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W3E16M72SR-200BM: 产品描述DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219; 产品类别存储存储; 文件大小672KB，共16页; 制造商White Electronic Designs Corporation; 官网地址http://www.wedc.com/

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W3E16M72SR-200BM概述

DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219

W3E16M72SR-200BM规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	White Electronic Designs Corporation
包装说明	32 X 25 MM, PLASTIC, BGA-219
Reach Compliance Code	unknown
访问模式	FOUR BANK PAGE BURST
最长访问时间	0.75 ns
其他特性	AUTO REFRESH
JESD-30 代码	R-PBGA-B219
长度	32 mm
内存密度	1207959552 bit
内存集成电路类型	DDR DRAM
内存宽度	72
功能数量	1
端口数量	1
端子数量	219
字数	16777216 words
字数代码	16000000
工作模式	SYNCHRONOUS
最高工作温度	125 °C
最低工作温度	-55 °C
组织	16MX72
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY
峰值回流温度（摄氏度）	NOT SPECIFIED
认证状态	Not Qualified
座面最大高度	2.65 mm
最大供电电压 (Vsup)	2.7 V
最小供电电压 (Vsup)	2.3 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	MILITARY
端子形式	BALL
端子节距	1.27 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	25 mm
Base Number Matches	1

W3E16M72SR-200BM相似产品对比

	W3E16M72SR-200BM	W3E16M72SR-225BM	W3E16M72SR-225BC	W3E16M72SR-250BC	W3E16M72SR-225BI	W3E16M72SR-200BI	W3E16M72SR-250BI	W3E16M72SR-250BM	W3E16M72SR-200BC
描述	DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219	DDR DRAM, 16MX72, 0.75ns, CMOS, PBGA219, 32 X 25 MM, PLASTIC, BGA-219
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation	White Electronic Designs Corporation
包装说明	32 X 25 MM, PLASTIC, BGA-219	32 X 25 MM, PLASTIC, BGA-219	BGA,	BGA,	BGA,	BGA,	BGA,	32 X 25 MM, PLASTIC, BGA-219	BGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
访问模式	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
最长访问时间	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns	0.75 ns
其他特性	AUTO REFRESH	AUTO REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO REFRESH	AUTO/SELF REFRESH
JESD-30 代码	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219	R-PBGA-B219
长度	32 mm	32 mm	32 mm	32 mm	32 mm	32 mm	32 mm	32 mm	32 mm
内存密度	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit	1207959552 bit
内存集成电路类型	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM	DDR DRAM
内存宽度	72	72	72	72	72	72	72	72	72
功能数量	1	1	1	1	1	1	1	1	1
端口数量	1	1	1	1	1	1	1	1	1
端子数量	219	219	219	219	219	219	219	219	219
字数	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words	16777216 words
字数代码	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000	16000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	125 °C	125 °C	70 °C	70 °C	85 °C	85 °C	85 °C	125 °C	70 °C
最低工作温度	-55 °C	-55 °C	-	-	-40 °C	-40 °C	-40 °C	-55 °C	-
组织	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72	16MX72
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	2.65 mm	2.65 mm	2.65 mm	2.65 mm	2.65 mm	2.65 mm	2.65 mm	2.65 mm	2.65 mm
最大供电电压 (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
最小供电电压 (Vsup)	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V	2.3 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	MILITARY	COMMERCIAL
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm	25 mm
Base Number Matches	1	1	1	1	1	1	1	1	1
自我刷新	-	-	YES	YES	YES	YES	YES	-	YES

W3E16M72SR-200BM

W3E16M72SR-200BM概述

W3E16M72SR-200BM规格参数

W3E16M72SR-200BM相似产品对比

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