|
TLV320AIC23IGQE |
TLV320AIC23GQE |
TLV320AIC23PWRG4 |
描述 |
Interface - CODECs LP Port Audio |
Interface - CODECs Low-Power Portable Aud Converter |
Interface - CODECs Low-Power Portable Aud Converter |
是否无铅 |
含铅 |
含铅 |
不含铅 |
是否Rohs认证 |
不符合 |
不符合 |
符合 |
零件包装代码 |
BGA |
BGA |
SSOP |
包装说明 |
VFBGA, BGA80,9X9,20 |
VFBGA, BGA80,9X9,20 |
TSSOP, TSSOP28,.25 |
针数 |
80 |
80 |
28 |
Reach Compliance Code |
_compli |
_compli |
unknow |
其他特性 |
ALSO REQUIRES 1.42V TO 3.6V SUPPLY |
ALSO REQUIRES 1.42V TO 3.6V SUPPLY |
ALSO REQUIRES 1.42V TO 3.6V SUPPLY |
商用集成电路类型 |
CONSUMER CIRCUIT |
CONSUMER CIRCUIT |
CONSUMER CIRCUIT |
JESD-30 代码 |
S-PBGA-B80 |
S-PBGA-B80 |
R-PDSO-G28 |
JESD-609代码 |
e0 |
e0 |
e4 |
长度 |
5 mm |
5 mm |
9.7 mm |
湿度敏感等级 |
2A |
2A |
1 |
功能数量 |
1 |
1 |
1 |
端子数量 |
80 |
80 |
28 |
最高工作温度 |
85 °C |
70 °C |
70 °C |
最低工作温度 |
-40 °C |
-10 °C |
-10 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
VFBGA |
VFBGA |
TSSOP |
封装等效代码 |
BGA80,9X9,20 |
BGA80,9X9,20 |
TSSOP28,.25 |
封装形状 |
SQUARE |
SQUARE |
RECTANGULAR |
封装形式 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) |
235 |
235 |
260 |
电源 |
1.5,3.3 V |
1.5,3.3 V |
1.5,3.3 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1 mm |
1 mm |
1.2 mm |
最大供电电压 (Vsup) |
3.6 V |
3.6 V |
3.6 V |
最小供电电压 (Vsup) |
2.7 V |
2.7 V |
2.7 V |
表面贴装 |
YES |
YES |
YES |
温度等级 |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
端子面层 |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
BALL |
BALL |
GULL WING |
端子节距 |
0.5 mm |
0.5 mm |
0.65 mm |
端子位置 |
BOTTOM |
BOTTOM |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
5 mm |
5 mm |
4.4 mm |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
- |
Factory Lead Time |
1 week |
1 week |
- |
最大压摆率 |
- |
13 mA |
13 mA |