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MADP-011034-10720T

产品描述Pin Diode,
产品类别分立半导体    二极管   
文件大小332KB,共4页
制造商MACOM
官网地址http://www.macom.com
标准
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MADP-011034-10720T概述

Pin Diode,

MADP-011034-10720T规格参数

参数名称属性值
是否Rohs认证符合
厂商名称MACOM
Reach Compliance Codecompliant
ECCN代码EAR99
二极管类型PIN DIODE
峰值回流温度(摄氏度)NOT SPECIFIED
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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MADP-011034-10720T
Non-Magnetic MELF PIN Diode
Package Style 1072
Features
Non-Magnetic Package for MRI Applications
Rectangular MELF Ceramic Package
Hermetically Sealed
RoHS Compliant
Rev V2
Description
The MADP-011034-10720T is a surface mount PIN
diode in a non-magnetic
Metal Electrode Leadless
Faced
(MELF) package. The MADP-011034-10720T
is manufactured using M/A-COM Technology
Solutions time proven HIPAX technology. The result
is a low inductance ceramic package with no ribbons
or wires. The package utilizes a unique non-magnetic
plating process that provides for a hermetically sealed
component that has extremely low electromagnetic
permeability. Incorporated in the package is a glass
passivated CERMA chip that is full face bonded on
the cathode and anode which maximizes the surface
contact area to minimize the electrical and thermal
resistances. The chip and package have been
comprehensively characterized both electrically and
mechanically to ensure repeatable and predictable
performance
.
Absolute Maximum Ratings
1,2,3
@ 25°C
Parameter
Reverse DC & AC Voltage
1,2
D.C. Forward Current
1,2
Peak A.C. Forward Surge
Current ( 8.3 mS Single
Half Sine Wave )
1,2
C.W. Power Dissipation
1,2,3
Operating Temperature
1,2
Storage Temperature
1,2
Mounting Temperature
1,2
Absolute
Maximum
|-150 V|
0.5 A
2.5 A
6.0 W
-65°C to +150°C
-65°C to +175°C
+260°C for 30 s
Application
The MADP-011034-10720T is designed for circuit
protection and the tuning of RF coil designs in MRI
applications. When connected in an anti-parallel
configuration these PIN diodes provide excellent
protection from long RF pulses and transient voltage
spikes.
1. Exceeding these limits may cause permanent damage
2. Values will de-rate over temperature.
3. Infinite Heat Sink, de-rate to 0W @ +175 °C ,
by –40mW/°C from 25°C to +175 °C
Designed for Automated Assembly
This easy to use package design makes automatic
pick and place, indexing and assembly, extremely
easy. The parallel flat surfaces are well suited for
most key jaw or vacuum pick-up techniques. All of the
solderable surfaces are tin plated and compatible with
industry standard reflow and vapor phase soldering
processes
.
RoHS
The MADP-011034-10720T is fully RoHS compliant
meaning that it contains less than the maximum
allowable concentration of 0.1% by weight for lead,
PBB, PBDE, and 0.01% of cadmium and hexavalent
chromium at raw homogeneous materials level.
There is less than 100ppm of mercury and no
mercury was intentionally added to the component.
ADVANCED:
Data Sheets contain information regarding a product M/A-COM is considering for
North America
Tel: 800.366.2266 / Fax: 978.366.2266
development. Performance is based on target specifications, simulated results, and/or prototype
Europe
Tel: 44.1908.574.200 / Fax: 44.1908.574.300
measurements. Commitment to develop is not guaranteed.
Asia/Pacific
Tel: 81.44.844.8296 / Fax: 81.44.844.8298
PRELIMINARY:
Data Sheets contain information regarding a product M/A-COM has under develop-
Visit www.macom.com for additional data sheets and product information.
ment. Performance is based on engineering tests. Specifications are typical. Mechanical outline has
been fixed. Engineering samples and/or test data may be available. Commitment to produce in
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s) or
volume is not guaranteed.
information contained herein without notice.

 
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