---|---|---|---|---|---|
| 描述 | EEPROM, 16KX8, Serial, CMOS, PDSO8 | EEPROM, 16KX8, Serial, CMOS, PDSO8 | EEPROM, 16KX8, Serial, CMOS, PDSO8 | EEPROM, 16KX8, Serial, CMOS, PDSO8 | EEPROM, 16KX8, Serial, CMOS, PDSO8 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 包装说明 | SOP, | SOIC-8 | TSSOP, | TSSOP, | SOP, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | ALSO OPERATES AT 5MHZ AT 2.5-4.5 SUPPLY VOLTAGE | ALSO OPERATES AT 5MHZ AT 2.5-4.5 SUPPLY VOLTAGE | ALSO OPERATES AT 5MHZ AT 2.5-4.5 SUPPLY VOLTAGE | ALSO OPERATES AT 5MHZ AT 2.5-4.5 SUPPLY VOLTAGE | ALSO OPERATES AT 5MHZ AT 2.5-4.5 SUPPLY VOLTAGE |
| 最大时钟频率 (fCLK) | 10 MHz | 10 MHz | 10 MHz | 10 MHz | 10 MHz |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| 长度 | 4.9 mm | 4.9 mm | 4.4 mm | 4.4 mm | 4.9 mm |
| 内存密度 | 131072 bit | 131072 bit | 131072 bit | 131072 bit | 131072 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| 字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 16KX8 | 16KX8 | 16KX8 | 16KX8 | 16KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | TSSOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.2 mm | 1.2 mm | 1.75 mm |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 0.65 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3.9 mm | 3.9 mm | 3 mm | 3 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| Base Number Matches | 1 | - | 1 | 1 | 1 |
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