SBR3U30P1
3.0A SBR
®
SUPER BARRIER RECTIFIER
PowerDI
®
123
Features
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•
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Ultra Low Forward Voltage Drop
Superior Reverse Avalanche Capability
Patented Interlocking Clip Design for High Surge Current
Capacity
Patented Super Barrier Rectifier Technology
Soft, Fast Switching Capability
150ºC Operating Junction Temperature
±16KV ESD Protection (HBM, 3B)
±25KV ESD Protection (IEC61000-4-2 Level 4, Air Discharge)
Lead Free Finish, RoHS Compliant (Note 1)
“Green” Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
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Case: PowerDI 123
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Polarity Indicator: Cathode Band
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Marking Information: See Page 4
Ordering Information: See Page 4
Weight: 0.018 grams (approximate)
®
Top View
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current (See Figure 1)
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Non-Repetitive Avalanche Energy
(T
J
= 25°C, I
AS
= 5A, L = 8.5 mH)
Repetitive Peak Avalanche Energy
(1µs, 25°C)
Symbol
V
RRM
V
RWM
V
RM
V
R(RMS)
I
O
I
FSM
E
AS
P
ARM
Value
30
21
3.0
75
105
1100
Unit
V
V
A
A
mJ
W
Thermal Characteristics
Characteristic
Maximum Thermal Resistance
Thermal Resistance Junction to Soldering (Note 2)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
Operating and Storage Temperature Range (Note 5)
Notes:
Symbol
R
θ
JS
R
θ
JA
R
θ
JA
T
J
, T
STG
Value
5
178
123
-65 to +150
Unit
ºC/W
ºC
1. RoHS revision 13.2.2003. High temperature solder exemption applied, see
EU Directive Annex Note 7.
2. Theoretical R
θJS
calculated from the top center of the die straight down to the PCB cathode tab solder junction.
3. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf
SBR and PowerDI are registered trademark of Diodes Incorporated.
SBR3U30P1
Document number: DS30974 Rev. 6 - 2
1 of 4
www.diodes.com
October 2008
© Diodes Incorporated
SBR3U30P1
Electrical Characteristics
Characteristic
Reverse Breakdown Voltage (Note 5)
@T
A
= 25°C unless otherwise specified
Symbol
V
(BR)R
Min
30
Typ
-
0.28
0.31
0.39
0.20
0.23
0.35
70
150
6
12
Max
-
0.32
0.35
0.43
0.23
0.26
0.38
150
400
15
20
Unit
V
Test Condition
I
R
= 400µA
I
F
= 0.5A, T
J
= 25ºC
I
F
= 1.0A, T
J
= 25ºC
I
F
= 3.0A, T
J
= 25ºC
I
F
= 0.5A, T
J
= 125ºC
I
F
= 1.0A, T
J
= 125ºC
I
F
= 3.0A, T
J
= 125ºC
V
R
= 5V, T
J
= 25ºC
V
R
= 30V, T
J
= 25ºC
V
R
= 5V, T
J
= 125ºC
V
R
= 30V, T
J
= 125ºC
Forward Voltage Drop
V
F
-
V
Leakage Current (Note 5)
I
R
-
µA
µA
mA
mA
Notes:
5. Short duration pulse test used to minimize self-heating effect.
I
F
, INSTANTANEOUS FORWARD CURRENT (mA)
1.2
10,000
T
A
=100
°
C
P
D
, POWER DISSIPATION (W)
1
1,000
T
A
=150
°
C
T
A
= -65
°
C
0.8
100
0.6
10
T
A
=25
°
C
0.4
0.2
1
0
0
0.1
1
2
3
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
Fig. 1 Forward Power Dissipation
4
0
0.2
0.4
0.6
0.8
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
I
R
, INSTANTANEOUS REVERSE CURRENT (mA)
1.0E+02
1.0E+01
1.0E+00
1.0E-01
1.0E-02
1.0E-03
1.0E-04
T
A
= -65
°
C
T
A
=150
°
C
T
A
=100
°
C
10,000
f = 1.0MHz
C
T
, TOTAL CAPACITANCE (pF)
1,000
T
A
=25
°
C
100
10
1.0E-05
0
5
10
15
20
25
30
V
R
, INSTANTANEOUS REVERSE VOLTAGE (V)
Fig. 3 Typical Reverse Characteristics
1
0
5
10
15
20
25
30
V
R
, DC REVERSE VOLTAGE (V)
Fig. 4 Total Capacitance vs. Reverse Voltage
SBR and PowerDI are registered trademark of Diodes Incorporated.
SBR3U30P1
Document number: DS30974 Rev. 6 - 2
2 of 4
www.diodes.com
October 2008
© Diodes Incorporated
SBR3U30P1
T
A
, DERATED AMBIENT TEMPERATURE (°C)
5.0
I
F(AV)
, AVERAGE FORWARD CURRENT (A)
160
150
140
130
120
4.0
3.0
110
100
90
80
70
60
0
10
5
20
15
25
V
R
, DC REVERSE VOLTAGE (V)
Fig. 6 Operating Temperature Derating
30
2.0
1.0
0
0
25
50
75 100 125 150 175
T
A
, AMBIENT TEMPERATURE (°C)
Fig. 5 Forward Current Derating Curve
200
120
P
ARM
, AVALANCHE PEAK PULSE POWER
DERATING IN PERCENTAGE (%)
10,000
P
ARM
, MAXIMUM AVALANCHE POWER (W)
0
25
50
75
100 125
150
T
J
, JUNCTION TEMPERATURE (
°
C)
Fig. 7 Pulse Derating Curve
175
100
1,000
80
60
100
40
10
20
0
1
0.001
0.1
1
10
100
T
P
, PULSE DURATION (uS)
Fig. 8 Maximum Avalanche Power Curve
0.01
1,000
SBR and PowerDI are registered trademark of Diodes Incorporated.
SBR3U30P1
Document number: DS30974 Rev. 6 - 2
3 of 4
www.diodes.com
October 2008
© Diodes Incorporated
SBR3U30P1
Ordering Information
Part Number
SBR3U30P1-7
Notes:
(Note 6)
Case
®
PowerDI 123
Packaging
3000/Tape & Reel
6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
Marking Information
3U3 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: T = 2006)
M = Month (ex: 9 = September)
3U3
Date Code Key
Year
Code
Month
Code
2006
T
Jan
1
2007
U
Feb
2
2008
V
Mar
3
Apr
4
YM
2009
W
May
5
2010
X
Jun
6
2011
Y
Jul
7
2012
Z
Aug
8
Sep
9
2013
A
Oct
O
2014
B
Nov
N
2015
C
Dec
D
Package Outline Dimensions
B
C
E
D
H
L
L1
E
L2
PowerDI 123
Dim Min Max Typ
A
3.50 3.90 3.70
B
2.60 3.00 2.80
C
1.63 1.93 1.78
D
0.93 1.00 0.98
E
0.85 1.25 1.00
H
0.15 0.25 0.20
L
0.55 0.75 0.65
L1
1.80 2.20 2.00
L2
0.95 1.25 1.10
All Dimensions in mm
®
A
Suggested Pad Layout
X1
G
X2
Y2
Y1
Dimensions
G
X1
X2
Y1
Y2
Value (in mm)
1.0
2.2
0.9
1.4
1.4
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product
described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall
assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website,
harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written
approval of the President of Diodes Incorporated.
SBR and PowerDI are registered trademark of Diodes Incorporated.
SBR3U30P1
Document number: DS30974 Rev. 6 - 2
4 of 4
www.diodes.com
October 2008
© Diodes Incorporated
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