TVR2B,TVR2G,TVR2J
TOSHIBA Fast Recovery Diode Silicon Diffused Type
TVR2B,TVR2G,TVR2J
TV Applications (fast recovery)
•
•
•
•
Average Forward Current: I
F (AV)
= 0.5 A (Ta = 50°C)
Repetitive Peak Reverse Voltage: V
RRM
= 100 to 600 V
Reverse Recovery Time: t
rr
= 5 to 20 µs
Plastic Mold Type.
Unit: mm
Maximum Ratings
(Ta
=
25°C)
Characteristics
TVR2B
Repetitive peak
reverse voltage
TVR2G
TVR2J
TVR2B
Reverse voltage
(DC)
TVR2G
TVR2J
Average forward current (Ta
=
50°C)
Peak one cycle surge forward current
(non repetitive)
Junction temperature
Storage temperature range
I
F (AV)
I
FSM
T
j
T
stg
V
R
V
RRM
Symbol
Rating
100
400
600
50
300
500
0.5
30 (50 Hz)
33 (60 Hz)
−40
to 125
−40
to 125
A
A
°C
°C
V
V
Unit
JEDEC
JEITA
TOSHIBA
DO-41
―
3-3C1A
Weight: 0.3 g (typ.)
Electrical Characteristics
(Ta
=
25°C)
Characteristics
Peak forward voltage
Repetitive peak reverse current
Reverse recovery time
Forward recovery voltage
Symbol
V
FM
I
RRM
t
rr
V
fr
Test Condition
I
FM
=
1.0 A
V
RRM
=
Rated
I
F
=
20 mA, I
R
=
1 mA
I
F
=
0.1 A, t
r
=
100 ns, t
w
=
5
µs
Min
⎯
⎯
5
⎯
Typ.
⎯
⎯
⎯
⎯
Max
1.4
10
20
6
Unit
V
µA
µs
V
Note1:
Note2:
Soldering: 5 mm is the minimum to be kept between case and soldering part.
Lead bending: 5 mm is the minimum to be kept from the case when bend the lead wire.
Marking
Part No. (or abbreviation code)
Lot No.
A line indicates
lead (Pb)-free package or
lead (Pb)-free finish.
Abbreviation Code
VR2B
VR2G
VR
2J
Part No.
TVR2B
TVR2G
TVR2J
VR2J
1
2004-08-10
TVR2B,TVR2G,TVR2J
Handling Precaution
The maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded
during operation, even for an instant. The following are the general derating methods that we recommend when
you design a circuit with a device.
V
RRM
:
We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the
maximum rating of V
RRM
for a DC circuit and be no greater than 50% of that of V
RRM
for an AC
circuit. V
RRM
has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into
account designing a device at low temperature.
We recommend that the worst case current be no greater than 80% of the maximum rating of I
F(AV)
.
Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the
margin by using an allowable Tamax-I
F(AV)
curve.
I
F(AV)
:
This rating specifies the non-repetitive peak current in one cycle of a 50-Hz sine wave, condition angle 180.
Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device.
We recommend that a device be used at a Tj of below 100°C under the worst load and heat radiation conditions.
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Please refer to the Rectifiers databook for further information.
2
2004-08-10
TVR2B,TVR2G,TVR2J
Ta max – I
F (AV)
200
50
Surge forward current (non-repetitive)
(A)
Tj
=
25°C
40
Maximum allowable temperature
Ta max (°C)
120
Resistive and inductive load
80
Capacitive load
40
Peak surge forward current
I
FSM
160
30
20
60 Hz
10
50 Hz
0
1
0
0
0.1
0.2
0.3
0.4
0.5
0.6
3
10
30
100
Average forward current
I
F (AV)
(A)
Number of cycles
3
2004-08-10
TVR2B,TVR2G,TVR2J
RESTRICTIONS ON PRODUCT USE
•
The information contained herein is subject to change without notice.
030619EAA
•
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
•
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc..
•
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk.
•
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
4
2004-08-10
传感器
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
