SONET/SDH Clock Multiplier PLL
| ZL30415_06 | ZL30415 | ZL30415GGC | ZL30415GGF | ZL30415GGG2 | ZL30415GGF2 | |
|---|---|---|---|---|---|---|
| 描述 | SONET/SDH Clock Multiplier PLL | SONET/SDH Clock Multiplier PLL | SONET/SDH Clock Multiplier PLL | SONET/SDH Clock Multiplier PLL | SONET/SDH Clock Multiplier PLL | SONET/SDH Clock Multiplier PLL |
| 厂商名称 | - | - | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) | Zarlink Semiconductor (Microsemi) |
| 包装说明 | - | - | LFBGA, BGA64,8X8,32 | LFBGA, | LFBGA, | LFBGA, |
| Reach Compliance Code | - | - | compliant | unknow | compli | unknow |
| 应用程序 | - | - | SONET;SDH | SONET;SDH | SONET;SDH | SONET;SDH |
| JESD-30 代码 | - | - | S-PBGA-B64 | S-PBGA-B64 | S-PBGA-B64 | S-PBGA-B64 |
| 长度 | - | - | 8 mm | 8 mm | 8 mm | 8 mm |
| 功能数量 | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | - | 64 | 64 | 64 | 64 |
| 最高工作温度 | - | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | - | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装形状 | - | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | - | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 认证状态 | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | - | 1.41 mm | 1.41 mm | 1.41 mm | 1.41 mm |
| 标称供电电压 | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | - | - | YES | YES | YES | YES |
| 电信集成电路类型 | - | - | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT | ATM/SONET/SDH SUPPORT CIRCUIT |
| 温度等级 | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | - | - | BALL | BALL | BALL | BALL |
| 端子节距 | - | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | - | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | - | - | 8 mm | 8 mm | 8 mm | 8 mm |
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