DA6282.001
9 January 2007
This is preliminary information on a new
product under development. Micro Analog
Systems Oy reserves the right to make any
changes without notice.
IC FOR 6.50 – 40.00 MHz VCTCXO
•
•
•
•
•
•
Min. Supply Voltage 2.6 V
Max. Frequency 40 MHz
True Sine Wave Output
Frequency Stability ±2.0 ppm
Suitable for Ultra Small
VCTCXO
Very Low Phase Noise
MAS6282
DESCRIPTION
The MAS6282 is an integrated circuit well suited to
build VCTCXO for mobile communication.
Temperature calibration is achieved in three
calibration temperatures only. The trimming is done
through a serial bus and the calibration information
is stored in an internal PROM. This means no
rework for trimming is needed.
To build a VCTCXO only a crystal is required in
addition to MAS6282. The compensation method is
fully analog, working continuously without
generating any steps or other interference.
Output is true sine wave resulting in lower
harmonics than with clipped sine wave output.
FEATURES
•
•
•
•
•
•
Very small size
Minimum Vdd 2.6V
No voltage reference capacitor needed
Programmable VC-sensitivity
Divider option selectable by a PROM bit
Output peak voltage (amplitude) option
selectable by a PROM bit
APPLICATIONS
•
•
VCTCXO for mobile phones
VCTCXO for other applications
BLOCK DIAGRAM
DA
TFRPROM
TEST(2:0)
INF(4:0)
LIN(7:0)
CUB(3:0)
SCALE(4:0)
SENS(2:0)
CDACF(5:0)
CDACC(3:0)
DIV(0:0)
AMPL(0:0)
POLYNOMIAL
Thermal
sensor
VREF
TEST
MUX
TIN
MOUT
CLK
f(T)
= Ax
3
+Bx+C
OUT
FILTER
PV
VC_SENS
VC
V divider
VDD
To all blocks
CDACC
CDACF
XO
core
f
|
f
/
2
Buffer+
divider
OUT
VSS
XIN
XOUT
1 (5)
DA6282.001
9 January 2007
PIN DESCRIPTION
Pin Description MAS6282A
Crystal/Varactor Oscillator Input
Power Supply Voltage
Serial Bus Data Input
Serial Bus Clock Input
Buffer Output
Voltage Control Input
Crystal Oscillator Output
Temperature Output
Programming Input
Test Multiplexer Output
Power Supply Ground
Symbol
XIN
VDD
DA
CLK
OUT
VC
XOUT
TIN
PV
MOUT
VSS
x-coordinate
185
436
1071
1342
1612
209
477
780
1071
1335
1612
y-coordinate
1229
1229
1229
1229
1229
152
152
152
152
152
152
Note:
Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note:
Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
Note:
Test Multiplexer Output is for testing only and must not be connected in module.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Voltage
Power Dissipation
Storage Temperature
ESD Rating; HBM
Latchup Current Limit
Symbol
V
DD
– V
SS
V
IN
P
MAX
T
ST
I
LUT
Min
–0.3
V
SS
-0.3
–55
±2
±100
Max
5.5
V
DD
+ 0.3
20
150
Unit
V
V
mW
o
C
kV
mA
Note
1)
2)
3)
Note:
Stresses beyond the values listed may cause a permanent damage to the device. The device may not
operate under these conditions, but it will not be destroyed
Note 1:
Not valid for programming pin PV
Note 2:
Value depends on a thermal resistance of the used packade
Note 3:
In pins XIN and XOUT maximum ESD rating is 1 kV.
