Field Programmable Gate Array, 1184 CLBs, 54000 Gates, CMOS, PBGA272, PLASTIC, BGA-272
| 参数名称 | 属性值 |
| Objectid | 1822044661 |
| 包装说明 | BGA, |
| Reach Compliance Code | compliant |
| 其他特性 | ALSO OPERATE AT 5.0V SUPPLY |
| CLB-Max的组合延迟 | 2.1 ns |
| JESD-30 代码 | S-PBGA-B272 |
| 长度 | 27 mm |
| 可配置逻辑块数量 | 1184 |
| 等效关口数量 | 54000 |
| 端子数量 | 272 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1184 CLBS, 54000 GATES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.5 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子节距 | 1.27 mm |
| 端子位置 | BOTTOM |
| 宽度 | 27 mm |
| A42MX36-2BG272X79 | A42MX36-1BG272X79 | A42MX36-BG272X79 | A42MX36-3BG272X79 | A42MX36-FBG272X79 | |
|---|---|---|---|---|---|
| 描述 | Field Programmable Gate Array, 1184 CLBs, 54000 Gates, CMOS, PBGA272, PLASTIC, BGA-272 | Field Programmable Gate Array, 1184 CLBs, 54000 Gates, CMOS, PBGA272, PLASTIC, BGA-272 | Field Programmable Gate Array, 1184 CLBs, 54000 Gates, CMOS, PBGA272, PLASTIC, BGA-272 | Field Programmable Gate Array, 1184 CLBs, 54000 Gates, CMOS, PBGA272, PLASTIC, BGA-272 | Field Programmable Gate Array, 1184 CLBs, 54000 Gates, CMOS, PBGA272, PLASTIC, BGA-272 |
| 包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 其他特性 | ALSO OPERATE AT 5.0V SUPPLY | ALSO OPERATE AT 5.0V SUPPLY | ALSO OPERATE AT 5.0V SUPPLY | ALSO OPERATE AT 5.0V SUPPLY | ALSO OPERATE AT 5.0V SUPPLY |
| CLB-Max的组合延迟 | 2.1 ns | 2.3 ns | 2.7 ns | 1.9 ns | 3.8 ns |
| JESD-30 代码 | S-PBGA-B272 | S-PBGA-B272 | S-PBGA-B272 | S-PBGA-B272 | S-PBGA-B272 |
| 长度 | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm |
| 可配置逻辑块数量 | 1184 | 1184 | 1184 | 1184 | 1184 |
| 等效关口数量 | 54000 | 54000 | 54000 | 54000 | 54000 |
| 端子数量 | 272 | 272 | 272 | 272 | 272 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1184 CLBS, 54000 GATES | 1184 CLBS, 54000 GATES | 1184 CLBS, 54000 GATES | 1184 CLBS, 54000 GATES | 1184 CLBS, 54000 GATES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 可编程逻辑类型 | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY | FIELD PROGRAMMABLE GATE ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.5 mm | 2.5 mm | 2.5 mm | 2.5 mm | 2.5 mm |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 宽度 | 27 mm | 27 mm | 27 mm | 27 mm | 27 mm |
| 厂商名称 | - | Microsemi | Microsemi | Microsemi | Microsemi |
| Base Number Matches | - | 1 | 1 | 1 | 1 |
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