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MAX9974GCCB

产品描述Dual Driver/Comparator/Load with Internal DACs
产品类别模拟混合信号IC    放大器电路   
文件大小386KB,共26页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
下载文档 详细参数 选型对比 全文预览

MAX9974GCCB概述

Dual Driver/Comparator/Load with Internal DACs

MAX9974GCCB规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码QFP
包装说明10 X 10 MM, 1 MM HEIGHT, MS-026ACD, TQFP-64
针数64
Reach Compliance Code_compli
ECCN代码EAR99
放大器类型COMPARATOR
最大输入失调电压50000 µV
JESD-30 代码S-PQFP-G64
JESD-609代码e0
长度10 mm
湿度敏感等级3
负供电电压上限-6 V
标称负供电电压 (Vsup)-4.75 V
功能数量1
端子数量64
最高工作温度70 °C
最低工作温度
输出类型OPEN-COLLECTOR
封装主体材料PLASTIC/EPOXY
封装代码HTFQFP
封装形状SQUARE
封装形式FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)240
认证状态Not Qualified
标称响应时间1.2 ns
座面最大高度1.2 mm
供电电压上限11 V
标称供电电压 (Vsup)9.75 V
表面贴装YES
技术BICMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度10 mm

文档预览

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19-0690; Rev 0; 1/07
Dual Driver/Comparator/Load
with Internal DACs
General Description
The MAX9973/MAX9974 fully integrated, high-perfor-
mance, dual-channel pin electronics driver/compara-
tor/load (DCL) with built-in level-setting digital-to-analog
converters (DACs) are ideally suited for memory and
SOC automatic test equipment (ATE) applications.
Each channel includes a three-level pin driver, a win-
dow comparator, dynamic clamps, a 1kΩ load, and
seven independent level-setting DACs.
The driver features a wide voltage range and high-speed
operation, includes high-impedance and active-termina-
tion (3rd-level drive) modes, and is highly linear even at
low voltage swings. Additionally, the driver provides high-
speed differential multiplexer control inputs, with internal
termination resistors that are compatible with ECL, LV-
PECL, LVDS, and GTL. The window comparators provide
extremely low timing variation over changes in slew rate,
pulse width, or overdrive voltage, and have open-collec-
tor outputs. When high-impedance mode is selected, the
dynamic clamps provide damping of high-speed device-
under-test (DUT) waveforms. The load facilitates fast con-
tact testing when used in conjunction with the
comparators, and functions as a pullup for
open-drain/collector DUT_ outputs. The MAX9973/
MAX9974 are configured through a serial interface.
The MAX9973/MAX9974 differ in two aspects: the posi-
tion of the exposed heat slug and the pin arrangement.
The MAX9973G/MAX9974G comparator outputs sink
8mA (typ), while the MAX9973H/MAX9974H compara-
tor outputs sink 16mA (typ). The devices are available
in a 64-pin (10mm x 10mm x 1.00mm) TQFP-EP pack-
age with an exposed paddle on top (MAX9973) or bot-
tom (MAX9974) for heat removal. Power dissipation is
only 700mW per channel. The full operating voltage
range is -1.5V to +6.5V. Operation is specified at an
internal die temperature of +40°C to +100°C, and fea-
tures a temperature monitor output.
o
600Mbps at 3V High Speed
o
700mW per Channel Extremely Low Power
Dissipation
o
-1.5V to +6.5V Wide Voltage Range
o
200mV to 8V Wide Voltage Swing Range
o
10nA (max) Low-Leakage Mode
o
Integrated Termination On-the-Fly
(3rd-Level Drive)
o
Integrated Voltage Clamps
o
Passive Load or Pullup
o
Very Low Timing Dispersion
o
Minimal External Component Count
o
SPI
TM
-Compatible Serial Control Interface
Features
MAX9973/MAX9974
Ordering Information
PART
PIN-PACKAGE
PKG
CODE
OUTPUT
SINK
CURRENT
MAX9973GC
CB
64 TQFP-EP-IDP**
(10mm x 10mm x C64E-13R
1.00mm)
64 TQFP-EP-IDP**
(10mm x 10mm x C64E-13R
1.00mm)
64 TQFP-EP
(10mm x 10mm x
1.00mm)
64 TQFP-EP
(10mm x 10mm x
1.00mm)
8mA
MAX9973HCCB*
16mA
MAX9974GC
CB*
8mA
Applications
Memory Testers
SOC Testers
MAX9974HCCB*
16mA
Note:
Devices are available in both leaded and lead-free
packages. Specify lead free by adding a + symbol at the end
of the part number when ordering.
*Future
product—contact factory for availability.
**EP-IDP
= Exposed paddle (inverted die paddle).
EP = Exposed paddle.
SPI is a trademark of Motorola Inc.
Pin Configuration appears at end of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX9974GCCB相似产品对比

MAX9974GCCB MAX9973GCCB MAX9973 MAX9973HCCB MAX9974HCCB
描述 Dual Driver/Comparator/Load with Internal DACs Dual Driver/Comparator/Load with Internal DACs Dual Driver/Comparator/Load with Internal DACs Dual Driver/Comparator/Load with Internal DACs Dual Driver/Comparator/Load with Internal DACs
是否Rohs认证 不符合 不符合 - 不符合 不符合
零件包装代码 QFP QFP - QFP QFP
包装说明 10 X 10 MM, 1 MM HEIGHT, MS-026ACD, TQFP-64 10 X 10 MM, 1 MM HEIGHT, MS-026ACD, TQFP-64 - 10 X 10 MM, 1 MM HEIGHT, MS-026ACD, TQFP-64 10 X 10 MM, 1 MM HEIGHT, MS-026ACD, TQFP-64
针数 64 64 - 64 64
Reach Compliance Code _compli _compli - _compli _compli
ECCN代码 EAR99 EAR99 - EAR99 EAR99
放大器类型 COMPARATOR - - COMPARATOR COMPARATOR
最大输入失调电压 50000 µV - - 50000 µV 50000 µV
JESD-30 代码 S-PQFP-G64 - - S-PQFP-G64 S-PQFP-G64
JESD-609代码 e0 - - e0 e0
长度 10 mm - - 10 mm 10 mm
湿度敏感等级 3 - - 3 3
负供电电压上限 -6 V - - -6 V -6 V
标称负供电电压 (Vsup) -4.75 V - - -4.75 V -4.75 V
功能数量 1 - - 1 1
端子数量 64 - - 64 64
最高工作温度 70 °C - - 70 °C 70 °C
输出类型 OPEN-COLLECTOR - - OPEN-COLLECTOR OPEN-COLLECTOR
封装主体材料 PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HTFQFP - - HTFQFP HTFQFP
封装形状 SQUARE - - SQUARE SQUARE
封装形式 FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH - - FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) 240 - - 245 240
认证状态 Not Qualified - - Not Qualified Not Qualified
标称响应时间 1.2 ns - - 1.2 ns 1.2 ns
座面最大高度 1.2 mm - - 1.2 mm 1.2 mm
供电电压上限 11 V - - 11 V 11 V
标称供电电压 (Vsup) 9.75 V - - 9.75 V 9.75 V
表面贴装 YES - - YES YES
技术 BICMOS - - BICMOS BICMOS
温度等级 COMMERCIAL - - COMMERCIAL COMMERCIAL
端子面层 TIN LEAD - - TIN LEAD TIN LEAD
端子形式 GULL WING - - GULL WING GULL WING
端子节距 0.5 mm - - 0.5 mm 0.5 mm
端子位置 QUAD - - QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED
宽度 10 mm - - 10 mm 10 mm
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