2 (5)
DA6282.001
9 January 2007
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply voltage
Supply current
Supply current
Operating temperature
Crystal load capacitance
Crystal pulling sensitivity
Crystal Rs
Symbol
V
DD
I
CC
I
CC
T
OP
C
L
S
R
S
Conditions
Vdd = 2.8 V, f
c
=26 MHz
Vdd = 2.8 V, f
c
=40 MHz
–40
8
18
20
30
50
Min
2.6
Typ
2.8
1.3
1.5
Max
4.0
Unit
V
mA
mA
o
C
pF
ppm/pF
Note
+85
1)
Note 1:
CDACF = 32 and CDACC = 8
ELECTRICAL CHARACTERISTICS
Parameter
Crystal frequency range for MAS6282
Voltage control range
Voltage control sensitivity (SENS=7)
Frequency vs. supply voltage
Frequency vs. load change
Output voltage (10 k || 10 pF)
Power Consumption
Harmonic distortion
Compensation range ±2.0 ppm
Compensation range linear part
Compensation inflection point
Compensation range cubic part
Fine compensation CDACF (6 Bit)
Coarse compensation CDACC (4 Bit)
Start-up time
@ 10Hz
@ 100Hz
Phase noise
@ 1kHz
@ 10kHz
@ 100kHz
Symbol
f
c
V
C
V
CSENS
df
o
df
o
V
out
P
T
C
a1
INF
a3
C
XOUT
C
XOUT
T
START
Min
13.00
0
Typ
1.3
10
Max
40.00
VDD
±0.2
±0.2
0.6
0.8/1.0
8
-25
–30
–0.7
20.5
95
C10
C20
2
–90
–113
–136
–148
–155
C10 + 0.95
C20 + 6.75
85
0.0
36
Unit
MHz
V
ppm/V
ppm
ppm
Vpp
mW
dBc
o
C
ppm/K
o
C
2 3
ppm /K
pF
pF
ms
Note
1)
2)
3)
4)
5)
8)
6)
6)
n
dBc/Hz
7)
Note 1:
Frequency division by two is selected by PROM bit DIV: 0=no division, 1=div by 2
Thus IC output frequency range is 6.5 MHz – 40 MHz.
Note 2:
Depending on crystal pulling
Note 3:
VDD±5%
Note 4:
R=10 k ±10%, C=10 pF±10%
Note 5:
0.8 V / 1.0 V output is selected by PROM bit AMPL: 0=0.8 Vpp, 1=1.0Vpp
Note 6:
Typically C10 = 3.1 pF at CDACF=0, CDACC=0
Note 7:
Not measured in production testing; guaranteed by design
Note 8:
Max power consumption is 8 mW when V
DD
is 4V
3 (5)
DA6282.001
9 January 2007
IC OUTLINE
XIN
VDD
DA
CLK
OUT
Y = 1380 m
MAS6282A
Die map reference
VC
XOUT
TIN
PV
MOUT
VSS
X = 1840 m
Note 1:
MAS6282 pads are round with 80 µm diameter at opening.
Note 2:
Pins CLK and DA can either be connected to VSS or left floating, pin PV can either be connected to VSS
or left floating and pin TIN must be left floating in VCTCXO module end-user application.
Note 3:
Die map reference is the actual left bottom corner of the sawn chip.
Note 4:
See coordinates in pin description on page 2.
SAMPLES IN SBDIL 20 PACKAGE
1
2
3
4
20
19
OUT
18
GND
17
MAS6282
YYWW
XXXXX.X
MOUT
PV
TIN
XOUT
VC
XIN
Top marking:
YYWW = Year, Week
XXXXX.X = Lot number
CLK
5
DA
6
7
16
15
14
13
12
11
VDD
8
9
10
4 (5)
DA6282.001
9 January 2007
ORDERING INFORMATION
Product Code
MAS6282A1TG00
Product
IC for 6.5MHz to 40MHz
VCTCXO
Package
EWS Tested wafers 215 µm
Comments
Die Size 1.840 x 1.380 mm
Contact Micro Analog Systems Oy for other wafer thickness options.
N
The formation of product code
Product name
MAS6282
Design version
A1
Package type
TG = 215 m thick EWS tested wafer
Delivery format
00 = bare wafer
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O. Box 51
FIN-02771 Espoo, FINLAND
http://www.mas-oy.com
Tel. (09) 80 521
Tel. Int. +358 9 80 521
Telefax +358 9 805 3213
Email: info@mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design or
performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes no
claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only and
Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further testing or
modification.
5 (5)
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