S i 5 2 11 2 - B 5 / B 6
PCI-E
XPRESS
G
EN
3
Features
DUAL
O
UTPUT
C
LOCK
G
ENERATOR
PCI-Express Gen 1, Gen 2,
Gen 3, and Gen 4 common clock
compliant
Gen 3 SRNS Compliant
Low power HCSL differential
output buffers
Supports Serial-ATA (SATA) at
100 MHz
No termination resistors required
25 MHz Crystal Input or Clock
input
Triangular spread spectrum
profile for maximum EMI
reduction (Si52112-B6)
Extended Temperature:
–40 to 85 °C
3.3 V Power supply
Small package 10-pin TDFN
(3x3 mm)
Si52112-B5 does not support
spread spectrum outputs
Si52112-B6 supports 0.5% down
spread outputs
Ordering Information:
See page 13
Pin Assignments
Applications
Network attached storage
Multi-function printer
Wireless access point
Routers
VDD
XOUT
1
2
3
4
5
10
9
8
7
6
VDD
DIFF2
DIFF2
DIFF1
DIFF1
Description
Si52112-B5/B6 is a high-performance, PCIe clock generator that can
source two PCIe clocks from a 25 MHz crystal or clock input. The clock
outputs are compliant to PCIe Gen 1, Gen 2, Gen 3, Gen 3 SRNS and
Gen 4 common clock specifications. The ultra-small footprint (3x3 mm)
and industry leading low power consumption make Si52112-B5/B6 the
ideal clock solution for consumer and embedded applications. Measuring
PCIe clock jitter is quick and easy with the Silicon Labs PCIe Clock Jitter
Tool. Download it for free at
www.silabs.com/pcie-learningcenter.
XIN/CLKIN
VSS
VSS
Patents pending
Functional Block Diagram
VDD
DIFF1
XIN/CLKIN
XOUT
PLL
Divider
DIFF2
VSS
Rev 1.2 12/15
Copyright © 2015 by Silicon Laboratories
Si52112-B5/B6
Si52112-B5/B6
T
ABLE
Section
OF
C
ONTENTS
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2. Crystal Recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1. Crystal Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2. Calculating Load Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3. Test and Measurement Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1. 10-Pin TDFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2. 8-Pin TSSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
6. Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.1. TDFN Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
6.2. TSSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
7. Recommended Design Guideline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Rev 1.2
3
Si52112-B5/B6
1. Electrical Specifications
Table 1. Recommended Operating Conditions
Parameter
Supply Voltage (extended)
Supply Voltage (commercial)
Symbol
V
DD(extended)
V
DD(commercial)
Test Condition
3.3 V ± 5%
3.3 V ± 10%
Min
3.13
2.97
Typ
3.3
3.3
Max
3.46
3.63
Unit
V
V
Table 2. DC Electrical Specifications
Parameter
Operating Voltage
Operating Supply Current
Input Pin Capacitance
Output Pin Capacitance
Symbol
V
DD
I
DD
C
IN
C
OUT
Test Condition
3.3 V ± 10%
Full Active
Input Pin Capacitance
Output Pin Capacitance
Min
2.97
—
—
—
Typ
3.30
—
3
—
Max
3.63
17
5
5
Unit
V
mA
pF
pF
4
Rev 1.2
Si52112-B5/B6
Table 3. AC Electrical Specifications
Parameter
Crystal
Long-term Accuracy
Clock Input
CLKIN Duty Cycle
CLKIN Rise and Fall Times
CLKIN Cycle-to-Cycle Jitter
CLKIN Long Term Jitter
Input High Voltage
Input Low Voltage
Input High Current
Input Low Current
DIFF Clocks
Duty Cycle
Symbol
L
ACC
T
DC
T
R
/T
F
T
CCJ
T
LTJ
V
IH
V
IL
I
IH
I
IL
T
DC
T
SKEW
F
OUT
F
ACC
t
r/f2
T
CCJ
Pk-Pk
GEN1
Test Condition
Measured at V
DD
/2 differential
Measured at V
DD
/2
Measured between 0.2 V
DD
and
0.8 V
DD
Measured at V
DD
/2
Measured at V
DD
/2
XIN/CLKIN pin
XIN/CLKIN pin
XIN/CLKIN pin, VIN = V
DD
XIN/CLKIN pin, 0 < VIN <0.8
Measured at 0 V differential
Measured at 0 V differential
VDD = 3.3 V
All output clocks
Measured differentially from
±150 mV
Measured at 0 V differential
PCIe Gen 1
10 kHz < F < 1.5 MHz
1.5 MHz < F < Nyquist
PLL BW of 2–4 or 2–5 MHz,
CDR = 10 MHz
PLL BW of 2–4 or 2–5 MHz,
CDR = 10 MHz
PLL BW of 2–4 or 2–5 MHz,
CDR = 10 MHz
Min
—
45
0.5
—
—
2
—
—
–35
45
—
—
—
0.6
—
—
—
—
—
—
Typ
—
—
—
—
—
—
—
—
—
—
—
100
—
—
28
24
1.35
1.4
0.4
0.28
Max
250
55
4.0
250
350
V
DD
+0.3
0.8
35
—
55
60
—
100
4.0
70
86
3.0
3.1
1.0
0.71
Unit
ppm
%
V/ns
ps
ps
V
V
µA
µA
%
ps
MHz
ppm
V/ns
ps
ps
ps
ps
ps
ps
Skew
Output Frequency
Frequency Accuracy
Slew Rate
Cycle-to-Cycle Jitter
PCIe Gen 1 Pk-Pk Jitter,
Common Clock
PCIe Gen 2 Phase Jitter,
Common Clock
PCIe Gen 3 Phase Jitter,
Common Clock
PCIe Gen 3 Phase Jitter,
Separate Reference No Spread,
SRNS
PCIe Gen 4 Phase Jitter,
Common Clock
Crossing Point Voltage at 0.7 V
Swing
Voltage High
Voltage Low
RMS
GEN2
RMS
GEN3
RMS
GEN3_SRNS
RMS
GEN4
V
OX
V
HIGH
V
LOW
—
300
—
–0.3
0.4
—
—
—
1.0
550
1.15
—
ps
mV
V
V
Notes:
1.
Visit
www.pcisig.com
for complete PCIe specifications.
2.
Gen 4 specifications based on the PCI-Express Base Specification 4.0 rev. 0.5.
3.
Download the Silicon Labs PCIe Clock Jitter Tool at
www.silabs.com/pcie-learningcenter.
Rev 1.2
5
Microchip MCU
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